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Electronics Packaging Manufacturing, IEEE Transactions on

Issue 3 • Date July 2004

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Displaying Results 1 - 11 of 11
  • Table of contents

    Publication Year: 2004 , Page(s): c1
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  • IEEE Transactions on Electronics Packaging Manufacturing publication information

    Publication Year: 2004 , Page(s): c2
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  • Modeling of positive-displacement fluid dispensing processes

    Publication Year: 2004 , Page(s): 157 - 163
    Cited by:  Papers (13)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (608 KB) |  | HTML iconHTML  

    Dispensing has been widely used in industry to precisely control the delivery of fluid materials. Among several approaches, positive-displacement dispensing by employing the linear movement of a motor-driven piston is recognized as the most promising because the approach is assumed to be "true" volumetric dispensing. This is true for dispensing a large volume of fluid with continuous piston motion... View full abstract»

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  • The changing automotive environment: high-temperature electronics

    Publication Year: 2004 , Page(s): 164 - 176
    Cited by:  Papers (104)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1560 KB) |  | HTML iconHTML  

    The underhood automotive environment is harsh and current trends in the automotive electronics industry will be pushing the temperature envelope for electronic components. The desire to place engine control units on the engine and transmission control units either on or in the transmission will push the ambient temperature above 125°C. However, extreme cost pressures, increasing reliability de... View full abstract»

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  • Model-based integration of control and supervision for one kind of curing process

    Publication Year: 2004 , Page(s): 177 - 186
    Cited by:  Papers (10)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (544 KB) |  | HTML iconHTML  

    The optimization of the cure schedule for one kind of adhesive die-attach curing process in the electronics industry is very difficult to achieve due to the lack of tools for the online measurement of the extent of reaction adhesives during curing. In practice, the cure schedule is typically determined in a trial-and-error process, even though this is costly and may not guarantee the reliability o... View full abstract»

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  • Scheduling selective disassembly for plastics recovery in an electronics recycling center

    Publication Year: 2004 , Page(s): 187 - 197
    Cited by:  Papers (8)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (608 KB) |  | HTML iconHTML  

    High-value engineering plastics demand in the electronics industry reaches nearly 1.5 million tons annually. Since these plastics are derived from nonrenewable petroleum-based resources, research for scheduling of plastics-to-plastics recycling is warranted. Recent research has shown the feasibility of extending the reverse electronics supply chain, driven primarily by remanufacturing and metals r... View full abstract»

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  • Acoustic monitoring of electrochemical deposition

    Publication Year: 2004 , Page(s): 198 - 209
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (760 KB) |  | HTML iconHTML  

    In the microelectronics industry, manufacturers are concerned with increasing yield and reducing costs. Monitoring of unit manufacturing processes helps alleviate errors during fabrication, thereby increasing yield and ultimately decreasing cost. This work proposes an acoustic method for in-situ monitoring of electrochemical deposition. A micromachined acoustic sensor was developed for this purpos... View full abstract»

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  • IEEE Transactions on Advanced Packaging - table of contents

    Publication Year: 2004 , Page(s): 210
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  • IEEE Transactions on Components and Packaging Technology - table of contents

    Publication Year: 2004 , Page(s): 211 - 212
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information for authors

    Publication Year: 2004 , Page(s): c3
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  • IEEE Components, Packaging, and Manufacturing Technology Society Information

    Publication Year: 2004 , Page(s): c4
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Aims & Scope

IEEE Transactions on Electronics Packaging Manufacturing addresses design for manufacturability, cost and process modeling, process control and automation, factory analysis and improvement, information systems, statistical methods, environmentally friendly processing, and computer-integrated manufacturing for the production of electronic assemblies and products.

 

This Transaction ceased production in 2010. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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Meet Our Editors

Editor-in-Chief
R. Wayne Johnson
Auburn University