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IEEE Transactions on Electronics Packaging Manufacturing

Issue 3 • Date July 2005

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Displaying Results 1 - 19 of 19
  • Table of contents

    Publication Year: 2005, Page(s): c1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2005, Page(s): c2
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  • Foreword Special Section on Electrical Overstress/Electrostatic Discharge (EOS/ESD)

    Publication Year: 2005, Page(s): 205
    Cited by:  Papers (1)
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  • ESD phenomena in GMR heads in the manufacturing process of HDD and GMR heads

    Publication Year: 2005, Page(s):206 - 212
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1128 KB) | HTML iconHTML

    It is well known that giant magnetoresistive (GMR) heads used for hard disk drives (HDD) are very sensitive to electrostatic discharge (ESD). In this paper, we describe a method of categorizing ESD damage modes from a standpoint of magnetic influences on the heads as observed by quasi-static test (QST) characteristics as well as electromagnetic characteristics like off-track profiles. In addition,... View full abstract»

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  • TLP systems with combined 50- and 500-Ω impedance probes and Kelvin probes

    Publication Year: 2005, Page(s):213 - 223
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3640 KB) | HTML iconHTML

    Transmission line pulse (TLP) systems are mainly classified by their impedance, such as a 50- or 500-Ω current source. A new TLP configuration allows switching between 50 and 500 Ω by computer control to characterize a given part using both impedances. In addition, a four-needle Kelvin technique is introduced to TLP, which overcomes the measurement error from variations in contact resi... View full abstract»

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  • Combined TLP/RF testing system for detection of ESD failures in RF circuits

    Publication Year: 2005, Page(s):224 - 230
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (376 KB) | HTML iconHTML

    We present a modified transmission-line pulse (TLP) measurement system in which radio frequency (RF) functionality tests, along with the conventional leakage current measurement, are performed after each pulse to detect failure. Measurement results from 5-GHz low-noise amplifiers (LNAs) show that RF metrics degrade before the leakage current increases. Also, we introduce an electrostatic discharge... View full abstract»

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  • Corner bonding of CSPs: processing and reliability

    Publication Year: 2005, Page(s):231 - 240
    Cited by:  Papers (22)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (5080 KB) | HTML iconHTML

    The use of chip-scale packages (CSPs) has expanded rapidly, particularly in portable electronic products. Many CSP designs will meet the thermal cycle or thermal shock requirements for these applications. However, mechanical shock (drop) and bending requirements often necessitate the use of underfills to increase the mechanical strength of the CSP-to-board connection. Capillary flow underfills pro... View full abstract»

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  • Optimizing the IC delamination quality via six-sigma approach

    Publication Year: 2005, Page(s):241 - 248
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (608 KB) | HTML iconHTML

    Integrated circuit (IC) delamination defects occur due to a poor adhesion between wafer passivation and the assembly-molding compound. Most of the components with minor delamination are not detected during the testing process, but they have the potential to cause functional failure in the application field. Unfortunately, reworking these components is not permitted, and the IC manufacturer can inc... View full abstract»

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  • CO2 laser processing of alumina (Al2O3) printed circuit board substrates

    Publication Year: 2005, Page(s):249 - 258
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1424 KB) | HTML iconHTML

    We report the results of an investigation of the laser-material interaction processes involved in laser drilling of alumina, through the use of an enhanced peak power (2.5 kW) CO2 laser and novel temporal pulse formats. Peak power was varied from 30 W to 2 kW for pulses of constant energy to observe the effect produced on scribe depth. High-speed videography of hole formation has been c... View full abstract»

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  • Novel multilayering technique using folded flexible circuits

    Publication Year: 2005, Page(s):259 - 264
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (400 KB) | HTML iconHTML

    Multilayer circuit board technology offers the only feasible way to route high-density conductors through a narrow space. This technology has two limitations: the rigid multilayer circuit board typically used is not always compact enough for the application, and it is expensive. In this paper, we present a less expensive alternative that additionally achieves the required compactness: flexible cir... View full abstract»

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  • Formulation and processing of novel conductive solution inks in continuous inkjet printing of 3-D electric circuits

    Publication Year: 2005, Page(s):265 - 273
    Cited by:  Papers (17)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3968 KB) | HTML iconHTML

    One of the greatest challenges for the inkjet printing electrical circuits is formulation and processing of conductive inks. In the present investigation, two different formulations of particle-free conductive solutions are introduced that are low in cost, easy to deposit, and possess good electrical properties. A novel aqueous solution consisting of silver nitrate and additives is initially descr... View full abstract»

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  • Formation of Pb/63Sn solder bumps using a solder droplet jetting method

    Publication Year: 2005, Page(s):274 - 281
    Cited by:  Papers (7)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1976 KB) | HTML iconHTML

    Formation processes of Pb/63Sn solder droplets using a solder droplet jetting have not been sufficiently reported. Solving problems such as satellite droplets and position errors are very important for a uniform bump size and reliable flip-chip solder bump formation process. First, this paper presents the optimization of jet conditions of Pb/63Sn solder droplets and the formation process of Pb/63S... View full abstract»

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  • Leading the field since 1884 [advertisement]

    Publication Year: 2005, Page(s): 282
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  • Join IEEE

    Publication Year: 2005, Page(s): 283
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  • Quality without compromise [advertisement]

    Publication Year: 2005, Page(s): 284
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  • IEEE Transactions on Advanced Packaging - Table of contents

    Publication Year: 2005, Page(s):285 - 286
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  • IEEE Transactions on Components and Packaging Technology - Table of contents

    Publication Year: 2005, Page(s):287 - 288
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2005, Page(s): c3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2005, Page(s): c4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University