Issue 2 • Date June 2004
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[Front cover]
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PDF (92 KB)
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IEEE Transactions on Device and Materials Reliability publication information
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PDF (32 KB)
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Table of contents
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PDF (45 KB)
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Rapid die heating for low-stress die attach
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PDF (560 KB)
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Initiation and propagation of delaminations at the underfill/passivation interface relevant to flip-chip assemblies
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PDF (528 KB)
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Mechanics of thin films and microdevices
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PDF (776 KB)
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Statistical study for electromigration reliability in dual-damascene Cu interconnects
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PDF (616 KB)
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The effect of thermal treatment on device characteristic and reliability for sub-100-nm CMOSFETs
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PDF (416 KB)
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High holding voltage cascoded LVTSCR structures for 5.5-V tolerant ESD protection clamps
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PDF (944 KB)
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Physical limitation of the cascoded snapback NMOS ESD protection capability due to the non-uniform turn-off
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PDF (880 KB)
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Theoretical and experimental study on junction temperature of packaged Fabry-Perot laser diode
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PDF (264 KB)
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Special Issue of T-DMR on Thermal Management for Reliability
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PDF (96 KB)
Aims & Scope
IEEE Transactions on Device and Materials Reliability provides leading edge information that is critical to the creation of reliable electronic devices and materials, and a focus for interdisciplinary communication in the state of the art of reliability of electronic devices, and the materials used in their manufacture.
Meet Our Editors
Editor-in-Chief
Anthony S. Oates
Taiwan Semiconductor Mfg Co.


