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IEEE Transactions on Electronics Packaging Manufacturing

Issue 3 • Date July 2006

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Displaying Results 1 - 17 of 17
  • Table of contents

    Publication Year: 2006, Page(s): c1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2006, Page(s): c2
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  • Copper Direct Drilling With TEA \hbox {CO}_{2} Laser in Manufacture of High-Density Interconnection Printed Circuit Board

    Publication Year: 2006, Page(s):145 - 149
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB) | HTML iconHTML

    A method for copper direct drilling by carbon dioxide (CO2 ) laser was investigated for efficient microvia formation on the copper conducting layer of high-density interconnection (HDI) of printed circuit board (PCB). A metal-tin layer was coated on the surface of copper conductor foil to enhance the CO2 laser energy adsorption on it. The coated surfaces were then drilled by ... View full abstract»

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  • Planning the e-Scrap Reverse Production System Under Uncertainty in the State of Georgia: A Case Study

    Publication Year: 2006, Page(s):150 - 162
    Cited by:  Papers (23)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1546 KB) | HTML iconHTML

    Due to legislative requirements, environmental concerns, and market image, the disposition of end-of-life e-scrap is attracting tremendous attention in many parts of the world today. Effective management of returned used product flows can have a great impact on the profitability and resulting financial viability of associated e-scrap reverse production systems. However, designing efficient e-scrap... View full abstract»

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  • An Experimental and Numerical Investigation Into Multilayer Probe Card Layout Design

    Publication Year: 2006, Page(s):163 - 171
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2820 KB) | HTML iconHTML

    This paper conducts experimental and numerical investigations into the microforce probing technique used to test the functionality of IC devices. The study commences by considering the case of a single tungsten needle probe and examines the relationship between the contact force and the scrub mark size on aluminum pads at various levels of overdrive and shooting angle. Subsequently, a three-dimens... View full abstract»

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  • Using Coupled Transmission Lines to Generate Impedance-Matched Pulses Resembling Charged Device Model ESD

    Publication Year: 2006, Page(s):172 - 178
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (839 KB) | HTML iconHTML

    A quarter-wave directional coupler plus ordinary transmission line pulsing (TLP) can create short pulses resembling charged device model (CDM) electrostatic discharge (ESD). Pulse rise time often relates to the coupler's center frequency and can thereby be stabilized. It is shown that for a voltage step of a given size, yet with arbitrary waveform, the net amount of coupled charge (the charge pack... View full abstract»

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  • Acid Decapsulation of Epoxy Molded IC Packages With Copper Wire Bonds

    Publication Year: 2006, Page(s):179 - 183
    Cited by:  Papers (28)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (478 KB) | HTML iconHTML

    Epoxy molded IC packages with copper wire bonds are decapsulated using mixtures of concentrated sulfuric acid (20%) and fuming nitric acid in an automatic decapping unit and, observed with minimal corrosion of copper wires (0.8-6 mil sizes) and bond interfaces. To attain maximum cross-linking of the molded epoxies, the post mold cured packages (175 degC for 4 h) were further, aged at high temperat... View full abstract»

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  • Establishing a Relationship Between Warranty and Reliability

    Publication Year: 2006, Page(s):184 - 190
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (273 KB) | HTML iconHTML

    In today's competitive marketplace, customers have come to expect that the products they purchase will perform as intended, and federal and state laws have been passed to enshrine this as a right of customers. A warranty is a written assurance that the manufacturer of a product will guarantee the quality and reliability of a product in terms of correcting any legitimate problems with the product a... View full abstract»

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  • Mechanical Strength and Interface Characteristics of Transmission Laser Bonding

    Publication Year: 2006, Page(s):191 - 201
    Cited by:  Papers (6)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (880 KB) | HTML iconHTML

    A laser-based bonding technique, called transmission laser bonding (TLB), is studied for the purposes of device and wafer-level packaging. The TLB technique uses the specific characteristics of a laser to bond a transparent wafer on top of an opaque wafer. When a laser beam with a specific wavelength is passed through a transparent wafer, high-density laser energy is absorbed by the opaque wafer a... View full abstract»

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  • Wave Soldering Using Sn/3.0Ag/0.5Cu Solder and Water Soluble VOC-Free Flux

    Publication Year: 2006, Page(s):202 - 210
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (759 KB) | HTML iconHTML

    Environmental and health concerns, due to the leaching of lead from landfills into ground water, have necessitated legislation that restricts the use of lead in electronics. The transition from the eutectic tin-lead composition used in electronic solders to lead-free solder is imminent. Understanding the impact of this transition on lead-free wave soldering is crucial because a large segment of pr... View full abstract»

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  • Reliability Investigation of Mixed BGA Assemblies

    Publication Year: 2006, Page(s):211 - 216
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3236 KB) | HTML iconHTML

    The effect of different reflow profiles on the reliability of lead-free (LF) Sn-3.0 Ag-0.5 Cu (wt.%) (SAC 305) ball grid array (BGA) devices assembled with a SnPb eutectic paste was investigated. The memory modules in a back-to-back configuration were reflowed on standard graphic cards finished with immersion silver (IAg) or hot air solder leveling (HASL) coatings. The reflow peak temperatures ran... View full abstract»

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  • Surface Insulation Resistance of Conformally Coated Printed Circuit Boards Processed With No-Clean Flux

    Publication Year: 2006, Page(s):217 - 223
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (747 KB) | HTML iconHTML

    Printed circuit board (PCB) specimens containing three different IPC-B-25 test structures were exposed to temperature/humidity/bias conditions in order to evaluate the effects of conformal coating, conductor spacing, voltage bias, flux chemistry, and test environment on surface insulation resistance (SIR). Results indicate that conformal coatings improve reliability, provided that sources of conta... View full abstract»

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    Publication Year: 2006, Page(s): 224
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  • IEEE Transactions on Advanced Packaging - Table of contents

    Publication Year: 2006, Page(s):225 - 226
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  • IEEE Transactions on Components and Packaging Technolog - Table of contents

    Publication Year: 2006, Page(s):227 - 228
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2006, Page(s): c3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2006, Page(s): c4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University