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IEEE Transactions on Electronics Packaging Manufacturing

Issue 2 • Date April 2006

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  • Table of contents

    Publication Year: 2006, Page(s): c1
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  • IEEE Components, Packaging, and Manufacturing Technology Society [publication information]

    Publication Year: 2006, Page(s): c2
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  • Development of horizontal elements in 3-D microcontacts

    Publication Year: 2006, Page(s):69 - 74
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1984 KB) | HTML iconHTML

    This paper describes the development and production of horizontal elements in three-dimensional (3-D) microcontacts, implemented in package to PCB assembly. Instead of the standard vacuum deposition process of metal films onto dielectric interfaces, an alternative method aiming at simplicity and lower-cost relative to the technology roadmap, is proposed. This method employs chemical activation and... View full abstract»

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  • Effects of fluid properties on dispensing processes for electronics packaging

    Publication Year: 2006, Page(s):75 - 82
    Cited by:  Papers (21)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (896 KB) | HTML iconHTML

    The fluid dispensing process has been widely employed in electronics packaging manufacturing to deliver fluid materials (such as epoxy, encapsulant, adhesive) on substrates or printed circuit boards (PCBs) for the purpose of die attachment, encapsulation, coating, or surface mounting. In this process, the fluid properties such as How behavior, surface tension, and contact angle can have a signific... View full abstract»

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  • Eco-efficiency of take-back and recycling, a comprehensive approach

    Publication Year: 2006, Page(s):83 - 90
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB) | HTML iconHTML

    A key question in setting up take-back systems for discarded consumer electronics is how much environmental improvement can be realized per amount of money invested. With the eco-efficiency concept developed, the environmental and economic performance of single products within various end-of-life scenarios can be quantified as well as the contribution of individual materials and material fractions... View full abstract»

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  • An accommodative approach designed for TCP gold-to-gold inner lead bonding

    Publication Year: 2006, Page(s):91 - 98
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1528 KB) | HTML iconHTML

    This paper proposes an approach that resolves the tradeoff between bond pad crack, the passivation crack, and lead lift failure modes in gold-to-gold inner lead bonding. The bonding head temperature, stage temperature, and bonding force are addressed as three critical recipes. The proposed scenario determines the bonding head temperature according to the maximum compensation flatness, followed by ... View full abstract»

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  • Online multiobjective Pareto optimal dynamic scheduling of semiconductor back-end using conjunctive simulated scheduling

    Publication Year: 2006, Page(s):99 - 109
    Cited by:  Papers (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB) | HTML iconHTML

    A discrete event simulation based "online near-real-time" dynamic multiobjective scheduling system has been conceptualized, designed, and developed to achieve Pareto optimal solutions in a complex manufacturing environment of semiconductor back-end. Our approach includes the use of linear weighted aggregation optimization approach for multiple objectives and auto simulation model generation for on... View full abstract»

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  • Plastic separation planning for end-of-life electronics

    Publication Year: 2006, Page(s):110 - 118
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (568 KB) | HTML iconHTML

    Important challenges remain for sustainable design, manufacture, use, and recycling of electronics including materials selection and disassembly time. This paper examines the value relationship between the quantity of plastics separated and the time required for disassembly and segregation. Labor costs for disassembly can constitute a large portion of the total acquisition cost for a recycled mate... View full abstract»

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  • Double bump flip-chip assembly

    Publication Year: 2006, Page(s):119 - 133
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3912 KB) | HTML iconHTML

    Capillary underfill remains the dominate process for underfilling Hip-chip die both in packages and for direct chip attach (DCA) on printed circuit board (PCB) assemblies. Capillary underfill requires a post reflow dispense and cure operation, and the underflow time increases with increasing die area and decreasing die-to-substrate spacing. Fluxing or no-How underfills are dispensed prior to die p... View full abstract»

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  • 2nd Annual Organic Microelectronics Workshop (ACS/IEEE/MRS)

    Publication Year: 2006, Page(s): 134
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  • 15th Topical Meeting on Electrical Performance of Electronic Packaging (EPEP 2006)

    Publication Year: 2006, Page(s): 135
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  • 8th Electronics Packaging Technology Conference (EPTC 2006)

    Publication Year: 2006, Page(s): 136
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  • 56th Electronic Components and Packaging Conference (ECPC 2006)

    Publication Year: 2006, Page(s): 137
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  • Celebrating the vitality of technology the Proceedings of the IEEE [advertisement]

    Publication Year: 2006, Page(s): 138
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  • Have you visited lately? www.ieee.org [advertisement]

    Publication Year: 2006, Page(s): 139
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  • IEEE order form for reprints

    Publication Year: 2006, Page(s): 140
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  • IEEE Transactions on Advanced Packaging - Table of contents

    Publication Year: 2006, Page(s):141 - 142
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  • IEEE Transactions on Components and Packaging Technolog - Table of contents

    Publication Year: 2006, Page(s):143 - 144
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  • IEEE Components, Packaging, and Manufacturing Technology Society - Information for authors

    Publication Year: 2006, Page(s): c3
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  • Board of Governors [IEEE Components, Packaging, and Manufacturing Technology Society information]

    Publication Year: 2006, Page(s): c4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University