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IEEE Transactions on Semiconductor Manufacturing

Issue 2 • Date May 2006

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Displaying Results 1 - 17 of 17
  • Table of contents

    Publication Year: 2006, Page(s): c1
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  • IEEE Transactions on Semiconductor Manufacturing publication information

    Publication Year: 2006, Page(s): c2
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  • 2005 Best Paper Award

    Publication Year: 2006, Page(s):157 - 158
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  • Multiblock principal component analysis based on a combined index for semiconductor fault detection and diagnosis

    Publication Year: 2006, Page(s):159 - 172
    Cited by:  Papers (80)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (592 KB) | HTML iconHTML

    The purposes of multivariate statistical process control (MSPC) are to improve process operations by quickly detecting when process abnormalities have occurred and diagnosing the sources of the process abnormalities. In the area of semiconductor manufacturing, increased yield and improved product quality result from reducing the amount of wafers produced under suboptimal operating conditions. This... View full abstract»

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  • Neurogenetic design centering

    Publication Year: 2006, Page(s):173 - 182
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (744 KB) | HTML iconHTML

    A new technique for design centering and yield enhancement of devices and circuits is presented. The proposed method uses neural networks for device and/or circuit modeling and genetic algorithms for parametric yield optimization. It uses a Monte Carlo-based method for yield estimation via the neural models (thus consuming less time) and genetic algorithms for efficient design centering. The neuro... View full abstract»

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  • A processing quality prognostics scheme for plasma sputtering in TFT-LCD manufacturing

    Publication Year: 2006, Page(s):183 - 194
    Cited by:  Papers (43)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (784 KB) | HTML iconHTML

    A novel quality prognostics scheme (QPS) for plasma sputtering in TFT-LCD manufacturing processes is proposed. The QPS consists of a conjecture model and a prediction model. The conjecture model can use processing parameters and sensor data to estimate the processing quality (sputtering thickness) in real time. This conjecture function is also called virtual metrology. On the other hand, the predi... View full abstract»

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  • Intelligent prognostics system design and implementation

    Publication Year: 2006, Page(s):195 - 207
    Cited by:  Papers (29)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (760 KB) | HTML iconHTML

    This paper proposes an intelligent prognostics system JPS) for semiconductor and TFT-LCD manufacturing. The IPS comprises several generic embedded devices (GEDs) and remote clients. The GED can be easily embedded into various types of equipment to acquire equipment engineering data and meet the specification requirements of Interface A for supporting semiconductor industry equipment engineering ca... View full abstract»

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  • Treatment of Chemical–Mechanical Planarization Wastes by Electrocoagulation/Electro- Fenton Method

    Publication Year: 2006, Page(s):208 - 215
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (896 KB) | HTML iconHTML

    A method for the treatment of chemical–mechanical planaarization wastewater that utilizes the principles of electrocoagulation (EC) and electro-Fenton (EF) reactions has been investigated. The method consists of subjecting the wastewater to an applied electric field between two iron electrodes, in the presence of hydrogen peroxide. Dissolved iron is responsible for electrocoagulation, while ... View full abstract»

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  • A problem reduction approach for scheduling semiconductor wafer fabrication facilities

    Publication Year: 2006, Page(s):216 - 225
    Cited by:  Papers (15)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (672 KB) | HTML iconHTML

    Most scheduling procedures used in industry are based on the dispatching paradigm, where decisions are made based on the jobs available at the time the machine becomes free. While optimization-based scheduling procedures have repeatedly been shown to yield significantly better schedules under ideal circumstances, their practical implementation is hampered by high computational requirements. We pre... View full abstract»

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  • Scheduling single-armed cluster tools with reentrant wafer flows

    Publication Year: 2006, Page(s):226 - 240
    Cited by:  Papers (65)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (744 KB) | HTML iconHTML

    A cluster tool for semiconductor manufacturing consists of several single-wafer processing chambers and a wafer-handling robot in a closed environment. The use of cluster tools is extended to reentrant processes such as atomic layer deposition, where a wafer visits a processing chamber more than once. Such a reentrant wafer How complicates scheduling and control of the cluster tool and often cause... View full abstract»

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  • Test wafer management for semiconductor manufacturing

    Publication Year: 2006, Page(s):241 - 251
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (784 KB) | HTML iconHTML

    Test wafers (TWs) are used for equipment qualification purposes in semiconductor manufacturing. TW management is unique because of the possibility of downgrading a TW to test lower class processes. Since the yearly TW costs add up to several million dollars for a typical semiconductor fab, effective TW management can substantially reduce costs by identifying the right quantity of TWs to purchase, ... View full abstract»

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  • Factory cycle-time prediction with a data-mining approach

    Publication Year: 2006, Page(s):252 - 258
    Cited by:  Papers (31)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (608 KB) | HTML iconHTML

    An estimate of cycle time for a product in a factory is critical to semiconductor manufacturers (and in other industries) to assess customer due dates, schedule resources and actions for anticipated job completions, and to monitor the operation. Historical data can be used to learn a predictive model for cycle time based on measured and calculated process metrics (such as work-in-progress at speci... View full abstract»

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  • Enterprise-wide semiconductor manufacturing resource planning

    Publication Year: 2006, Page(s):259 - 268
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (544 KB) | HTML iconHTML

    We develop a model for global logistics and resource optimization in a typical semiconductor manufacturing operation. The model is designed to aid in resource allocation and strategic decisions for long term planning in the semiconductor industry. Decisions include where to make products, whether or not to open new facilities, whether or not to add new tools, and whether or not to subcontract. View full abstract»

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  • Quantifying variability of batching equipment using effective process times

    Publication Year: 2006, Page(s):269 - 275
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (984 KB) | HTML iconHTML

    Process time variability plays a key role in the cycle time of wafers. Several sources of variability can be distinguished. However, identification and measurement of all individual sources is almost impossible. Therefore, in previous work, a new method has been proposed to measure effective process times (EPT) for single-lot machines. The EPT incorporates the various sources of variability. From ... View full abstract»

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  • 2006 EDS J.J. Ebers Award

    Publication Year: 2006, Page(s): 276
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  • IEEE Transactions on Semiconductor Manufacturing Information for authors

    Publication Year: 2006, Page(s): c3
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  • Blank page [back cover]

    Publication Year: 2006, Page(s): c4
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Aims & Scope

The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief

Anthony Muscat
Department of Chemical and Environmental Engineering
Harshbarger Bldg., Room 134
1133 E. James Rogers Way
University of Arizona
Tucson, AZ  85721