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Component Parts, IRE Transactions on

Issue 3 • Date September 1959

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Displaying Results 1 - 10 of 10
  • Trend of things to come

    Publication Year: 1959 , Page(s): 144 - 149
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  • Capacitors - 1959

    Publication Year: 1959 , Page(s): 150 - 174
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    Any discussion on the state of the art on such a broad subject as capacitors must by necessity Ibe somewhat sketchy. As many writers have pointed out, a capacitor is a relatively simple device; and because of its simplicity, its purpose can be achieved in many ways and with many materials. In this discussion I shall limit myself primarily to those constructions and materials which are now in production and which are be!.ng used in sufficient quantities to make their inclusion in any survey of economic importance. Some of the types are used only in Europe, while some types are used only in this country. The chronological comparisons that will be made will go back about forty years, Many of the capacitors used today were used at that time. No attemot will be made to determine just when during this period any of thesle capacitors came into existence. Also, only general characteristics will be given, since the number of various types is so great that it would require much more time than is alloted to me to discuss them. This discussion will attempt to cover two aspects of the art. One is based on materials and processes. The second is based on the evolution of the capacitor as indicated by the development of military specifications. View full abstract»

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  • A Practical, Comprehensive Component Application Program

    Publication Year: 1959 , Page(s): 190 - 192
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  • Army Electronics Research: Theory to Reality

    Publication Year: 1959 , Page(s): 193 - 200
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  • An analysis of printed wire connectors

    Publication Year: 1959 , Page(s): 223 - 235
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  • Electronic Materials-an Industry-Wide Problem

    Publication Year: 1959 , Page(s): 175 - 179
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    After a review of the reasons for the current emphasis on electronic materials, both in civilian industry and in the military, the government-area sponsored research and development program in this is reviewed and its basic objectives outlined. A brief discussion of probable long-term investigations in the area of electronic materials is followed by a listing of immediate materials requirements based on specific recommendations of qualified representatives of the Army, Navy, and Air Force. Emphasis throughout the paper is directed at the need for close cooperation between industry and the military, and two procedures--one conventional and obvious, and the second of a less conventional nature--are proposed as avenues leading toward an improvement in the current materials situation. View full abstract»

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  • Progress Report on Ad Hoc Study on Parts Specifications Management for Reliability

    Publication Year: 1959 , Page(s): 128 - 143
    Cited by:  Papers (2)
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    This paper is a progress report on the Ad Hoc Study on Electronic Parts and Tubes Specification Management for Reliability Jointly sponsored by the Offices of the Assistant Secretaries of Defense (Research and Engineering)* and (Supply and Logistics). The basic objective of this study is to analyzer the recommendations established by the Advisory Group on Reliability of Electronic Equipment (AGREE) Task Group 5 in order to advise the, Assistant Secretaries of Defense (Research and Engineering)* end (Supply and Logistics) regaining efficient implementation methods and procedures. This study will cover the following areas relative to electronic parts and tubes: (a) Specification of reliability of parts and tubes in terms of failure rate as a function of time and the test procedures and plans for determining compliance with the level specified; (b) Survey of methods used in preparation and coordination of parts and tubes specifications; (c) Review of the Qualification Approval Testing requirements and procedures; (d) Adequacy of test requirements with respect to reliability requirements and quality control procedures; (3) Program for exchange of technical charaoteristics and test data on parts and tubes; (f) Methodology for development and dissemination of design guide or parts application data including failure rate curves or data as a function of circuit application severity level and enviroment. View full abstract»

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  • A Review of the Influence of Recent Material and Technique Development on Transformer Design

    Publication Year: 1959 , Page(s): 201 - 209
    Cited by:  Papers (1)
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    The requirements for greater miniaturization, higher operating temperature capability, and better moisture protection have resulted in the development of new constructional techniques for electronic transformers. The developments in application of new materials and techniques are detailed. Among the new developments discussed are the application of fluorochemicals to transformers designed for maximum coil temperatures of 200°C.; the philosophy of "controlled environment" for the insulation system through the application of inert gases for transformers designed for maximum coil temperatures of 3S0°C. , and the application of epoxies to the molded coil encapsulated transformer. View full abstract»

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  • Improvements Made in Electronic Parts During the Past Ten Years

    Publication Year: 1959 , Page(s): 210 - 222
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    Since other presentations of this conference will cover the different electronic parts areas, this paper is limited to the improvements made in the general areas of resistors, transmission lines, mechtronics and relays. Changing environments along with the demand for improved performance, smaller size and longer life have been the motivating factors in bringing about electronic part improvements. Briefly these environmental changes are listed in Figure 1. It should be noted that there is a considerable spread in some of these conditions - as for example - temperature. This is because some electronic equipments are subjected to different environments than others and parts fulfilling these requirements may be so vastly different in size, cost and quantity requirements that it would be impracticable, for example, to use a 500°C component for all lower temperature appli- cations. View full abstract»

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  • Uniform Cooling Air Flow During Computer Maintenance and Operation.

    Publication Year: 1959 , Page(s): 180 - 189
    Cited by:  Patents (3)
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    Many designs have recently evolved for cooling digital equipments. The Sylvania Waltham Laboratories, in building the Universal Digital Operational Flight Trainer, UDOFT, has developed a cooling method applicable to many systems. Every designer is faced with the dilemma of obtaining an optimum balance between ease of testing finished equipment and ease of construction testing of the first engineering system. In the cooling plan used in UDOFT, both types of test work as well as system operation maintenance can be accomplished without disturbing the air-flow path over the many small plug-in packages which contain the computer circuitry. Any package, or all packages, can be removed from their respective slots and all remaining packages will still receive the same constant air supply. This is accomplished without any moving flow-control devices and without gasketing seals. The hot-spot temperature of the electron tubes and other heat sensitive parts is controlled by maintaining a known, fixed air flow through each individual package. This arrangement provides optimum thermal control of the system, thereby improving both component and total system reliability. View full abstract»

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Aims & Scope

This Transaction ceased production in 1962. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope