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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 4 • Date December 1986

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Displaying Results 1 - 25 of 32
  • Foreword

    Publication Year: 1986, Page(s): 327
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    Freely Available from IEEE
  • Fatigue of 60/40 Solder

    Publication Year: 1986, Page(s):423 - 432
    Cited by:  Papers (190)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1656 KB)

    Plastic strain versus fatigue life data are presented for tests run at -- 50, 35, 125, and 150°C. It was found that these data could be correlated by the Coffin-Manson fatigue law, with an exponent of approximately 0.5 for the tests run at -35°C to 125°C. At 150°C the exponent was reduced to 0.37. These results were obtained for plastic strain limited tests. Different results a... View full abstract»

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  • Translucent A1N Ceramic Substrate

    Publication Year: 1986, Page(s):386 - 390
    Cited by:  Papers (47)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1128 KB)

    A translucent aluminum nitride (AlN) substrate has recently come into the market which has a thermal conductivity of 140 W/mK at room temperature and 130 W/mK at 100°C, eight times that of alumina (Al2O3) and one-half to two-thirds that of beryllia (BeO). Its excellent electrical and mechanical properties as well as inherent light transmitting property ensure that the ne... View full abstract»

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  • Rapidly Solidified Soft Solder Die-Attach Technology

    Publication Year: 1986, Page(s):416 - 422
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1368 KB)

    Soft solders used in the die-attach of power packages are prone to fatigue failure. Conventionally east soft solders typically contain nonhomogeneous Phases and organics. Failure analysis usually shows extensive voids, cracks, and segregation of metals in the die-attach medium, which leads to increased thermal resistance and catastrophic failure during power cycling. Soft solders manufactured via ... View full abstract»

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  • Die Attach Evaluation Using Test Chips Containing Localized Temperature Measurement Diodes

    Publication Year: 1986, Page(s):410 - 415
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (928 KB)

    The die attach related problems of lifting and die cracking become more critical with increasing size of integrated circuit (IC) devices. For this reason, a thermal test utilizing specialized chips and an automated system has been designed for the evaluation of large die attach integrity. Both void detection and statistical characterization of sample populations are possible. While an actual estim... View full abstract»

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  • Aluminum Alloy Package for Microwave Amplifier

    Publication Year: 1986, Page(s):513 - 517
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    A study of hermetic sealing methods for a general-use Al alloy package for a microwave amplifier with increased output power and lighter weight is described. To solder the glass insulated terminals to the Al alloy case hermetically, using commercial Pb-Sn solder, we propose a unique "local plating method"--Ni plating inside the terminal holes of the case. In this method, Ni plating 2-4/um thick is... View full abstract»

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  • Surge Current Failure in Solid Electrolyte Tantalum Capacitors

    Publication Year: 1986, Page(s):475 - 479
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1024 KB)

    Fast charging and discharging of solid tantalum capacitors causes breakdown by heating in the MuO2cathode instead of dielectric breakdown. It appears that localized regions of lower resistance and poor thermal contact to a heat sink allow very high temperatures to occur. These "hot spots" can then cause breakdown of the adjacent dielectric film and, eventually, loss of the capacitor. Te... View full abstract»

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  • On Using Strain Gauges in Electronic Assemblies When Temperature Is Not Constant

    Publication Year: 1986, Page(s):492 - 497
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (856 KB)

    In a previous paper we presented this equation for processing strain gauge readings when the temperature is changing:E = Egauge reading-Eapparent strain+Estandard material Second-order corrections to this equation are presented, and the size of the corrections and their uncertainties are estimated. Included are measurements on NBS standard reference materials (Cu a... View full abstract»

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  • A Mechanism for Board Warpage by Thermal Expansion of Surface Mounted Connector

    Publication Year: 1986, Page(s):508 - 512
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (520 KB)

    A mechanism of printed circuit (PC) board warpage caused by a thermal mismatch between a surface mounted connector and a PC board is demonstrated. Both the increase and the decrease in temperature enlarge the space between the PC board and the surface mounted (SM) connector. Basically four nondimensional parameters control this mechanism. They are the thermal strain mismatch, the ratio of bending ... View full abstract»

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  • Polyimide - Substrate Bonding Studies Using \gamma -APS Coupling Agent

    Publication Year: 1986, Page(s):364 - 369
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (936 KB)

    Application of polyimides in microelectronics fabrication for interlevel dielectric, passivation, or device isolation requires that the polymer films maintain interface integrity with a variety of surfaces at high temperature and during solvent processing. y-aminopropyltriethoxy-silane (y-APS) in aqueous solution is the most commonly employed adhesion promoter for the bonding of polyimides to inor... View full abstract»

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  • Charge Carriers and Time Dependent Currents in BaTiO3-Based Ceramic

    Publication Year: 1986, Page(s):469 - 474
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (736 KB)

    The following items are treated for BaTiO3-based ceramic and multilayer ceramic (MLC) capacitors: type of charge carrier, mode of transport, and time dependence of conductivity during degradation. For a specific X7R-type ceramic, the charge carrier is verified to be the electron by several independent measurements. Seebeck voltages are negative; Galvanic voltages are zero; leakage curre... View full abstract»

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  • A Low Cost Lead Frame Techonology for Automated Laser Packaging

    Publication Year: 1986, Page(s):455 - 457
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (664 KB)

    The current price of packaged high quality 1.3 um lasers for lightwave communications makes them prohibitively expensive for local applications. To demonstrate a way of reducing this high price a laser mount has been designed and fabricated using an inherently inexpensive stamping process. The design is adaptable for automated bonding testing and accelerated aging, which promises significant furth... View full abstract»

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  • Comparison of the Stability of Gold and Palladium Alloy Connector Contacts Subjected to Vibration

