Electronics Packaging Manufacturing, IEEE Transactions on
Issue 1 • Date Jan. 2006
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Displaying Results 1 - 15 of 15
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Table of contents
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PDF (38 KB)
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IEEE Transactions on Electronics Packaging Manufacturing publication information
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PDF (42 KB)
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Effect of laminated wafer toward dicing process and alternative double pass sawing method to reduce chipping
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PDF (1872 KB)
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Run-to-run failure detection and diagnosis using neural networks and Dempster-Shafer theory: an application to excimer laser ablation
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PDF (1216 KB)
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Full-field 3-D measurement of solder pastes using LCD-based phase shifting techniques
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PDF (1152 KB)
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Al/SiC carriers for microwave integrated circuits by a new technique of pressureless infiltration
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PDF (1352 KB)
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1st Electronics Systemintegration Technology Conference (ESTC 2006)
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PDF (801 KB)
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IEEE Transactions on Advanced Packaging - table of contents
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PDF (51 KB)
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IEEE Transactions on Components and Packaging Technology - table of contents
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PDF (51 KB)
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IEEE Components, Packaging, and Manufacturing Technology Society Information for authors
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PDF (34 KB)
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IEEE Components, Packaging, and Manufacturing Technology Society Information
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PDF (32 KB)
Aims & Scope
IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.
Meet Our Editors
Editor-in-Chief
R. Wayne Johnson
Auburn University
