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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 3 • Date September 1984

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Displaying Results 1 - 15 of 15
  • Editorial

    Publication Year: 1984, Page(s):209 - 210
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    Freely Available from IEEE
  • Gas Cooling Enhancement Technology for Integrated Circuit Chips

    Publication Year: 1984, Page(s):286 - 293
    Cited by:  Papers (5)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1128 KB)

    New approaches are described for increasing the capability of forced gas convection cooling for integrated circuit chips, using an enhanced heat transfer technique and a higher gas flow velocity in a closed-cycle flow. A turbulence promoting fin with low pressure loss has been developed and enhancement of the heat transfer coefficient using gas flow velocities up to 50 m/s is examined using air an... View full abstract»

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  • Development of 16 dots/mm Thermal Printing Head

    Publication Year: 1984, Page(s):294 - 298
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1088 KB)

    The development of a high-speed thermal printing head with a resolution of 16 dots/ram is described. Main features of the present study are as follows. 1) A meander shaped heating resistor is suitable for high-resolution printing and has a life of more than 2 X l08pulses at the applied pulse width of 0.8 ms. 2) The deterioration characteristic of the meander shaped heating resistor depe... View full abstract»

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  • Technical Progress as a Result of the Entropy Law

    Publication Year: 1984, Page(s):211 - 214
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    The purpose is to investigate the origin o! technical progress as a result of the entropy law, to find its limitations, and to discover its best use. View full abstract»

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  • Management's Role in Planning the Automated Factory

    Publication Year: 1984, Page(s):215 - 217
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (448 KB)

    The potential for competitive advantage from an automated factory is of concern to all business managers. A description is given as to how one may go about planning for factory automation. Starting with the business objectives, it leads through development of a supporting manufacturing strategy, and on to preparation of an automation strategy. View full abstract»

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  • Modeling FMS by Closed Queuing Network Analysis Methods

    Publication Year: 1984, Page(s):241 - 248
    Cited by:  Papers (6)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (984 KB)

    The problem of scheduling concurrent lots of different components on a flexible manufacturing system (FMS) structured with a closed transportation network is approached. The production model and hence the decision/control process is seen here decomposed in two hierarchical levels. 1) At the lowest (microscopic) level, with a heuristic closed queuing network analysis, the average throughputs of the... View full abstract»

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  • Successful Factory Automation

    Publication Year: 1984, Page(s):218 - 224
    Cited by:  Papers (1)
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    The manufacturing environment has changed. The world-wide competitive pressures along with the availability of automated equipment have caused businesses to embrace the new technologies. However it is only through a thorough understanding of the business needs that a plan can be developed and implemented which will result in successful automation. View full abstract»

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  • A Further Study on the Microstructure of Glass-Bonded Ag Thick-Film Conductors

    Publication Year: 1984, Page(s):281 - 285
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (864 KB)

    The sintering and microstructure development of glassbonded Ag thick-film conductors have been studied with special emphasis on the effects of glass-Ag ratio, film thickness, and substrate material. Techniques employed are dilatometry, microscopy, and electron probe microanalysis (EPMA). The variation of surface silver concentration has been well correlated with the microstructure, and the experim... View full abstract»

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  • Interconnection Costs of Various Substrates-The Myth of Cheap Wire

    Publication Year: 1984, Page(s):261 - 263
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    Silicon has always been considered a dense and cheap medium for making wires, especially when compared with traditional interconnection media on a per interconnection basis. However interconnection costs in all technologies are essentially invariant on a per unit length basis. The advancing scale of integration has allowed active devices to be smaller and closer together, so wiring, both on chip a... View full abstract»

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  • A New Silicone Gel Sealing Mechanism for High Reliability Encapsulation

    Publication Year: 1984, Page(s):249 - 256
    Cited by:  Papers (15)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2184 KB)

    Plastic molded packages for large-scale integrated (LSI) devices are widely utilized for low-cost computer equipment. The environmental reliability of conventional plastic molded packages, however, is inferior to the reliability of hermetically sealed ceramic packages. A sealing mechanism for the chip, using a silicone jelly as an encapsulation, is discussed. View full abstract»

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  • Estimating the Strength of Annular Glass-to-Metal Seals in Microelectronic Packages: An Experimental Study

    Publication Year: 1984, Page(s):276 - 280
    Cited by:  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (944 KB)

    The resistance of annular glass-to-metal seals, in microelectronic packages, to a sudden change in temperature is tested through the thermal shock test. In order to predict or evaluate the failure of the seal under thermal shock, the strength of the seal has to be known. A lower bound for the strength of such seals is evaluated by subjecting samples made of a circular lead sealed to a TO-8 eyelet ... View full abstract»

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  • New Packaging Strategy to Reduce System Costs

    Publication Year: 1984, Page(s):257 - 260
    Cited by:  Papers (1)  |  Patents (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (984 KB)

    Packaging density for mid-sized computers, personal computers, and other cost-performance equipment has been limited by the need to use available interface or "glue" circuit chips. This makes the system and circuit boards DIP dominated, with a continuing lower circuit density than achieved by bigger main frame systems. Using the percent active silicon area yardstick, various multichip package stre... View full abstract»

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  • Humidity Control in Accelerated Life Tests

    Publication Year: 1984, Page(s):268 - 275
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    The humidity-controlled environments over certain saturated salt solutions used for accelerated temperature-humidity life testing have been more accurately characterized. Measurements of relative humidity were made for seven salt solutions at four temperatures: 25, 50, 60, and 80°C. Variations in the experimental test environment were caused by temperature fluctuations and the approach toward... View full abstract»

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  • Heat Transfer of Fine-Wire Fuse

    Publication Year: 1984, Page(s):264 - 267
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (584 KB)

    The thermal analysis, by hand calculation and computer, of the experimental data of fine-wire fuse "sealed" (in air) in tiny tube shows that the heat transfer through the air around the fine wire is the dominant heat loss mechanism. Even at the melting point of nickel, 1454°C, the radiation loss from a fine wire amounts to about ten percent of the total power loss and becomes comparable to th... View full abstract»

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  • Performance of Hierarchical Production Scheduling Policy

    Publication Year: 1984, Page(s):225 - 240
    Cited by:  Papers (38)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2016 KB)

    The performance of Kimemia and Gershwin's hierarchical scheduling scheme for flexible manufacturing systems, as enhanced by Gershwin, Akella, and Choong, is described. This method calculates times at which to dispatch parts into a system in a way that limits the disruptive effects of such disturbances as machine failures. Simulation results based on a detailed model of an IBM printed circuit card ... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope