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Product Engineering and Production, IEEE Transactions on

Issue 2 • Date April 1963

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Displaying Results 1 - 5 of 5
  • Industrial Audio-Visual Applications

    Page(s): 10 - 15
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  • Electron Beam Cutting Techniques for Electronic Applications

    Page(s): 16 - 27
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    The advantages of electron beam cutting are outlined. Specific production applications of these cutting techniques to electronic packaging are discussed in detail. Examples presented include: the etching of micro components; the scribing of thin films; the drilling and cutting of precision holes and slots in ceramic components; and the use of the electron beam cutter as a salvage tool. View full abstract»

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  • Elephantine Electronics --- A New Circuit Packaging Problem

    Page(s): 1 - 9
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    Very high voltage-high power electronic equipment packaging techniques present new and unique problems in the field of product engineering and packaging. New electronic systems in this category consist of a number of subunits, but all of the systems utilize a high voltage power supply as the basic unit. In the case of conventional electronic systems, the power supply components have standard shapes and are packaged in accepted configurations. Components performing these same functions in high voltage high power supplies, deviate tremendously from the norm. The power transformer may occupy the same space as a weekend cabin, the filter capacitors may be as large as a railroad car, the rectifiers may give the impression of factory chimney stacks. For reasons of size alone these components require special structural considerations. For reasons of their high voltage-high power operation they also require special configuration considerations. The packaging of equipment in this category involves the packaging of bulky components into an assembly, while considering ease of construction, ease of transportation and the ease of removal of components for maintenance purposes. The components along with the hardware utilized for the support structure, must then constitute a package that provides the most economical utilization of space, and at the same time, provide voltage clearances that may be several orders of magnitude greater than those normally encountered when packaging lower voltage components. In general, this equipment is not contained within a cabinet or rack as is normal in lower voltage circuitry. These equipments usually utilize one or more buildings either in existence or specially designed and constructed for the purpose. Consequently, considerable thought must be given to operator convenience and human engineering. The packaging, integration and manufacturing of a typical system including operational, safety and maintenance considerations will be described. View full abstract»

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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