Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Issue 4 • Date December 1984
Society Sponsor
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Displaying Results 1 - 22 of 22
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Foreword
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PDF (112 KB)
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Laser Polysilicon Link Making
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PDF (592 KB)
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Gold-Aluminum Intermetallics: Ball Bond Shear Testing and Thin Film Reaction Couples
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PDF (1448 KB)
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High Speed and High Resolution Contact-Type Image Sensor Using an Amorphous Silicon Photodetector Array
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PDF (824 KB)
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Gaseous Cleaning Beneath Surface Mounted Components: Evaluation Using a Beam Lead Test Chip
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PDF (1264 KB)
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High Speed and High Resolution ISO A4 Size Amorphous Si:H Contact Linear Image Sensor
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PDF (688 KB)
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The Measurement of Flux Residues from Chip Carrier Attachment and Their Effect On Other Thick Film Hybrid Components
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PDF (2376 KB)
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Aluminum Nitride-An Alternative Ceramic Substrate for High Power Applications in Microcircuits
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PDF (1048 KB)
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Cast Leads for Surface Attachment
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PDF (1304 KB)
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Forces, Moments, and Displacements During Thermal Chamber Cycling of Leadless Ceramic Chip Carriers Soldered to Printed Boards
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PDF (1848 KB)
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Leakage Currents in Multilayer Ceramic Capacitors
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PDF (1560 KB)
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A Field Study of Connector Reliability
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PDF (1168 KB)
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Solder Fatigue Problems in Power Packages
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PDF (960 KB)
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Effect of Fretting on the Contact Resistance of Palladium Electroplate Having a Gold Flash, Cobalt-Gold Electroplate, and DG R156
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PDF (1760 KB)
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Aims & Scope
IEEE Transactions on Components, Hybrids, and Manufacturing Technology was published 1978-1993. The latest title for this publication is IEEE Transactions on Advanced Packaging.
