By Topic

Component Parts, IRE Transactions on

Issue 2 • Date Jun 1961

Filter Results

Displaying Results 1 - 8 of 8
  • Polycarbonates as Capacitor Dielectrics

    Page(s): 89 - 93
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (608 KB)  

    Polycarbonates have interesting possibilities as materials for capacitor films. In mechanical and electrical properties, polycarbonates fall generally between polystyrene and Mylar, and possess an unusually low temperature coefficient of dielectric constant. They can be cast from solvent and can be metallized; hence, they are adaptable to lacquer film techniques. This paper reports a preliminary evaluation of polycarbonates as capacitor dielectrics. Further work needs to be done on optimizing composition, molecular weight, and chemical purities. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The Oxidation of Sputtered Tantalum Films and Its Relationship to the Stability of the Electrical Resistance of These Films

    Page(s): 51 - 56
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1072 KB)  

    A study of the oxidation of sputtered tantalum films was carried out to help explain the changes in electrical resistance of such films when heated in air at 100°C. A microbalance was used to obtain the oxidation data over a range of temperatures from 100-600°C in pure oxygen at a pressure of 7.6 cm of Hg. The electrical resistance of films was measured over a temperature range up to 200°C. Some results were also obtained when heating was carried out in a vacuum of 10--6mm of Hg. From a consideration of the oxidation data and the electrical resistance data, it appears that oxidative effects based on a simple model of oxide film formation do not play a major role in affecting the stability of the electrical resistance of the films under the test conditions. Oxidative effects at grain boundaries may have more of an influence. However, structural changes, not yet characterized, may be equally important in accounting for the resistance changes. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Titanium Printed Capacitors for Microminiaturization

    Page(s): 80 - 83
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (576 KB)  

    It is shown in this paper that by an appropriate cleaning and forming procedure titanium metal can be anodically oxidized to a low leakage current, which makes it possible to use this material for capacitor fabrication. Experimental data are given for the metal/oxide/metal thin-film capacitor. A new "printing" technique especially suited for the fabrication of film capacitors in printed microminiaturized electronic circuits is described for the forming of the dielectric oxide layer. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The Controlled Superconductor as a Linear Amplifier

    Page(s): 84 - 88
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (640 KB)  

    The use of controlled superconducting devices in linear amplifier applications is discussed. Static characteristics are presented and the location of the cut-off regions is developed. Linear equivalent circuits are developed for the low-frequency case. Several amplifier circuits are discussed. The theoretical efficiencies of controlled-superconductor amplifiers are determined for various classes of operation. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A Survey of Semiconductor Materials Technology

    Page(s): 65 - 69
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (456 KB)  

    A survey of the techniques used in the preparation and evaluation of semiconductor materials is presented. The various processes for the preparation and growth of crystals are described, and an outline of their relative merits is given. Crystalgrowth records must be maintained to permit control of yield from subsequent manufacturing processes. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Characterization of Magnetic Switch Cores

    Page(s): 45 - 50
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (872 KB)  

    The time rate of change of flux and the change in flux methods of characterizing magnetic switch cores are reviewed and related to a mathematical flux reversal model. The relationships of the two methods are developed and discussed. Finally, the unifying concepts of time average current and electric charge are shown to be important in relating core characteristics to actual circuit application. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Electrohydrodynamic Components

    Page(s): 57 - 64
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1360 KB)  

    Motion of unipolar ions in insulating liquids creates strong coupling between electrical and hydrodynamic systems energy. This permits us to pump liquids directly with electrical power or to build up electrical energy from liquid motion. The phenomenon has been used to build high-impedance electrohydrodynamic components such as switches, relays, voltage regulators, voltage generators and dc transformers. Their principle of operation will be discussed, first-order approximation theories will be given, and a number of research models will be described. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Integrated Thin-Film Circuits

    Page(s): 70 - 79
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1544 KB)  

    This paper describes the fabrication of microminiaturized circuitry using sputtered metals. Experiments proved that it was possible, with special techniques, to use a photosensitive resist (Kodak Metal Etch Resist) as a masking medium for the deposition of circuit components with accurate dimensions. In this instance, a single metal (tantalum) was used to form the passive components. The high sheet resistivity of stable tantalum films permits the fabrication of small resistors, while two-dimensional capacitors can be formed from anodically oxidized tantalum films. This facilitates a unfied approach to microminiaturization. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.

Aims & Scope

This Transaction ceased production in 1962. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope