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Browse Journals & Magazines > Components and Packaging Techn ... Volume 29 Issue 4 Help

Components and Packaging Technologies, IEEE Transactions on

Issue 4 • Date Dec. 2006

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Aims & Scope

IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.

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Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.

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