IEE Review

Issue 12 • Dec. 2004

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Displaying Results 1 - 25 of 36
  • Cellphone operators form regional alliance

    Publication Year: 2004, Page(s): 20
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (454 KB)

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  • Careers

    Publication Year: 2004, Page(s): 61
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (442 KB)

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  • Market slowdown "is not a recession"

    Publication Year: 2004, Page(s): 14
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (458 KB)

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  • Got to get a packet or two [stacked multilayer chip assemblies]

    Publication Year: 2004, Page(s):40 - 43
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (638 KB)

    System in package (SiP), as it is being called, is a combination of two or more die stacked together on an interconnection substrate, all within a single package. Typically, there is some sort of processor chip coupled to either memory, a high-performance analogue IC, or to a micro-electro-mechanical system (MEMS) device. A SiP, though, could contain all these elements. This article discusses the ... View full abstract»

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  • Plastic-film scanner runs on daylight

    Publication Year: 2004, Page(s): 18
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (454 KB)

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  • Careers

    Publication Year: 2004, Page(s): 60
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  • Cash plea for green coal

    Publication Year: 2004, Page(s): 12
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  • Where next for the handset? [multiple wireless services in single device]

    Publication Year: 2004, Page(s):36 - 39
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (631 KB)

    There is a general belief that innovative wireless technologies are converging to meet a whole range of specific user demands, with new wireless standards transforming the capabilities of the ubiquitous mobile. This article examines some of the technologies which are going into the handset, which can then be seamlessly switched between. These include, wireless fidelity (Wi-Fi), UMTS (3G), GPRS (2.... View full abstract»

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  • Careers

    Publication Year: 2004, Page(s): 57
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (437 KB)

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  • Events

    Publication Year: 2004, Page(s):63 - 64
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  • Scaling down proves a strain

    Publication Year: 2004, Page(s): 16
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  • Careers

    Publication Year: 2004, Page(s): 59
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (458 KB)

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  • Announcement

    Publication Year: 2004, Page(s): 8
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (443 KB)

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  • Spin-out policy has a dizzy turn [spin-out company valuation tax]

    Publication Year: 2004, Page(s):24 - 25
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (507 KB)

    This article first outlines the current situation with respect to the valuation tax on university spin-out company formation. It then announces that academics have persuaded the government to reconsider tax changes that they say could stifle the commercial exploitation of UK research. View full abstract»

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  • Wild ride to Titan [Huygens space probe landing]

    Publication Year: 2004, Page(s):30 - 34
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (710 KB)

    A ground-breaking European spacecraft will be first to explore Saturn's largest moon. On 25 December, the Huygens space probe begins its 20-day descent towards the surface of Titan. This article outlines the construction of the descent probe and instruments carried, gives details of the mission, and speculates on the conditions that might be found. View full abstract»

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  • Careers

    Publication Year: 2004, Page(s): 56
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (451 KB)

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  • Gadgets

    Publication Year: 2004, Page(s):52 - 53
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  • Feed back - IEE Letters

    Publication Year: 2004, Page(s): 4
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  • Singapore sees trouble ahead for semicon firms

    Publication Year: 2004, Page(s): 21
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  • Announcement

    Publication Year: 2004, Page(s): 62
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  • Firms punt on casino growth

    Publication Year: 2004, Page(s): 15
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  • Tracking down the chip killers [IC design verification]

    Publication Year: 2004, Page(s):44 - 46
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (604 KB)

    As integration levels soar, formal methods are playing an increasing role in helping to crack the chip verification conundrum. This article considers the process of IC design, verification, simulation and test, with emphasis on formal verification and assertion methods. View full abstract»

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  • Careers

    Publication Year: 2004, Page(s): 58
    Cited by:  Papers (1)
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (462 KB)

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  • Announcement

    Publication Year: 2004, Page(s): 65
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  • Talk about a change [VoIP replacing PSTN]

    Publication Year: 2004
    IEEE is not the copyright holder of this material | Click to expandAbstract |PDF file iconPDF (457 KB)

    The rapid rise of Internet telephony services means that existing telecoms networks could soon be redundant. This paper examines the technological and financial issues concerning voice over Internet protocol (VoIP) and the probability of it substantially replacing existing public switched telephone networks (PSTN) within the next few years. View full abstract»

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Aims & Scope

Published from 1988-2006, IEE Review was the IEE's flagship magazine featuring analysis, news, innovation announcements, job advertisements and careers advice. The coverage was wide and aimed at professionals in all areas of engineering and technology, including the key industry sectors of communications, control and automation, electronics, management, IT, manufacturing and power.

Full Aims & Scope