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Circuits and Devices Magazine, IEEE

Issue 6 • Date Nov. 2002

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Displaying Results 1 - 12 of 12
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  • New trends in optical network design and modeling [Book Reviews]

    Page(s): 37
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    Freely Available from IEEE
  • Electronics and communications for scientists and engineers [Book Reviews]

    Page(s): 37 - 38
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    Freely Available from IEEE
  • Low temperature electronics [Book Reviews]

    Page(s): 38
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    Freely Available from IEEE
  • Photodetectors and fiber optics [Book Reviews]

    Page(s): 38 - 39
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    Freely Available from IEEE
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  • Wireless marketing

    Page(s): 39 - 40
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (265 KB)  

    First Page of the Article
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  • Tera Tool [terahertz time-domain spectroscopy]

    Page(s): 23 - 28
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (624 KB) |  | HTML iconHTML  

    The terahertz differential time-domain spectroscopic method is applied to characterize the dielectric and optical properties of a variety of thin films at terahertz frequency. The results of several samples including silicon dioxide, parylene-n polymer film, tantalum oxide film, and protein thin layer samples were presented. The dielectric property of silicon dioxide thin film is well fitted to that of a bulk. The dielectric properties of parylene-n thin films show good agreement with the result measured by the goniometric terahertz time-domain spectroscopy. The dielectric and optical properties of the tantalum oxide show reasonable data with previously available data. Some properties in thin films are slightly different from the bulk materials. The origin of this discrepancy is considered due to fine grain formation, mechanical stresses, formation of interfacial layers, or rough interfaces during thin-film deposition process. The terahertz differential time-domain spectroscopy may be applied to the measurement of the dielectric and optical properties of thin films (nanometer to micrometer) of several materials, which cannot be done by any other method. View full abstract»

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  • A robust CMOS Bluetooth radio/modem system-on-chip

    Page(s): 7 - 16
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (312 KB) |  | HTML iconHTML  

    The relaxed constraints on Bluetooth RF front-end implementation, together with the requirement of frequency hopping, result in a frequency offset and drift elimination or reduction problem. In the Spirea Bluetooth radio solution BlueTraC, a scalable digital demodulator is used, which gives a flexible, fast, and tunable frequency adjusting implementation. To increase the dynamic range the existing transmit chain is used to tune the LO during receive mode. View full abstract»

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  • Demonstrating a bright future [optoelectronic demonstrators]

    Page(s): 17 - 22
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    Reviewed the technologies behind two successful optoelectronic demonstrator systems. These demonstrators show that the optics-in-computing technologies are reaching a level of sophistication where their deployment in "real-world" computing/networking environments becomes increasingly likely. The primary requirements for the successful transfer of these technologies from the laboratory to the "real world" are larger, more uniform arrays of the optoelectronic devices and highly stable optical and optomechanical assemblies. The advent of high-efficiency, low-power consumption arrays of oxide-confined VCSELs has reduced the overall optical complexity of these demonstrators with subsequent gains in the mechanical stability of these optical systems. Although at present the maximum array size of VCSELs that is readily available is 8 × 8, there is, in principle, no reason why larger arrays cannot be developed. In tandem with these developments, the design and fabrication of micro-optical elements has reached the stage where they can be regarded as the standard optoelectronic interconnection method. Micro-optical optoelectronic system demonstrators show that optics-in-computing interconnection technologies are nearing real-world readiness. View full abstract»

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  • Modeling ferroelectric capacitors for memory applications

    Page(s): 10 - 16
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    The ferroelectric capacitor model is the foundation for accurate simulation of ferroelectric hysteresis loops and minor loops, transitions between the loops under arbitrary voltage patterns, transient responses of ferroelectric capacitors to short voltage pulses with widths in the nano-second range, and temperature behaviors of ferroelectric capacitors. The simulation speed is the same as that for a typical nonlinear capacitor. To the circuit designers, a ferroelectric capacitor is represented as a two-port device like a capacitor. The parameters are extracted easily and reliably by curve fitting the measured hysteresis loops. The model is applicable to fast circuit simulations for large ferroelectric memory designs. View full abstract»

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  • Model quality needs to be job one [circuit CAD]

    Page(s): 29 - 35
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (814 KB) |  | HTML iconHTML  

    A SPICE model is a tool for circuit designers to design their chip. As the design activity shifts from purely digital to increasingly analog/RF applications, an accurate model with smooth device characteristics becomes essential. BSIM3 gains popularity because of its capability to meet these challenges. As CMOS processing evolves and various tunneling/leakage currents begin to surface, companies are exploring BSIM4 for their immediate future use. Regardless of which model is selected, the entire QA flow must be executed before a model is released to the design community. The four essential steps are to ensure 1) there is no kink in the conductance and capacitance calculated in the model; 2) the process specifications are reflected in the model; 3) the trend of various parameters make sense as a function of channel width, length, and device temperature; and finally, 4) the figure of merit from simulating the benchmark circuit is consistent with previous models. View full abstract»

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Aims & Scope

IEEE Circuits and Devices Magazine (1985-2006) covers the design, implementation, packaging, and manufacture of micro-electronic and photonic devices, circuits and systems

 

This Magazine ceased publication in 2006.

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Meet Our Editors

Editor-in-Chief
Dr. Ronald W. Waynant
r.waynant@ieee.org