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Proceedings of the IEEE

Issue 6 • June 2006

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Displaying Results 1 - 19 of 19
  • [Front cover]

    Publication Year: 2006, Page(s): c1
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  • Proceedings of the IEEE [publication information]

    Publication Year: 2006, Page(s): c2
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  • Table of contents

    Publication Year: 2006, Page(s):1041 - 1042
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  • Electronic journals versus print: Publishing in the electronic age [Point of view]

    Publication Year: 2006, Page(s):1043 - 1044
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  • Special Issue on Systems-on-Chip: Design and Integration

    Publication Year: 2006, Page(s):1045 - 1049
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  • System-on-Chip: Reuse and Integration

    Publication Year: 2006, Page(s):1050 - 1069
    Cited by:  Papers (82)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1061 KB) | HTML iconHTML

    Over the past ten years, as integrated circuits became increasingly more complex and expensive, the industry began to embrace new design and reuse methodologies that are collectively referred to as system-on-chip (SoC) design. In this paper, we focus on the reuse and integration issues encountered in this paradigm shift. The reusable components, called intellectual property (IP) blocks or cores, a... View full abstract»

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  • Embedding Mixed-Signal Design in Systems-on-Chip

    Publication Year: 2006, Page(s):1070 - 1088
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1150 KB) | HTML iconHTML

    With semiconductor technology feature size scaling below 100 nm, mixed-signal design faces some important challenges, caused among others by reduced supply voltages, process variation, and declining intrinsic device gains. Addressing these challenges requires innovative solutions, at the technology, circuit, architecture, and design-methodology level. We present some of these solutions, including ... View full abstract»

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  • Asynchronous Techniques for System-on-Chip Design

    Publication Year: 2006, Page(s):1089 - 1120
    Cited by:  Papers (140)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (587 KB) | HTML iconHTML

    SoC design will require asynchronous techniques as the large parameter variations across the chip will make it impossible to control delays in clock networks and other global signals efficiently. Initially, SoCs will be globally asynchronous and locally synchronous (GALS). But the complexity of the numerous asynchronous/synchronous interfaces required in a GALS will eventually lead to entirely asy... View full abstract»

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  • An Industry Perspective on Current and Future State of the Art in System-on-Chip (SoC) Technology

    Publication Year: 2006, Page(s):1121 - 1137
    Cited by:  Papers (20)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (956 KB) | HTML iconHTML

    In fast-moving consumer electronics markets where product lifetimes may be measured in months rather than years, fast time-to-market development of the system-on-chip solutions that lie at the heart of these products has become critical to commercial success. New semiconductor process technologies have the potential to integrate ever greater functional complexity onto realistically priced silicon ... View full abstract»

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  • Chip-Scale Integration of Data-Gathering Microsystems

    Publication Year: 2006, Page(s):1138 - 1159
    Cited by:  Papers (23)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1574 KB) | HTML iconHTML

    Integrated microsystems merging embedded computing with sensing and actuation are poised to dramatically expand our ability to gather information from the nonelectronic world. Examples include a microassembled multichip electronic interface to the brain, an integrated electrofluidic gas chromatography system for environmental monitoring, and a wireless intra-arterial microsystem for pressure and f... View full abstract»

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  • Microsensor Integration Into Systems-on-Chip

    Publication Year: 2006, Page(s):1160 - 1176
    Cited by:  Papers (56)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1288 KB) | HTML iconHTML

    Sensing systems-on-chip (SSoCs), combining micromachined sensing structures and microelectronic building blocks on a single chip, are reviewed. While single-chip pressure and inertial sensing systems have been commercially available for more than a decade, the recent expansion of SSoC into new application areas, ranging from chemical and biochemical sensing to atomic force microscopy, demonstrates... View full abstract»

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  • SoC Issues for RF Smart Dust

    Publication Year: 2006, Page(s):1177 - 1196
    Cited by:  Papers (85)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1149 KB) | HTML iconHTML

    Wireless sensor nodes are autonomous devices incorporating sensing, power, computation, and communication into one system. Applications for large scale networks of these nodes are presented in the context of their impact on the hardware design. The demand for low unit cost and multiyear lifetimes, combined with progress in CMOS and MEMS processing, are driving development of SoC solutions for sens... View full abstract»

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  • SoC Emerging Technologies

    Publication Year: 2006, Page(s):1197 - 1213
    Cited by:  Papers (26)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1222 KB) | HTML iconHTML

    Although silicon technology is continuously evolving to produce smaller systems with minimized power dissipation and at a lower cost and improved reliability, it is expected that this trend will have matured between 2014 and 2016. This will eventually lead to the integration of a multiplicity of technologies rather than simply silicon technology. This multiplicity of technologies will be the drivi... View full abstract»

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  • Three-Dimensional Integrated Circuits and the Future of System-on-Chip Designs

    Publication Year: 2006, Page(s):1214 - 1224
    Cited by:  Papers (323)  |  Patents (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2087 KB) | HTML iconHTML

    Three-dimensional integrated circuits (3-D ICs) offer significant improvements over two-dimensional circuits, and promise a solution to the severe problems that are being, and will be, encountered as monolithic process geometries are reduced to below 65 nm. Several methods associated with the fabrication of 3-D ICs are discussed in this paper, and the techniques developed by Tezzaron Semiconductor... View full abstract»

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  • Design Tools for an Emerging SoC Technology: Quantum-Dot Cellular Automata

    Publication Year: 2006, Page(s):1225 - 1244
    Cited by:  Papers (77)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1576 KB) | HTML iconHTML

    The future of system-on-chip (SoC) technologies, based on the scaling of current FET-based integrated circuitry, is being predicted to reach fabrication limits by the year 2015. Economic limits may be reached before that time. Continued scaling of electronic devices to molecular scales will undoubtedly require a paradigm shift from the FET-based switch to an alternative mechanism of information re... View full abstract»

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  • Electrical Engineering Hall of Fame: Robert A. Millikan

    Publication Year: 2006, Page(s):1245 - 1247
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (241 KB) | HTML iconHTML

    In 1911, the American Institute of Electrical Engineers (AIEE) selected Robert Andrews Millikan as the recipient of the Edison Medal. He was cited "for his experimental work in electrical science". He was the first recipient to be honored primarily for his scientific contributions rather than engineering or invention. The selection committee may have been influenced by his leading role in the mobi... View full abstract»

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  • Future Special Issues/Special Sections of the Proceedings

    Publication Year: 2006, Page(s): 1248
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  • IEEE Member Digital Library [advertisement]

    Publication Year: 2006, Page(s): c3
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  • Coming in July the Proceedings of the IEEE

    Publication Year: 2006, Page(s): c4
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Editor-in-Chief
H. Joel Trussell
North Carolina State University