Proceedings of the IEEE

Issue 8 • Aug. 2006

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  • [Front cover]

    Publication Year: 2006, Page(s): c1
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  • Proceedings of the IEEE publication information

    Publication Year: 2006, Page(s): c2
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  • Table of contents

    Publication Year: 2006, Page(s):1469 - 1470
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  • Climate Change and the Proper Role of Scientists and Engineers

    Publication Year: 2006, Page(s):1471 - 1472
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  • Scanning the Special Issue on On-Chip Thermal Engineering

    Publication Year: 2006, Page(s):1473 - 1475
    Cited by:  Papers (6)
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  • Cooling a Microprocessor Chip

    Publication Year: 2006, Page(s):1476 - 1486
    Cited by:  Papers (119)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1012 KB) | HTML iconHTML

    Increasing microprocessor performance has historically been accompanied by increasing power and increasing on-chip power density, both of which present a cooling challenge. In this paper, the historical evolution of power is traced and the impact of power and power density on thermal solution designs is summarized. Industrial and academic researchers have correspondingly increased their focus on e... View full abstract»

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  • Thermal Modeling, Analysis, and Management in VLSI Circuits: Principles and Methods

    Publication Year: 2006, Page(s):1487 - 1501
    Cited by:  Papers (165)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (399 KB) | HTML iconHTML

    The growing packing density and power consumption of very large scale integration (VLSI) circuits have made thermal effects one of the most important concerns of VLSI designers. The increasing variability of key process parameters in nanometer CMOS technologies has resulted in larger impact of the substrate and metal line temperatures on the reliability and performance of the devices and interconn... View full abstract»

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  • Temperature-Aware Placement for SOCs

    Publication Year: 2006, Page(s):1502 - 1518
    Cited by:  Papers (27)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (771 KB) | HTML iconHTML

    Dramatic rises in the power consumption and integration density of contemporary systems-on-chip (SoCs) have led to the need for careful attention to chip-level thermal integrity. High temperatures or uneven temperature distributions may result not only in reliability issues, but also timing failures, due to the temperature-dependent nature of chip time-to-failure and delay, respectively. To resolv... View full abstract»

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  • Dynamic Surface Temperature Measurements in ICs

    Publication Year: 2006, Page(s):1519 - 1533
    Cited by:  Papers (43)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1199 KB) | HTML iconHTML

    Measuring techniques of the die surface temperature in integrated circuits are reported as very appropriate for failure analysis, for thermal characterization, and for testing modern devices. The paper is arranged as a survey of techniques oriented towards measuring the temperature dynamics of the circuit surface and presenting and discussing both the merits and drawbacks of each technique with re... View full abstract»

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  • On-Chip Thermal Management With Microchannel Heat Sinks and Integrated Micropumps

    Publication Year: 2006, Page(s):1534 - 1548
    Cited by:  Papers (62)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1502 KB) | HTML iconHTML

    Liquid-cooled microchannel heat sinks are regarded as being amongst the most effective solutions for handling high levels of heat dissipation in space-constrained electronics. However, obstacles to their successful incorporation into products have included their high pumping requirements and the limits on available space which precludes the use of conventional pumps. Moreover, the transport charac... View full abstract»

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  • Direct Liquid Cooling of High Flux Micro and Nano Electronic Components

    Publication Year: 2006, Page(s):1549 - 1570
    Cited by:  Papers (64)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1470 KB) | HTML iconHTML

    The inexorable rise in chip power dissipation and emergence of on-chip hot spots with heat fluxes approaching 1 =kW/cm2 has turned renewed attention to direct cooling with dielectric liquids. Use of dielectric liquids in intimate contact with the heat dissipating surfaces eliminates the deleterious effects of solid-solid interface resistances and harnesses the highly efficient phase-cha... View full abstract»

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  • Thermal Interface Materials: Historical Perspective, Status, and Future Directions

    Publication Year: 2006, Page(s):1571 - 1586
    Cited by:  Papers (298)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1248 KB) | HTML iconHTML

    With the continual increase in cooling demand for microprocessors, there has been an increased focus within the microelectronics industry on developing thermal solutions. Thermal interface materials (TIMs) play a key role in thermally connecting various components of the thermal solution. Review of the progress made in the area of TIMs in the past five years is presented. The focus is on the rheol... View full abstract»

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  • Heat Generation and Transport in Nanometer-Scale Transistors

    Publication Year: 2006, Page(s):1587 - 1601
    Cited by:  Papers (219)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (547 KB) | HTML iconHTML

    As transistor gate lengths are scaled towards the 10-nm range, thermal device design is becoming an important part of microprocessor engineering. Decreasing dimensions lead to nanometer-scale hot spots in the transistor drain region, which may increase the drain series and source injection electrical resistances. Such trends are accelerated by the introduction of novel materials and nontraditional... View full abstract»

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  • Overview of Solid-State Thermoelectric Refrigerators and Possible Applications to On-Chip Thermal Management

    Publication Year: 2006, Page(s):1602 - 1612
    Cited by:  Papers (30)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB) | HTML iconHTML

    The concept of thermal management in microelectronic components is changing, and so is the potential for solid-state cooling to solve emerging problems. There is a qualitative change that differentiates the past from the future. We discuss past practices and future trends in the electronic cooling markets, setting the stage for an outline of designs and processes that provide new and enabling opti... View full abstract»

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  • Nanoscale Thermal Transport and Microrefrigerators on a Chip

    Publication Year: 2006, Page(s):1613 - 1638
    Cited by:  Papers (118)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1483 KB) | HTML iconHTML

    In this paper we review recent advances in nanoscale thermal and thermoelectric transport with an emphasis on the impact on integrated circuit (IC) thermal management. We will first review thermal conductivity of low-dimensional solids. Experimental results have shown that phonon surface and interface scattering can lower thermal conductivity of silicon thin films and nanowires in the sub-100-nm r... View full abstract»

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  • Electrical Engineering Hall of Fame: Harris J. Ryan

    Publication Year: 2006, Page(s):1639 - 1642
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (534 KB) | HTML iconHTML

    In 1925, the American Institute of Electrical Engineers (AIEE) selected Harris J. Ryan as the recipient of the Edison Medal. He was cited "for his contributions to the science and art of high-tension transmission of power." He had been a member of the AIEE since 1887 and had served as vice president of the Institute during 1896-1898 and as president during 1923-1924. He enjoyed an outstanding care... View full abstract»

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  • Future Special Issues/Special Sections of the Proceedings

    Publication Year: 2006, Page(s): 1643
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  • Leading the field since 1884 [advertisement]

    Publication Year: 2006, Page(s): 1644
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  • IEEE Member Digital Library [advertisement]

    Publication Year: 2006, Page(s): c3
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  • Coming in September the Proceedings of the IEEE

    Publication Year: 2006, Page(s): c4
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Meet Our Editors

Editor-in-Chief
H. Joel Trussell
North Carolina State University