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IEEE Transactions on Parts, Hybrids, and Packaging

Issue 4 • Date December 1971

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Displaying Results 1 - 6 of 6
  • Who's Who in G-PHP

    Publication Year: 1971, Page(s): 140
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    Freely Available from IEEE
  • Properties of Hafnium Dioxide Thin-Film Capacitors

    Publication Year: 1971, Page(s):141 - 147
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1048 KB)

    Dielectric films of anodically formed HfO2based on Hf films of different degrees of orientation as well as reactively sputtered HfO2films were studied. The anodic oxide grown on oriented Hf films and the reactively sputtered HfO2films were monoclinic and showed partial orientation with the View full abstract»

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  • Twisted Magnet Wire Transmission Line

    Publication Year: 1971, Page(s):148 - 154
    Cited by:  Papers (4)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (608 KB)

    Transmission line principles are applied to twisted magnet wire lines made of two wires to establish design limits. Expressions are developed to predict the effects of wire film insulation and of twisting. A design procedure is developed to realize a desired characteristic impedance for the design of radio frequency broad-band transformers, signal combiners, and pulse transformers. View full abstract»

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  • Process Limitations in the Design of Distributed RC Networks

    Publication Year: 1971, Page(s):163 - 167
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (536 KB)

    The design of thin-film distributed RC networks is discussed briefly and a chart is presented that greatly facilitates the initial design procedure. This chart is then used to demonstrate the limitations imposed upon minimum usable frequency by space availability, maximum sheet resistance, and maximum capacitance density. View full abstract»

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  • Computer Simulation of the Thermal Environment of Large-Scale Integrated Circuits: Computer Time-Saving Techniques

    Publication Year: 1971, Page(s):168 - 172
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (656 KB)

    This paper is concerned with the computer costs for both the steady-state and transient thermal responses of large-scale integrated circuits (LSI) when metal is present within the substrate. For the more cost-sensitive transient case, an extrapolation technique for computer time savings is compared with the accuracy loss in this study. This approach could be useful for design-cost planning. View full abstract»

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  • Corrosive Effects of Solder Flux on Printed-Circuit Boards

    Publication Year: 1971, Page(s):155 - 162
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1120 KB)

    A number of tactical radio sets have been reported inoperable as a result of lead breakage of transistor and quartz crystals. The lead material was a KovarTM-type iron-nickel-cobalt glass sealing alloy (54 percent Fe-29 percent Ni-17 percent Co). The location and type of fractures indicated that these leads failed by stress-corrosion cracking. Such failures result from the combined effe... View full abstract»

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Aims & Scope

This Transaction ceased production in 1977. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope