Issue 1 • Date Mar 1991
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Displaying Results 1 - 25 of 38
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Effect of contact material on the extinction of vacuum arcs under line frequency and high frequency conditions
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PDF (492 KB)
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Thick film resistors for AlN ceramics
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PDF (420 KB)
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Modification in the microstructure of materials with air-break switching at high currents
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PDF (1504 KB)
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A Weibull model to characterize lifetimes of aluminum alloy electrical wire connections
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PDF (660 KB)
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Physical interpretations concerning nonlinear conductivity phenomena across no-load switching contacts
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PDF (584 KB)
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Phenomena preceding arc ignition between opening contacts: experimental study and theoretical approach
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PDF (444 KB)
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On the application of W/Cu materials in the fields of power engineering and plasma technology
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PDF (808 KB)
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Normal force reduction in electronic circuits
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PDF (408 KB)
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A particle ejection mechanism for brushwear
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PDF (568 KB)
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Conduction in failing aluminum connections
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PDF (512 KB)
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Some investigations on slow and fast arc voltage fluctuations for contact materials proceeding in various gases and direct current
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PDF (372 KB)
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Temperature cycling effects between Sn/Pb solder and thick film Pd/Ag conductor metallization
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PDF (544 KB)
Aims & Scope
IEEE Transactions on Components, Hybrids, and Manufacturing Technology was published 1978-1993. The latest title for this publication is IEEE Transactions on Advanced Packaging.


