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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 3 • Date September 1983

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Displaying Results 1 - 20 of 20
  • Editorial

    Publication Year: 1983, Page(s): 225
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    Freely Available from IEEE
  • Guest Editor's Comments

    Publication Year: 1983, Page(s): 226
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    Freely Available from IEEE
  • Improved Electrical Performance Required for Future MOS Packaging

    Publication Year: 1983, Page(s):283 - 289
    Cited by:  Papers (16)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1024 KB)

    High speed integrated circuit (IC) families and the demands which these devices place on interconnection and power systems are compared, concluding that new materials, components, and packaging techniques are required to provide a nonlimiting electrical environment for high performance systems using metal-oxide semiconductor (MOS) technologies. View full abstract»

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  • Electrical Design of a High Speed Computer Packaging System

    Publication Year: 1983, Page(s):272 - 282
    Cited by:  Papers (18)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1624 KB)

    A methodology for optimizing the design of an electrical packaging system for a high speed computer is described The pertinent parameters are first defined and their sensitivities are derived so that the proper design trade-offs can ultimately be made. From this procedure, a set of rules is generated for driving a computer-aided design (CAD) system. Finally there is a discussion of design optimiza... View full abstract»

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  • High Thermal Conduction Package Technology for Flip Chip Devices

    Publication Year: 1983, Page(s):267 - 271
    Cited by:  Papers (6)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (800 KB)

    The technology of new packages with high thermal conduction performance, simplified structure, and also high reliability for flip chip devices is described. In order to obtain high thermal conduction, a thermal conduction plate is individually bonded to the back surface of a large-scale integrated (LSI) chip by soft solder and is arranged in close proximity to the inner surface of the cap, when th... View full abstract»

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  • Quality Control Techniques for "Zero Defects"

    Publication Year: 1983, Page(s):323 - 328
    Cited by:  Papers (83)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    Everyone is being exposed to the "zero defects" philosophy which establishes zero as a goal. This will not be achieved overnight but approached over time by continually striving to reduce targets. What kind of techniques are needed to assure zero defects? What constitutes an out-of-control situation? An attributes control chart conveys little information at or near zero defects. Assuring zero defe... View full abstract»

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  • Analysis of Surface Mount Thermal and Thermal Stress Performance

    Publication Year: 1983, Page(s):257 - 266
    Cited by:  Papers (29)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1688 KB)

    Ongoing analysis of leadless ceramic devices surface mounted to epoxy-glass is described. Finite element (FE) model results for thermal resistance as a function of airspeed, carrier size and spacing, and heatsinking are given. An overview of the thermal stress problem, emphasizing fatigue test design, is presented. The rationales used in choosing thermal cycle amplitudes, methods of heat transfer,... View full abstract»

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  • Thermal Studies on Pin Grid Array Packages for High Density LSI and VLSI Logic Circuits

    Publication Year: 1983, Page(s):246 - 256
    Cited by:  Papers (25)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1504 KB)

    The highest speed silicon logic chips are currently made using the emitter coupled logic (ECL) bipolar technology which inherently dissipates more power than other logic families. Recent developments include a macrocell array (MCA 2TM) logic chip dissipating up to 12 W of power over 0.47 cm2and there are plans to develop a technology chip dissipating 10 W of power over an are... View full abstract»

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  • Shallow Doping in Silicon

    Publication Year: 1983, Page(s):309 - 313
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (744 KB)

    In recent years liquid-state diffusion by laser melting has been instituted in device manufacture; and annealing of doped polysilicon and ion implantation damage by various lasers and incoherent radiation sources have been investigated. Continuous wave (CW) laser annealing was shown to be superior in the reduction of polysilicon sheet resistance due to increase in grain size. Incoherent radiation ... View full abstract»

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  • The Effect of High Dissipation Components on the Solder Joints of Ceramic Chip Carriers Attached to Thick Film Alumina Substrates

    Publication Year: 1983, Page(s):237 - 245
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2432 KB)

    The effects of power cycling and powered high temperature storage on chip carriers solder attached to thick film alumina substrates are compared with those of conventional temperature cycling and high temperature storage. Although the high temperature storage tests gave a similar deterioration in torque strength compared with unstressed controls, power cycling produced dramatically lower values th... View full abstract»

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  • Optical Coupling in Fiber Optics Packages with Surface Emitting LED's

    Publication Year: 1983, Page(s):334 - 342
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1624 KB)

    The optical coupling performance of two fiber optics emitter packaging styles is determined into five large-core-diameter [ \geq 100 µm) optical fibers with varying numerical apertures (NA). One package contains a short fiber coupled to a high index spherical lens positioned accurately between the LED and the fiber. The other package is fiberless, utili... View full abstract»

