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IEEE Transactions on Semiconductor Manufacturing

Issue 2 • Date May 1991

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Displaying Results 1 - 9 of 9
  • Statistical experimental design in plasma etch modeling

    Publication Year: 1991, Page(s):83 - 98
    Cited by:  Papers (48)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (952 KB)

    The objective of this work is to obtain a comprehensive set of empirical models for plasma etch rates, uniformity, selectivity, and anisotropy. These models accurately represent the behavior of a specific piece of equipment under a wide range of etch recipes, thus making them ideal for manufacturing and diagnostic purposes. The response characteristics of a CCl4-based plasma process use... View full abstract»

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  • Manufacturability issues in rapid thermal chemical vapor deposition

    Publication Year: 1991, Page(s):155 - 165
    Cited by:  Papers (20)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1136 KB)

    Rapid thermal processing (RTP) has been considered from a manufacturing point of view as a potential technology for depositing thin films by low-pressure chemical vapor deposition (LPCVD) in a single-wafer manufacturing environment. The results of this study suggest that new chemical processes must be developed to satisfy the throughput requirements of single-wafer manufacturing and the demands of... View full abstract»

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  • Process control system for VLSI fabrication

    Publication Year: 1991, Page(s):134 - 144
    Cited by:  Papers (47)  |  Patents (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1060 KB)

    A modular framework for the implementation of process control in VLSI fabrication is described. The system integrates existing approaches to process control with new methodologies in order to achieve online optimization and control of unit processes with consideration of preceding and following process steps. The process control system is based on three core modules. The flexible recipe generator ... View full abstract»

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  • Dynamic batching heuristic for simultaneous processing

    Publication Year: 1991, Page(s):77 - 82
    Cited by:  Papers (129)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (456 KB)

    This study focuses on computer integrated manufacturing as a means of supporting real-time resource allocation decisions in the semiconductor industry. Two general questions are addressed: (1) how can be global current state of the factory, which would be available in a computer integrated manufacturing system, be summarized into information for decisions? and (2) how much improvement might be exp... View full abstract»

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  • Modeling the bending of probes used in semiconductor industry

    Publication Year: 1991, Page(s):122 - 127
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (468 KB)

    An analytical model for the bending of probes used in the semiconductor industry is presented. It is shown that tip sliding distance is twice as large as was previously believed. This difference is shown to be caused by the beam curvature, which increases the angle between the tip and the vertical and pushes the tip forward. The model uses the probe shape and the material elastic properties to est... View full abstract»

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  • A magnetic levitation transport path

    Publication Year: 1991, Page(s):145 - 154
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (812 KB)

    A magnetic levitation transport path particularly suitable for moving objects in clean environments, such as for the transportation of wafers in clean rooms, is described. The present transport path is a demonstration system and is not designed for a specific application. It demonstrates the feasibility of applying a microcomputer-controlled magnetic field to generate linear motion of a carrier wi... View full abstract»

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  • Modeling optical equipment for wafer alignment and line-width measurement

    Publication Year: 1991, Page(s):99 - 110
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1004 KB)

    A methodology is presented for modeling a wide variety of optical metrology equipment currently utilized in integrated circuit manufacturing. These tools include steppers for wafer alignment and optical microscopes for linewidth measurement. Rigorous models have been developed to facilitate this task, and the simulator METRO, based on these models, has been implemented. By utilizing this simulator... View full abstract»

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  • A low damage, low contaminant plasma processing system utilizing energy clean technology

    Publication Year: 1991, Page(s):111 - 121
    Cited by:  Papers (10)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (972 KB)

    A plasma processing system for ULSI device manufacturing using energy clean technology is proposed that is capable of subtle control of ion impact energy under very low pressure and magnetron enhancement. Careful and extensive probe measurements were carried out to determine the effects of magnetic field, plasma excitation frequency, DC-biasing of plasma confining cylinder (shield), DC-biasing of ... View full abstract»

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  • Transmission measurements of pellicles for deep-UV lithography

    Publication Year: 1991, Page(s):128 - 133
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (464 KB)

    Candidate deep-UV pellicle materials were tested for transmission stability under deep-UV exposure. Measurements were made with an exposure apparatus using a KrF excimer laser and a light pipe illuminator. Increased absorption and thickness reduction caused by deep-UV exposure were found in polyvinyl butyral (PVB)-based pellicles. The thickness of the PVB pellicles was monitored in situ, and a dar... View full abstract»

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Aims & Scope

The IEEE Transactions on Semiconductor Manufacturing addresses the challenging problems of manufacturing complex microelectronic components.

Full Aims & Scope

Meet Our Editors

Editor-in-Chief

Anthony Muscat
Department of Chemical and Environmental Engineering
Harshbarger Bldg., Room 134
1133 E. James Rogers Way
University of Arizona
Tucson, AZ  85721