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IEEE Transactions on Electronics Packaging Manufacturing

Issue 4 • Oct. 2006

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Displaying Results 1 - 19 of 19
  • Table of contents

    Publication Year: 2006, Page(s): C1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2006, Page(s): C2
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  • Foreword: Special Section on Tin Whiskers

    Publication Year: 2006, Page(s):229 - 230
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  • Tin Whisker Test Method Development

    Publication Year: 2006, Page(s):231 - 238
    Cited by:  Papers (13)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1240 KB) | HTML iconHTML

    The International Electronics Manufacturing Initiative (iNEMI) proposed a set of tests that were subsequently standardized by the Joint Electron Device Engineering Council (JEDEC) Solid State Technology Association as JESD22A121. However, further optimization was needed to validate and verify proposed iNEMI tests to determine whether these test methods could differentiate between component surface... View full abstract»

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  • Humidity Effects on Sn Whisker Formation

    Publication Year: 2006, Page(s):239 - 245
    Cited by:  Papers (45)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (6049 KB) | HTML iconHTML

    Due to legislative issues, Pb-containing metallizations on semiconductor components are rapidly converted to Pb-free alternatives. One of the most popular alternatives is Sn electroplating. The major problem of these platings is the formation of Sn whiskers. In earlier publications, two mechanisms were uncovered that are responsible for whisker growth. However, these mechanisms do not explain whis... View full abstract»

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  • A Statistical Study of Sn Whisker Population and Growth During Elevated Temperature and Humidity Tests

    Publication Year: 2006, Page(s):246 - 251
    Cited by:  Papers (27)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2224 KB) | HTML iconHTML

    Storage tests at elevated temperature and humidity conditions have been widely adopted as one of the major acceleration tests for Sn whisker growth. However, the driving force associated and the nucleation and growth process of whiskers are yet to be fully understood. In this paper, Sn whisker growth on Cu leadframe material at two different test conditions is compared. Both loose and board-mounte... View full abstract»

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  • The Effect of Annealing on Tin Whisker Growth

    Publication Year: 2006, Page(s):252 - 258
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3110 KB) | HTML iconHTML

    This paper presents a design-of-experiments study on the effect of annealing and simulated reflow on tin whisker growth. Copper, brass, and alloy 42 coupons plated with either bright or matte tin were subjected to one of three elevated temperature exposures. After the elevated temperature exposures, specimens along with a set of control specimens were then kept in room ambient conditions and monit... View full abstract»

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  • Stress-Induced Tin Whisker Initiation Under Contact Loading

    Publication Year: 2006, Page(s):259 - 264
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1268 KB) | HTML iconHTML

    As electronic components become smaller, tin whiskers have an increasingly adverse effect on the assessment of the reliability of the components. In particular, the contact between components brings about whisker initiation near the contact area. Although a number of spontaneous tin whisker models have been proposed, a model of tin whisker initiation by contact loading has not yet been established... View full abstract»

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  • Microstructure-Based Stress Modeling of Tin Whisker Growth

    Publication Year: 2006, Page(s):265 - 273
    Cited by:  Papers (23)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2016 KB) | HTML iconHTML

    A 3-D finite element method (FEM) model considering the elasticity anisotropy, thermal expansion anisotropy, and plasticity of beta-Sn is established. The Voronoi diagrams are used to generate the geometric patterns of grains of the Sn coating on Cu leadframes. The crystal orientations are assigned to the Sn grains in the model using the X-ray diffraction (XRD) measurement data of the samples. The... View full abstract»

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  • Analysis of the Effects of Tin Whiskers at High Frequencies

    Publication Year: 2006, Page(s):274 - 279
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (861 KB) | HTML iconHTML

    The initiative to remove lead from microelectronics packages has led to increased use of pure tin plating as the final finish on the leads of some parts. This finish can spontaneously grow whiskers on its surface. This paper presents results of a study by electromagnetic modeling into the possible effect of these whiskers on high-frequency signals. These results show that realistic configurations ... View full abstract»

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  • Real-Time Quality Evaluation of Wire Bonding Using Input Impedance

    Publication Year: 2006, Page(s):280 - 284
    Cited by:  Papers (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (214 KB) | HTML iconHTML

    Input impedance characterizes the dynamic property of a linear system. A few existing technologies thus exploit input electrical impedance of wire bonders as the signature to monitor ultrasonic wire bonding processes. However, the waveforms of "impedance" in these technologies are evaluated only approximately. To overcome the shortcoming, we propose a method to detect the true waveforms of both th... View full abstract»

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  • Multiple Orders Per Job Compatible Batch Scheduling

    Publication Year: 2006, Page(s):285 - 296
    Cited by:  Papers (24)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (472 KB) | HTML iconHTML

    This paper investigates the problem of grouping different customer orders into jobs and these formed jobs to batches and scheduling them on a single batch processing machine to minimize the total weighted tardiness of orders. A compatible batching environment is considered in which there is no restriction on the orders being from the same family to be batched together. A mixed-integer program (MIP... View full abstract»

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  • Preventing of Dewetting Effects for Inorganic–Organic Hybrid Polymers Applied in Sequentially Buildup (SBU) Technology Without Surface Pretreatments

    Publication Year: 2006, Page(s):297 - 307
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1449 KB) | HTML iconHTML

    Upon processing waveguide structures by using the ORMOCER materials ORMOCORE as core material, and a mixture of ORMOCORE and ORMOCER-III (refractive index tuning agent) as cladding material, dewetting effects of the core layer from the cladding layer were observed. A similar phenomenon was observed for a mixture of ORMOCORE and ORMOCLAD which was used as comparative refractive index tuning materia... View full abstract»

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  • Using Transmission Laser Bonding Technique for Line Bonding in Microsystem Packaging

    Publication Year: 2006, Page(s):308 - 318
    Cited by:  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1723 KB) | HTML iconHTML

    The transmission laser bonding (TLB) technique has been developed for the formation of continuous line bonds for microsystem packaging applications. Line bonds are generated by overlapping single bonding spots, in which the degree of overlapping is achieved by varying the scanning speed of the laser as it irradiates the bonding wafers. An analytical model has been developed to guide the TLB proces... View full abstract»

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  • IEEE Transactions on Advanced Packaging - Table of contents

    Publication Year: 2006, Page(s):319 - 320
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  • IEEE Transactions on Components and Packaging Technolog - Table of contents

    Publication Year: 2006, Page(s):321 - 322
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  • 2006 Index

    Publication Year: 2006, Page(s):323 - 328
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2006, Page(s): C3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2006, Page(s): C4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University