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IEEE Design & Test of Computers

Issue 2 • Date March-April 2006

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Displaying Results 1 - 25 of 28
  • [Front cover]

    Publication Year: 2006, Page(s): c1
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  • [Inside front cover]

    Publication Year: 2006, Page(s): c2
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  • Call for Papers

    Publication Year: 2006, Page(s): 81
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  • Table of contents

    Publication Year: 2006, Page(s):82 - 83
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  • Masthead

    Publication Year: 2006, Page(s): 84
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  • Dealing with early life failures

    Publication Year: 2006, Page(s): 85
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  • Guest Editor's Introduction: Evolving Methods for Detecting and Handling Reliability Defects

    Publication Year: 2006, Page(s):86 - 87
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (52 KB) | HTML iconHTML

    Guest editor Phil Nigh introduces the Special Issue on Latent-Defect Screening as he explores the difficulties of current methods and calls for new solutions. View full abstract»

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  • Reducing burn-in time through high-voltage stress test and Weibull statistical analysis

    Publication Year: 2006, Page(s):88 - 98
    Cited by:  Papers (17)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (184 KB) | HTML iconHTML

    To guarantee an industry standard of reliability in ICs, manufacturers incorporate special testing techniques into the circuit manufacturing process. For most electronic devices, the specific reliability required is quite high, often producing a lifespan of several years. Testing such devices for reliability under normal operating conditions would require a very long period of time to gather the d... View full abstract»

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  • Call-for-Papers

    Publication Year: 2006, Page(s): 99
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  • Changing test and data modeling requirements for screening latent defects as statistical outliers

    Publication Year: 2006, Page(s):100 - 109
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB) | HTML iconHTML

    The expanded role of test demands a significant change in mind-set of nearly every engineer involved in the screening of semiconductor products. The issues to consider range from DFT and ATE requirements, to the design and optimization of test patterns, to the physical and statistical relationships of different tests, and finally, to the economics of reducing test time and cost. The identification... View full abstract»

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  • Combining negative binomial and Weibull distributions for yield and reliability prediction

    Publication Year: 2006, Page(s):110 - 116
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (136 KB) | HTML iconHTML

    A key productivity metric in semiconductor manufacturing is wafer test yield - the fraction of dies deemed functional following wafer probe testing. Wafer test yield is directly related to semiconductor manufacturing profitability: The higher the yield, the lower the cost of producing a functional chip, and therefore the greater the potential profit. Because wafer test yield is such a critical var... View full abstract»

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  • Call for Papers

    Publication Year: 2006, Page(s): 117
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  • The impact of multiple failure modes on estimating product field reliability

    Publication Year: 2006, Page(s):118 - 126
    Cited by:  Papers (20)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (256 KB) | HTML iconHTML

    A difficulty in reliability modeling is how to capture the impact of all of the various reliability defect types. The general approach to optimizing burn-in that we describe in this article addresses a multiple-defect environment. The approach has four main parts: (i) modeling the product's failure rate distribution, (ii) establishing the Pareto distribution of reliability defects, (iii) assessing... View full abstract»

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  • Call for Papers

    Publication Year: 2006, Page(s): 127
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  • Test consideration for nanometer-scale CMOS circuits

    Publication Year: 2006, Page(s):128 - 136
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (136 KB) | HTML iconHTML

    The exponential increase in leakage, the device parameter variations, and the aggressive power management techniques will severely impact IC testing methods. Test technology faces new challenges as faults with increasingly complex behavior become predominant. Design approaches aimed at fixing some of the undesirable effects of nanometric technologies could jeopardize current test approaches. In th... View full abstract»

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  • Call for Papers

    Publication Year: 2006, Page(s): 137
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  • Optical contactless probing: an all-silicon, fully optical approach

    Publication Year: 2006, Page(s):138 - 146
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (400 KB) | HTML iconHTML

    With decreasing feature size and increasing chip densities, the classical mechanical probe approach for internal fault detection and functional testing faces increasing challenges. Contactless testing might resolve many of the challenges associated with conventional mechanical wafer testing. This article reviews and explains existing optical contactless technologies and introduces a new test metho... View full abstract»

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  • IEEE Computer Society Information

    Publication Year: 2006, Page(s): 147
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  • A SystemC refinement methodology for embedded software

    Publication Year: 2006, Page(s):148 - 158
    Cited by:  Papers (10)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (360 KB) | HTML iconHTML

    This article presents a design environment that provides an interface for user-written SystemC modules that model application software to make calls to a real-time operating system (RTOS) kernel and cosimulate with user-written SystemC hardware modules. The environment also facilitates successive refinement through three abstraction layers for hardware-software codesign suitable for embedded-syste... View full abstract»

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  • Call for Papers

    Publication Year: 2006, Page(s): 159
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  • Was it worth the wait? Yes!

    Publication Year: 2006, Page(s):160 - 161
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  • An insider's look at microprocessor design

    Publication Year: 2006, Page(s):162 - 163
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  • ITC 2005 panels

    Publication Year: 2006, Page(s):164 - 166
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  • TTTC technical forum honoring Sudhakar M. Reddy

    Publication Year: 2006, Page(s): 167
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  • CEDA Currents

    Publication Year: 2006, Page(s):168 - 171
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Aims & Scope

This Periodical ceased production in 2012. The current retitled publication is IEEE Design & Test.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Krishnendu Chakrabarty