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IEEE Transactions on Electronics Packaging Manufacturing

Issue 4 • Oct. 2004

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Displaying Results 1 - 13 of 13
  • Table of contents

    Publication Year: 2004, Page(s): c1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2004, Page(s): c2
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  • Foreword to the Special Section of the Asian Green Electronics Conference (AGEC)

    Publication Year: 2004, Page(s):213 - 214
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  • Business benefits from applied EcoDesign

    Publication Year: 2004, Page(s):215 - 220
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1256 KB) | HTML iconHTML

    This work describes the application of EcoDesign (environmentally conscious design) within the electronics manufacturing company Philips and how the process has matured from a case-by-case basis driven by single persons to becoming a standard part of the product creation process of most of Philips' business units. Since it was first introduced, the ecodesign process has gone through many changes, ... View full abstract»

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  • The impact of lead-free legislation exemptions on the electronics industry

    Publication Year: 2004, Page(s):221 - 232
    Cited by:  Papers (50)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (440 KB) | HTML iconHTML

    The European Union's Waste Electrical and Electronic Equipment legislation requires manufacturers to reduce the disposal waste of electronic products by reuse, recycling, and other forms of recovery. To enhance the possibilities and economic profitability of recycling, elimination of hazardous materials from the electrical and electronic equipments was proposed under the supplementary directive, t... View full abstract»

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  • Uncertainty estimation by Monte Carlo Simulation applied to life cycle inventory of cordless phones and microscale metallization Processes

    Publication Year: 2004, Page(s):233 - 245
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB) | HTML iconHTML

    This work focuses on uncertainty analysis, that is, how the input data uncertainty affects the output data uncertainty in small but realistic product systems. The motivation for the study is to apply the Monte Carlo simulation for uncertainty estimation in life cycle inventory and environmental assessment of microelectronics applications. The present paper addresses the question whether there is a... View full abstract»

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  • A fluxless flip-chip bonding for VCSEL arrays using silver-coated indium solder bumps

    Publication Year: 2004, Page(s):246 - 253
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2328 KB) | HTML iconHTML

    Alloys of lead-tin system are the most common solder alloys used today. However, there are environmental and health issues concerning the toxicity of lead present in these lead-tin solder alloys. Also, the flux residue removal is mandatory and leads to environmental threats. More importantly, the use of flux may contaminate the optically active surface by organic residue leftover, and a convention... View full abstract»

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  • Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives

    Publication Year: 2004, Page(s):254 - 259
    Cited by:  Papers (24)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1696 KB) | HTML iconHTML

    This work describes the work of an investigation of the effects of solder reflow process on the reliability of anisotropic conductive film (ACF) interconnection for flip-chip on flex (FCOF) applications. Experiments as well as computer modeling methods have been used. The results show that the contact resistance of ACF interconnections increases after the reflow and the magnitude of the increase i... View full abstract»

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  • IEEE Transactions on Advanced Packaging - table of contents

    Publication Year: 2004, Page(s): 260
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  • IEEE Transactions on Components and Packaging Technology - table of contents

    Publication Year: 2004, Page(s):261 - 262
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  • 2004 Index

    Publication Year: 2004, Page(s):263 - 268
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2004, Page(s): c3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2004, Page(s): c4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University