IEEE Design & Test of Computers

Issue 3 • May-June 2005

Filter Results

Displaying Results 1 - 20 of 20
  • [Front cover]

    Publication Year: 2005, Page(s): c1
    Request permission for commercial reuse | |PDF file iconPDF (481 KB)
    Freely Available from IEEE
  • From the EIC: The other face of design for manufacturability

    Publication Year: 2005, Page(s): 193
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (81 KB) | HTML iconHTML

    The design-manufacturing interface (DMI) is one of the most critical junctions in the chip industry. For years, designers have debated the interplay of technologies on both sides of this interface. In this issue, D&T examines another current topic that deeply touches this interface: design for manufacturability (DFM). View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Table of contents

    Publication Year: 2005, Page(s):194 - 195
    Request permission for commercial reuse | |PDF file iconPDF (234 KB)
    Freely Available from IEEE
  • Masthead

    Publication Year: 2005, Page(s): 196
    Request permission for commercial reuse | |PDF file iconPDF (38 KB)
    Freely Available from IEEE
  • DAC Highlights

    Publication Year: 2005, Page(s):197 - 199
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (64 KB) | HTML iconHTML

    This year's Design Automation Conference represents the best of leading-edge industry practices and academic research across all IC and embedded-systems design technologies and methodologies. As cochairs of the technical program committee, we worked with more than 70 technical program committee members, reviewing more than 730 papers with hundreds of external reviewers, generating several thousand... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Guest Editors' Introduction: DFM Drives Changes in Design Flow

    Publication Year: 2005, Page(s):200 - 205
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (83 KB) | HTML iconHTML

    Design for manufacturability (DFM) has thus far been the focus of extensive study in the semiconductor industry. Although deep-submicron processes enable the manufacture of area-efficient, high-performance chips, navigating the nanometer landscape presents enormous manufacturability challenges. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Some thoughts on the IC design-manufacture interface

    Publication Year: 2005, Page(s):206 - 213
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (344 KB) | HTML iconHTML

    In the beginning, there were no design rules. Experts handling IC design and process development were knowledgeable in both disciplines. As circuit variety and complexity increased, a division of labor became necessary during the early 1970s. Since then, design rules have regulated the design-manufacture interface. These rules represent a compromise between designers, who often desire small, dense... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Yield-driven, false-path-aware clock skew scheduling

    Publication Year: 2005, Page(s):214 - 222
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (160 KB) | HTML iconHTML

    Semiconductor technology advances have enabled designers to integrate more functionality in a single chip. As design complexity increases, many new design techniques are developed to optimize chip area and power consumption, as well as performance. Traditionally, yield improvement has been achieved through process improvement. However, in deep-submicron technologies, process variations are difficu... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Value-added defect testing techniques

    Publication Year: 2005, Page(s):224 - 231
    Cited by:  Papers (9)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (344 KB) | HTML iconHTML

    In the transition from micrometer to nanometer technologies, many things have changed, but customer demands for low defects-per-million (DPM) failure rates have not. Modern electronic and mechanical systems contain an ever-increasing number of semiconductor components with each component containing ever-increasing gate counts per chip. With traditional quality levels, the reliability of these syst... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Infrastructure for successful BEOL yield ramp, transfer to manufacturing, and DFM characterization at 65 nm and below

    Publication Year: 2005, Page(s):232 - 239
    Cited by:  Papers (10)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (544 KB) | HTML iconHTML

    The challenges presented by deep-submicron interconnect back-end-of-line (BEOL) integration continue to grow in number, complexity, and required resolution at 90 nm and 65 nm. These challenges are causing industry-wide delays in technology deployment as well as low and often unstable yields. The historically observed improvements in time to successful yield ramp and final manufacturing yield as th... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • New test paradigms for yield and manufacturability

    Publication Year: 2005, Page(s):240 - 246
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (184 KB) | HTML iconHTML

    As CMOS technology continues its trend down the technology nodes through 90 nm to 14 nm, our industry faces the challenge of achieving necessary yield as we integrate more on-chip circuitry having more complex, advanced process technologies. These technologies are generally less scalable than in the past, which means we're involved in a completely new yield ramp almost every two years. Closing the... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Principles of sequential-equivalence verification

    Publication Year: 2005, Page(s):248 - 257
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (200 KB) | HTML iconHTML

    Traditionally, designers use simulation to check the functional equivalence of specification and implementation models. Although simulation can eliminate some or most design errors, it can never completely certify design correctness. Formal equivalence verification (FEV) is a viable alternative that has gained wide industrial acceptance. FEV, which uses automata theory and mathematical logic to fo... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Soft errors in advanced computer systems

    Publication Year: 2005, Page(s):258 - 266
    Cited by:  Papers (376)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (208 KB) | HTML iconHTML

    As the dimensions and operating voltages of computer electronics shrink to satisfy consumers' insatiable demand for higher density, greater functionality, and lower power consumption, sensitivity to radiation increases dramatically. In terrestrial applications, the predominant radiation issue is the soft error, whereby a single radiation event causes a data bit stored in a device to be corrupted u... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The future depends on innovation

    Publication Year: 2005, Page(s):268 - 279
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (232 KB) | HTML iconHTML

    Ken Wagner, IEEE Design & Tests interviews editor, spoke with Qualcomm's Irwin M. Jacobs during an in-depth interview discussion. D&T follows Jacobs' extraordinary career, from the radio location of America's trucks and automating Wal-Mart communications to creating and licensing what looks set to become the dominant cellular technology worldwide from Qualcomm. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Empowering the designer

    Publication Year: 2005, Page(s):280 - 281
    Request permission for commercial reuse | |PDF file iconPDF (79 KB) | HTML iconHTML
    Freely Available from IEEE
  • TTTC recognizes test visionary's lifetime contribution

    Publication Year: 2005, Page(s): 282
    Request permission for commercial reuse | |PDF file iconPDF (91 KB) | HTML iconHTML
    Full text access may be available. Click article title to sign in or learn about subscription options.
  • IEEE P1647 and P1800: two approaches to standardization and language design

    Publication Year: 2005, Page(s):283 - 285
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (95 KB) | HTML iconHTML

    Verification is currently the hot topic in EDA. The move to deep-submicron feature sizes in the latest IC designs has caused a paradigm shift, moving the emphasis from design to verification. Designers must create ICs with upwards of 50 million equivalent gates and still meet cost and time-to-market constraints. To do this, they are limiting new logic to a minimum and relying heavily on the reuse ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Design Automation Technical Committee Newsletter

    Publication Year: 2005, Page(s): 286
    Request permission for commercial reuse | |PDF file iconPDF (34 KB) | HTML iconHTML
    Freely Available from IEEE
  • Computer Society Information

    Publication Year: 2005, Page(s): 287
    Request permission for commercial reuse | |PDF file iconPDF (63 KB)
    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Design for manufacturability comes of age

    Publication Year: 2005, Page(s): 288
    Request permission for commercial reuse | |PDF file iconPDF (43 KB) | HTML iconHTML
    Full text access may be available. Click article title to sign in or learn about subscription options.

Aims & Scope

This Periodical ceased production in 2012. The current retitled publication is IEEE Design & Test.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
Krishnendu Chakrabarty