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  • A New Chip Carrier for High Performance Applications: Integrated Decoupling Capacitor Chip Carrier (IDCCC)

    Publication Year: 1983, Page(s):290 - 297
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1144 KB)

    The impact of inductance has rarely been considered in semiconductor Packaging. This is the reason for using the capacitor in the first place: it is a small, local energy reservoir for those current transients which cannot go back to the power supply without causing unacceptahly large voltage drops (V = L di/dt). Since 1978 a new chip carrier with integrated deeoupling capacitor (IDCCC) has been s... View full abstract»

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  • Design of a High Performance DIP-Like Pin Array Package for Logic Devices

    Publication Year: 1983, Page(s):305 - 308
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (856 KB)

    Pin array packages offer package sizes which are much smaller than their dual in-line package (DIP) equivalent. Pin array packages are also through hole mountable. A pin array package is described which is DIP-like in that it is rectangular but the input/ output (I/O) pins do not fully populate its base. The package is a co-fired tungsten metallized multilayer ceramic package with 104 I/O's yet is... View full abstract»

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  • Structural Characterization of Processed Silicon Wafers

    Publication Year: 1983, Page(s):314 - 322
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2608 KB)

    Two techniques, chemical etching and X-ray diffraction, for the characterization of process-induced defects in silicon wafers are illustrated. The types of etchants used to reveal various defects are reviewed. The use of a Lang camera for the measurements Of bulk defects and mechanical stress in silicon wafers is presented. Examples are given demonstrating the use of these two techniques: to monit... View full abstract»

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  • Direct Attachment of Leadless Chip Carriers to Organic Matrix Printed Wiring Boards

    Publication Year: 1983, Page(s):227 - 231
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1352 KB)

    A test program was performed that compares the reliability of various leadless chip carrier (LCC) solder joint configurations under conditions of temperature cycling from -55 to +125°C. Since there is a coefficient of thermal expansion mismatch between the ceramic body of the LCC (6 ppm/°C) and that of an epoxy-glass printed wiring board (15 ppm/°C), it was of interest to determine ... View full abstract»

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  • Corrosion of Gold-Coated Contact Materials Exposed to Humid Atmospheres Containing Low Concentrations of SO2and NO2

    Publication Year: 1983, Page(s):349 - 355
    Cited by:  Papers (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1008 KB)

    Corrosive atmospheres containing SO2, NO2, and SO2+ NO2(NO2:0.5, SO2:0.6 ppm) have been investigated and their corrosive effects on gold-plated brass were studied. The thickness of the gold coating was 0.3, 1.0, or 2.0 µm. Corrosive gas atmosphere containing NO2(0.5 ppm) caused corrosion sites already at low relative... View full abstract»

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  • High Pinout IC Packaging and the Density Advantage of Surface Mounting

    Publication Year: 1983, Page(s):298 - 304
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (752 KB)

    The packaging industry has been addressing the high pinout integrated circuit (IC) packaging issue in recent years. The specific solutions adopted have varied on a case by case basis and appear to he based on meeting a combination of objectives: 1) meeting needs with a workable short term evolution of the current packaging technology, and 2) consistency with long term objectives. The former is usu... View full abstract»

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  • Focused Ion Beams in Microelectronic Fabrication

    Publication Year: 1983, Page(s):329 - 333
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    For more than 20 years the designers and fabricators of integrated circuits and microstructure devices have strived toward smaller features as a means of achieving higher packing density, better performance, and lower cost. The new field of microlithography has emerged as a result of these pressures. The results of these efforts are a wide array of advanced development and production techniques us... View full abstract»

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  • Fatigue Life of Leadless Chip Carrier Solder Joints During Power Cycling

    Publication Year: 1983, Page(s):232 - 237
    Cited by:  Papers (170)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (952 KB)

    An ana1ytica1 method is described which provides estimates to first order of the number of either power or envirnnmenta1 cyc1es 1eading to so1der joint fai1ure. Vari0us parameter variations such as so1der joint height, ceramic chip carrier (CCC) size, printed c1rcuit substrate (PCS) materia1, etc. are investigated and discussed and samp1e estimates for a 0.65 x 0.65-in CCC are given. View full abstract»

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  • Effect of HCl and Cl2on Pd Inlay Coupons and Pd Connector Contacts

    Publication Year: 1983, Page(s):343 - 348
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    Field exposure studies indicate that a resistive palladium chloride film may grow on Pd coupons when the ambient contains both high relative humidity (RH) and chlorine. This behavior raises a concern about the use of palladium in separable connectors. Most connectors are shielded systems, and the contacts are subject to wipe on mating. Therefore contact resistance probe measurements on coupon surf... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope