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Product Engineering and Production, IEEE Transactions on

Issue 3 • Date July 1963

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Displaying Results 1 - 6 of 6
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  • Miniaturized Wire Wrap

    Page(s): 12 - 19
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    Miniaturization and micro-miniaturization are key words that are often heard in the electronic industry today. The increasing frequency of these terms reflects the growing importance attached to the reduction in size, of logic and power components used for data processing applications. In fact, miniaturization is now a primary project of many scientific research teams throughout the industry. The success of these projects is evidenced by the wide variety of small, smaller, and ultra-small computer components presently available. However, one aspect of the miniaturization program that has not kept pace with the primary effort, is the aspect of inter-component connections. There still exists in this area, a serious problem of developing and implementing an electrical communications scheme that can function between components of increasingly greater logical density. This paper proposes an effective connection scheme based on the "solderless wire wrap" technique. View full abstract»

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  • Production Techniques for Integrated Electronics

    Page(s): 20 - 32
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    Integrated components made by using thin film and semiconductor techniques have an important part in the design and fabrication of physically smaller, more reliable electronic systems. The general processes of materials preparation, metallizing, circuit pattern formation, materials modification, pattern modification, lead attachment and protection are presented for both thin film and semiconductor integrated components. Comparative evaluation indicates that a combination of the two technologies will be used to meet the requirements of the sixties. View full abstract»

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  • Product Reliability through Integrated Packaging and Handling

    Page(s): 1 - 11
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    Space Scientists and Engineers are under continuing pressure to establish increasingly rigid performance parameters in product design. The ever changing technical "state of the art" of space products dictates companion changes in the "state of the art" of supporting technical endeavors such as industrial engineering. One vital area in which industrial engineering must react in close concert with technical changes is material handling and packaging engineering. Material handling and packaging engineers must devise techniques, devices and systems to protect product performance parameters. In many instances, elements of the space industry have used a piecemeal approach to solve protective packaging and handling problems - with piecemeal results. A practical concept is needed to enable application of optimum industrial engineering to problems related to protection of space product reliability. This concept embraces recognition that space product manufacturers are part of a vast invention complex - and that this complex, in turn, is nothing more or less than an involved material flow. Accordingly, to enhance chances of space products to reliably perform; thoroughly integrated, cradle-to-grave protective packaging and handling systems and programs must be devised to cover every segment of the material flow - from raw materials to consumption. The manner of adoption of this concept by Lockheed's Missiles and Space Company and its efforts to bring to fruition practical results is presented. View full abstract»

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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