    Publication Year: 1986, Page(s):480 - 484
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (760 KB)

    Printed wiring board connector contacts utilizing gold and various palladium based alloys have been subjected to vibration testing to accelerate degradation caused by fretting or frictional polymer formation. The resistance of each contact was measured before the test and at various intervals throughout the test. The results show that the contacts with the maximum gold content are the most stable ... View full abstract»

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  • Composite- Type pin Grid Array package

    Publication Year: 1986, Page(s):336 - 340
    Cited by:  Papers (2)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1008 KB)

    A composite pin grid array (PGA) package was developed. This package is composed of the base, the polyimide film with the wiring paths of copper, and the cap. An attractive feature of this package is its electrical performance. Moreover, this package is suitable both for customization and for mass production at relatively low cost with reduced lead time from design to production. View full abstract»

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  • Solder Connections with a Ni Barrier

    Publication Year: 1986, Page(s):433 - 439
    Cited by:  Papers (3)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1400 KB)

    Copper-tin intermetallic compounds readily form when tin-bearing solder connections are made to copper surfaces. These compounds continue to grow during the life of solder connections and represent potentially weak interfaces. An investigation was undertaken to determine if a diffusion barrier between the solder and copper would inhibit Cu-Sn intermetallic compound formation and thereby extend joi... View full abstract»

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  • Electrical Properties of Cr - Al Alloy Thin Films

    Publication Year: 1986, Page(s):391 - 395
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    Electrical properties of Cr-Al alloy thin films which were deposited on 96-percent alumina substrates by using resistance-heated evaporation have been investigated. The resistivity of the thin films took a maximum value (2.2 x 10-5 ... View full abstract»

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  • Signature Analysis of Dispatch Schemes in Wafer Fabrication

    Publication Year: 1986, Page(s):518 - 525
    Cited by:  Papers (19)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1120 KB)

    Signature analysis is used to characterize lot dispatch priority schemes in wafer fabrication, a complex manufacturing operation. A number of idealized dispatch schemes are evaluated using a comprehensive assessment criterion. The production system analyzed in this paper is large in comparison to previous studies on manufacturing scheduling. Real dispatch schemes depend strongly on the characteris... View full abstract»

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  • Signature Analysis: Simulation of Inventory, Cycle Time, and Throughput Trade-Offs in Wafer Fabrication

    Publication Year: 1986, Page(s):498 - 507
    Cited by:  Papers (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1448 KB)

    Signature analysis provides a powerful heuristic method for the planning of simulation experiments and for the interpretation of simulation results. Signature analysis has been developed within the context of simulation of the dynamics of wafer fabrication operations in integrated circuit manufacturing. Graphical display of cycle time, throughput, and inventory provides a "signature" of the dynami... View full abstract»

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  • Reliability of Metallized Ceramic/Polyimide Substrates

    Publication Year: 1986, Page(s):396 - 402
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (904 KB)

    A new packaging technology has been developed to allow increased switching speeds, lower noise levels, and increased circuit density. The package consists of a ceramic substrate with two layers of copper circuitry separated by a polyimide layer. Extensive accelerated stress testing was performed on the chip carrier to determine the reliability exposures. We found no dielectric or interlayer failur... View full abstract»

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  • Noncontact Bent Pin Detection Using Laser Diffraction

    Publication Year: 1986, Page(s):458 - 463
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    The use of optical diffraction is investigated to detect bent pins on a high-density multi-chip integrated-circuit module as an intermediate step in a robotic assembly process. A fixed laser beam shines on a fixed optical array while the robot moves the pins of the module through the beam at four different orientations. (While two scans are mathematically adequate, four scans are required because ... View full abstract»

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  • Multilythics - A New Circuit Technology

    Publication Year: 1986, Page(s):341 - 346
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (872 KB)

    A process which combines the functional versatility of thick-film materials with the complexity and integrity of multilayer co-fired manufacturing was developed. This process allows us to integrate many passive functions into the "substrate" itself. The exterior surface of the device then needs only support active devices, special components like crystal oscillators, and devices requiring precisio... View full abstract»

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  • Fiber Optic Components

    Publication Year: 1986, Page(s):440 - 449
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    A review of the development of fiber optic components is given. Both single-mode and multimode technologies are addressed. Performance comparisons between various components are presented. View full abstract»

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  • Thermal Characteristics of Plastic Small Outline Transistor (SOT) Packages

    Publication Year: 1986, Page(s):353 - 363
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1720 KB)

    Surface mount plastic packages, including small outline transistor (SOT), small outline integrated circuit (SOIC), and plastic leaded chip carrier (PLCC), are projected to be the next generation replacement for plastic dual in-line packages (DIP's). Relative to DIP's, surface mount packages are small in size and allow higher package density on a hoard, leading to higher electrical speed for system... View full abstract»

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  • VLSI Packaging Technique Using Liquid-Cooled Channels

    Publication Year: 1986, Page(s):328 - 335
    Cited by:  Papers (40)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1280 KB)

    A new packaging technique which employs innovative indirect liquid cooling is described. The technique involves mounting very large-scale integrated (VLSI) chips on a multilayered alumina substrate which incorporates very fine coolant channels. In particular, an investigation into the optimal structure for the cooling section by computer simulation and by experiment involving the physical implemen... View full abstract»

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  • Current-Leakage Failures in Hybrid Microcircuits

    Publication Year: 1986, Page(s):403 - 409
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1544 KB)

    Electrical failures due to excessive current leakage have been observed in several hybrids during both hot and cold temperature testing. Failures have been correlated with increased amounts of ionic and gaseous contamination in the package. Short-term failures at cold temperature appeared to be due to ammonia (from the substrate-attach epoxy) condensing on the substrate and acting as a conductive ... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope