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IEEE Electrical Insulation Magazine

Issue 4 • Date July-Aug. 2004

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Displaying Results 1 - 25 of 31
  • IEEE Electrical Insulation Magazine - Front cover

    Publication Year: 2004, Page(s): 0_1
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  • Electrical Manufacturing Expo 04

    Publication Year: 2004, Page(s): 0_2
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  • IEEE Electrical Insulation Magazine Table of contents

    Publication Year: 2004, Page(s): 1
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  • IEEE Electrical Insulation Magazine Society Information

    Publication Year: 2004, Page(s): 2
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  • Duo-career track - Editorial

    Publication Year: 2004, Page(s): 3
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  • From the Editor's desk

    Publication Year: 2004, Page(s):4 - 5
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  • Condition assessment of distribution PILC cables from electrical, chemical, and dielectric measurements

    Publication Year: 2004, Page(s):6 - 12
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (702 KB) | HTML iconHTML

    A study was conducted to evaluate some new diagnostic techniques enabling users to effectively manage their paper-insulated, lead-covered (PILC) cable assets. The objective is to present the results obtained with four diagnostic techniques designed for use on in-service cables, but used only to a limited extent on PILC cables. These techniques are LIpATEST leakage current test method, isothermal r... View full abstract»

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  • The role of inorganic fillers in silicone rubber for outdoor insulation alumina tri-hydrate or silica

    Publication Year: 2004, Page(s):13 - 21
    Cited by:  Papers (48)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1568 KB) | HTML iconHTML

    A systematic study to understand how alumina tri-hydrate (ATH) and silica fillers improve the erosion resistance of silicone rubber during dry band arcing showed that the thermal conductivity of the resulting composite material is the main criterion governing material erosion. The thermal conductivity of the composite material is dependent on the thermal conductivity, concentration, particle size,... View full abstract»

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  • A rational consideration of space charge

    Publication Year: 2004, Page(s):22 - 27
    Cited by:  Papers (24)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (304 KB) | HTML iconHTML

    Space charge formation and its increase with field under DC conditions is not a mystical phenomenon. The increase in space charge with applied field is an obvious and inevitable result of the interaction of field-dependent current density with spatially inhomogeneous resistivity. For common polymeric dielectrics, the current density makes a transition from a linear function of field to an exponent... View full abstract»

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  • Inside EIC

    Publication Year: 2004, Page(s):28 - 30
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  • EME/EIC Volunteers

    Publication Year: 2004, Page(s): 31
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  • DEIS News

    Publication Year: 2004, Page(s):32 - 35
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  • Call for Papers for Workshops/Focus Group Discussions During DEIS-Sponsored Conferences in 2005

    Publication Year: 2004, Page(s): 36
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  • Industry News

    Publication Year: 2004, Page(s):37 - 38
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  • D&EI Folks - Takeshi Sakakibara

    Publication Year: 2004, Page(s): 39
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  • New magnet wire requirements on the horizon - NEMA News

    Publication Year: 2004, Page(s): 40
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  • Recent activities of Japan Electric Cable Technology Center - News from Japan

    Publication Year: 2004, Page(s):41 - 42
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  • The third international nanotechnology exhibition & conference was held in Tokyo - News from Japan

    Publication Year: 2004, Page(s):43 - 44
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  • Protection devices and systems for high-voltage applications - Book Review

    Publication Year: 2004, Page(s): 45
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  • Introduction to geometrical optics - Book Review

    Publication Year: 2004, Page(s): 45
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  • Plastics additives - volume 3 - an industry guide, 3rd Ed. - Book Review

    Publication Year: 2004, Page(s):45 - 46
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  • Annual review of physical chemistry, vol. 53 - Book Review

    Publication Year: 2004, Page(s): 46
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  • MEMS and NEMS - systems, devices, and structures

    Publication Year: 2004, Page(s): 46
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  • Annual reviews of materials research, vol. 32 - Book Review

    Publication Year: 2004, Page(s): 46
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  • Chip scale packaging for modern electronics - Book Review

    Publication Year: 2004, Page(s): 47
    Cited by:  Papers (2)
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Aims & Scope

The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions.

Full Aims & Scope

Meet Our Editors

Co-Editor-in-Chief
Edward Cherney

Co-Editor-in-Chief
Robert Fleming