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IEEE Transactions on Electronics Packaging Manufacturing

Issue 1 • Date Jan. 2006

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Displaying Results 1 - 15 of 15
  • Table of contents

    Publication Year: 2006, Page(s): c1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2006, Page(s): c2
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  • Lead-free chip scale packages: assembly and drop test reliability

    Publication Year: 2006, Page(s):1 - 9
    Cited by:  Papers (20)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3816 KB) | HTML iconHTML

    Three underfill options compatible with lead-free assembly have been evaluated: capillary underfill, fluxing underfill, and corner bond underfill. Chip scale packages (CSPs) with eutectic Sn/Pb solder were used for control samples. Without underfill, lead-free and Sn/Pb eutectic drop test results were comparable. Capillary flow underfills, dispensed and cured after reflow, are commonly used in CSP... View full abstract»

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  • Characteristics of Sn–Cu Solder Bump Formed by Electroplating for Flip Chip

    Publication Year: 2006, Page(s):10 - 16
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2584 KB) | HTML iconHTML

    Sn–Cu near eutectic solder bump was fabricated by electroplating for flip-chip, and its electroplating and bump characteristics were studied. A Si-wafer was used as a substrate and the under bump metallization (UBM) comprised 400 nm of Al, 300 nm of Cu, 400 nm of Ni, and 20 nm of Au sequentially from bottom to the top of the metallization. The electrolyte for plating Sn–Cu solder consi... View full abstract»

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  • Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping

    Publication Year: 2006, Page(s):17 - 24
    Cited by:  Papers (15)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1872 KB) | HTML iconHTML

    Thin wafers of 100-μm thickness laminated with die-attach film (DAF) was diced using a standard sawing process and revealed a low chipping crack resistance. Wafers laminated with conductive DAF shows greater chipping compared to nonconductive DAF and bare silicon wafer. It was found through scanning electron microscopy (SEM) micrographs, energy dispersive X-ray (EDX) analysis, and atomic force ... View full abstract»

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  • Viable plastics recycling from end-of-life electronics

    Publication Year: 2006, Page(s):25 - 31
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (408 KB) | HTML iconHTML

    Millions of end-of-life (EOL) electronic products represent more than one million tons of engineering thermoplastics. The economically and environmentally sound recovery of engineering thermoplastics from EOL electronics is a challenge to the sustainability of electronics manufacturing. In this paper, we review the technologies to separate and identify pure post-consumer plastics from EOL electron... View full abstract»

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  • Fabrication of microvias for multilayer LTCC substrates

    Publication Year: 2006, Page(s):32 - 41
    Cited by:  Papers (31)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2576 KB) | HTML iconHTML

    Advances in screen printing and photoimageable paste technologies have allowed low-temperature cofired ceramic (LTCC) circuit densities to continue to increase; however, the size of vias for Z-axis interconnections in multilayer LTCC substrates have been a limiting process constraint. In order to effectively exploit the 50-100-μm line/spacing capabilities of advanced screen printing and photoim... View full abstract»

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  • Run-to-run failure detection and diagnosis using neural networks and Dempster-Shafer theory: an application to excimer laser ablation

    Publication Year: 2006, Page(s):42 - 49
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1216 KB) | HTML iconHTML

    The formation of microvias in multilayer substrates is a critical factor in microelectronic packaging manufacturing. Such microstructures can be produced efficiently by excimer laser ablation. Thus, laser ablation systems are evolving to a level where the need to offset high capital equipment investment and lower equipment downtime are imminent. This paper presents a methodology for inline failure... View full abstract»

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  • Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques

    Publication Year: 2006, Page(s):50 - 57
    Cited by:  Papers (21)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1152 KB) | HTML iconHTML

    Quality inspection of deposited solder pastes is critical in surface mounting processes. As surface-mount technology (SMT) component pitches decrease, three-dimensional (3-D) measurement of solder pastes has become more and more important in ensuring solder joint reliability. Currently, the 3-D measurements for solder pastes are mainly performed by laser-based systems. However, they suffer from lo... View full abstract»

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  • Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration

    Publication Year: 2006, Page(s):58 - 63
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1352 KB) | HTML iconHTML

    Materials with high thermal conductivity and thermal expansion coefficient matching with that of Si or GaAs are being used for packaging high density microcircuits due to their ability of faster heat dissipation. Al/SiC is gaining wide acceptance as electronic packaging material due to the fact that its thermal expansion coefficient can be tailored to match with that of Si or GaAs by varying the A... View full abstract»

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  • 1st Electronics Systemintegration Technology Conference (ESTC 2006)

    Publication Year: 2006, Page(s): 64
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  • IEEE Transactions on Advanced Packaging - table of contents

    Publication Year: 2006, Page(s):65 - 66
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  • IEEE Transactions on Components and Packaging Technology - table of contents

    Publication Year: 2006, Page(s):67 - 68
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2006, Page(s): c3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2006, Page(s): c4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University