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Product Engineering and Production, IEEE Transactions on

Issue 4 • Date September 1963

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Displaying Results 1 - 9 of 9
  • Thin Film Packaging and Interconnections: The Development of a Packaging Philosophy

    Publication Year: 1963 , Page(s): 47 - 50
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  • Thermal Design and Analog Representation of a Thermoelectric Refrigerator

    Publication Year: 1963 , Page(s): 51 - 62
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  • Preparation of Actual-Size Printed Wiring Layouts

    Publication Year: 1963 , Page(s): 24 - 28
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    Difficulties encountered in maintaining accurate registraion between layers of multilayer printed wiring cards has resulted in a method of preparing artwork actual size instead of by the usual enlarged artwork-photoreduction procedure. Fundamental to the approach is the fact that precise placement of lands, or pads, is more important than exact positioning of etched conductors: Accurate (±0.001 in) land location is assured by jig-boring land-size holes in sheet metal (Invar) and contact printing the hole pattern (lands) onto a glass photographic plate. Conductor paths are added using narrow (0.016 in min) black crepe printed-wiring layout tape. Presstype transfer letters and numbers are added as required for titles or identification. Final artwork is formed by proJection-printing the composite artwork onto another photographic plate using collimated light. Laboratory use of the technique has been successful in eliminating registration difficulties with 8 in x 15 in multilayer printed-wired cards. View full abstract»

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  • A Practical Approach to Product Design Engineering

    Publication Year: 1963 , Page(s): 8 - 15
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    Product Design Engineering performs tasks of ever increasing importance in the electronic industry. The problem of staffing this engineering function increases proportionally. The functions of Product Design Engineering are reviewed and practical means of staffing are discussed. Special attention is given to a proper organizational structure. View full abstract»

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  • Electronic Packaging Techniques for Surveyor Lunar Spacecraft

    Publication Year: 1963 , Page(s): 38 - 46
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    . Several of the major packaging techniques and design methods used for electronics portions of the Surveyor spacecraft are presented. Descriptions are given of a typical electronic unit as it will appear on the spacecraft. View full abstract»

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  • Ferrite Machining

    Publication Year: 1963 , Page(s): 63 - 71
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    Different machining techniques for ferrite materials are discussed. Green or unfired ferrite pressed together with a waxlike binder, allows the use of existing machine tools in shaping the material. Chemical etching methods for green ferrite are also possible. Abrasive techniques for finished ferrites make possible automated machining methods with low initial and operating costs. Flexible, simple, and economical machining of ferrite is needed if the designer is to shape ferrite according to his calculated modes and not vice versa. Machining details and preparation of materials are summarized in attached Tables. Photographs, drawings, and graphs are included for visual explanation of the various machining operations View full abstract»

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  • Welding of Electronic Modules for the Polaris Missile

    Publication Year: 1963 , Page(s): 1 - 7
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    Some time ago the potential value of welding electronic modules was recognized. An investigation was authorized to locate and solve the problems which would be encountered Jf this technique were to be applied to the electronic modules. This paper summarizes the status of findings to date, the number of problems still under investigation, and other subjects requiring study. Preparations have been made for the first production application of welding electronic modules. A welding specification OS 11889 has been released. This specification states the requirements of suitable welding machines and the criteria for certifying weld schedules and in-process and final inspection. Preliminary weld schedules have been developed which meet the broad requirements of the specification. The thousands of welds made and tested during the development of these schedules have served to field test the requirements and related conditions to current experience in industry. The investigations offer evidence that nickel, Dumet, and Kovar are weldable lead materials to nickel interconnecting media. To meet standards, separate weld schedules are required for each material size; moreover, variations in material composition and temper must be limited. Continuing study of other essential aspects of the problems are being pursued. View full abstract»

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  • Picture-Tube Improvement through Controlled Manufacturing Environment and Ultrasonic Cleaning Technologies

    Publication Year: 1963 , Page(s): 29 - 37
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    . The trend toward higher-voltage picture-tube operation requires basic improvements in manufacturing techniques. The threshold of high-voltage instability characteristics of modern picture tubes cannot be increased significantly by design without adversely affecting focus and other performance characteristics. A practical technique of increasing the threshold of highvoltage instability by about 6 kv has been developed by means of extensive revisions of the picture-tube electron-gun manufacturing processes. Reduction of arcing, stray emission, neck fluorescence, and interelectrode shorts and leakages has resulted from the use of ultrasonic cleaning processes and "clean" environments. A precision method of controlling the grid-to-cathode spacing to improve the control of cut-off voltages has been developed. The physical geometry and relatively small size of picture-tube gun components required extensive investigations to determine the most efficient application of ultrasonic cleaning techniques, application of precision-controlled cathodegride 1 assembly technique, effective materials handling and storage methods, and a system for the protection of completed guns from particulate contamination. Concepts of environmental "whiteroom" nature were employed to house the program adequately. The extensive revisions to the picture-tube manufacturing processes and the new equipment and facilities at the RCA, Marion, Ind., plant are described. The performance of picture tubes has been improved continuously during the past few years as a result of improvements in high-voltage stability; reduction of interelectrode leakage; increased cathode emission, stability, and reliability; and the introduction of techniques related to focus quality. The solutions to these problems prompted detailed considerations of all factors affecting the picture tube, particularly gun processing and environmental controls during manufacturing. RCA, in the Marion, Ind., plant, has developed a new "total concept' approach to the solution of f Electron Tube Division, RCA, Marion, /rid. these problems based on a micro-clean processing program designed to produced economically manufactured electron guns properly processed for maximum reliability, View full abstract»

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  • Sources of Information for Electronic Product Engineers

    Publication Year: 1963 , Page(s): 16 - 23
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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope