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IEEE Transactions on Electronics Packaging Manufacturing

Issue 1 • Date Jan. 2005

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  • [Front cover]

    Publication Year: 2005, Page(s): c1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2005, Page(s): c2
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  • Table of contents

    Publication Year: 2005, Page(s): 1
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  • Foreword Special Issue on Tin Whiskers

    Publication Year: 2005, Page(s): 2
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  • Tin whisker test standardization

    Publication Year: 2005, Page(s):3 - 9
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3104 KB) | HTML iconHTML

    A National Electronics Manufacturing Initiative (NEMI) Committee, Whisker Test Method Standardization, was formed in 2001 to evaluate and identify environmental test conditions that are useful in predicting the propensity for tin whisker growth. The objective of the committee is to develop standardized whisker testing methods to provide to the electronics industry for characterizing and qualifying... View full abstract»

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  • Whisker test methods of JEITA whisker growth mechanism for test methods

    Publication Year: 2005, Page(s):10 - 16
    Cited by:  Papers (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1040 KB) | HTML iconHTML

    As the industry moves toward lead-free electronics, a replacement for the traditional tin-lead plating is required. Pure tin is the coating of choice for many suppliers, but there is a well-known problem with the growth of tin whiskers. A whisker is comprised of a tin crystal which, after an incubation period, grows with time. Whiskers may grow long enough to cause shorts in electronic circuits. A... View full abstract»

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  • An integrated theory of whisker formation: the physical metallurgy of whisker formation and the role of internal stresses

    Publication Year: 2005, Page(s):17 - 30
    Cited by:  Papers (87)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3664 KB) | HTML iconHTML

    Over 50 years of whisker research (cadmium, zinc, and tin) has not resulted in consensus about whisker formation fundamentals for metal films. New analytical tools have recently provided new insights into microstructural changes that occur during whisker formation. Integration of these newer observations with historical data led the authors to propose an Integrated Theory of Whisker Formation. The... View full abstract»

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  • Driving force for the formation of Sn whiskers: compressive stress-pathways for its generation and remedies for its elimination and minimization

    Publication Year: 2005, Page(s):31 - 35
    Cited by:  Papers (51)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1896 KB) | HTML iconHTML

    Compressive stress is widely accepted as the driving force for tin whisker formation. There are several pathways for compressive stress buildup in Sn coatings, which include the following: residual stress generated during plating; stress formation due to interfacial reactions between tin and copper substrate; mechanical stress; and thermal mechanical stress due to coefficient of thermal expansion ... View full abstract»

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  • Sn whiskers: material, design, processing, and post-plate reflow effects and development of an overall phenomenological theory

    Publication Year: 2005, Page(s):36 - 62
    Cited by:  Papers (45)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (8912 KB) | HTML iconHTML

    Replacement of Pb/Sn terminations on electronic devices with pure Sn has proven to be much more difficult than expected. The main problem is Sn whisker formation. Sn whiskers are typically single-crystal, mechanically strong, metallic filaments that can nucleate and grow over time in such a way as to lead to device failure in the field. In this study, we present the results of Sn whisker formation... View full abstract»

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  • Role of intrinsic stresses in the phenomena of tin whiskers in electrical connectors

    Publication Year: 2005, Page(s):63 - 74
    Cited by:  Papers (32)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (5312 KB) | HTML iconHTML

    The connector industry is at a crossroads with respect to selecting lead-free coatings in response to legislation and customer demands. Component manufacturers have long used tin-lead coatings because of lead's ability to inhibit tin whisker formation. Several lead-free alternate finishes such as pure tin, tin-bismuth, tin-copper, tin-zinc, Pd, and Pd-Ni-Au have been proposed. One simple, economic... View full abstract»

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  • Electrostatic fields and current-flow impact on whisker growth

    Publication Year: 2005, Page(s):75 - 84
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (3112 KB) | HTML iconHTML

    Tin whisker growth is problematic due to the potential for short circuits in electronic devices. These devices are electrically active, generating electric fields, and transporting current. Controversy continues regarding the propensity for tin whiskers to grow more readily in the presence of an electrical bias, and other researchers have proposed that an electrical field can influence tin-whisker... View full abstract»

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  • Investigation of Sn-Cu intermetallic compounds by AFM: new aspects of the role of intermetallic compounds in whisker formation

    Publication Year: 2005, Page(s):85 - 93
    Cited by:  Papers (27)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2456 KB) | HTML iconHTML

    It has been observed that different tin whisker growth properties can result from the same tin deposit on two copper leadframe materials, C19400 and C70250. It was also found that modification of the surface condition of identical substrates, through pretreatment prior to Sn-plating, affects whisker growth behavior. Here, we report an atomic force microscopy (AFM) investigation of intermetallic co... View full abstract»

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  • Annotated tin whisker bibliography and anthology

    Publication Year: 2005, Page(s):94 - 122
    Cited by:  Papers (114)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (592 KB) | HTML iconHTML

    Whisker publications from 1947 through 2004 are summarized and referenced in this document. The bibliography listings are chronological (by publication year) while the anthology section arranges references by topic. Almost all of the referenced documents deal with tin whiskers, but there are few that deal with zinc whiskers. View full abstract»

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  • 7th Electronics Packaging Technology Conference (EPTC 2005)

    Publication Year: 2005, Page(s): 123
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  • Explore IEL IEEE's most comprehensive resource

    Publication Year: 2005, Page(s): 124
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  • Join IEEE

    Publication Year: 2005, Page(s): 125
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  • IEEE order form for reprints

    Publication Year: 2005, Page(s): 126
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  • IEEE Transactions on Advanced Packaging - Table of contents

    Publication Year: 2005, Page(s):127 - 128
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  • IEEE Transactions on Components and Packaging Technology - Table of contents

    Publication Year: 2005, Page(s):129 - 130
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  • IEEE copyright form

    Publication Year: 2005, Page(s):131 - 132
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2005, Page(s): c3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2005, Page(s): c4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University