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IEEE Transactions on Parts, Materials and Packaging

Issue 2 • Date June 1969

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Displaying Results 1 - 7 of 7
  • Who's Who in G-PMP

    Publication Year: 1969, Page(s): 70
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    Freely Available from IEEE
  • A Hybrid Thick-Film Chroma Demodulator and Color-Difference Amplifier

    Publication Year: 1969, Page(s):117 - 123
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1056 KB)

    An experimental hybrid thick-film module has been developed that performs the functions of color demodulation and amplification in a color television receiver. The module consists of three principal circuit sections, all included on one 1 x 2 inch substrate: 1) two dual-diode color demodulators, 2) color-difference amplifiers, and 3) a four-diode dc restoration circuit that clamps all three color-... View full abstract»

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  • Aluminum Contact Surfaces in Electrical Transition Interfaces

    Publication Year: 1969, Page(s):104 - 111
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1064 KB)

    The resistance of certain electrical transition interfaces involving plane, nonplated aluminum contact surfaces increases with service. Analysis of resistance characteristics indicates formation of the contact interface during connection installation produces systematic disruption of the surface film. Interfacial shear strain -- relative movement--between the contact members is identified as the e... View full abstract»

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  • Optimized Miniature Thin-Film Planar Inductors, Compatible with Integrated Circuits

    Publication Year: 1969, Page(s):71 - 88
    Cited by:  Papers (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2288 KB)

    The theoretical background and techniques for constructing multipurpose miniature thin-film inductors are presented. These inductors use a thin-film gold spiral encapsulated with deposited ferrite film and present Q values of 100 in the range of 1-1200 µH. The ferrite film is deposited from thermal decomposition of an iodine solution containing the desired metal cations. The magnetic and elec... View full abstract»

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  • Organic Thin-Film Capacitor

    Publication Year: 1969, Page(s):112 - 116
    Cited by:  Papers (17)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (488 KB)

    High..molecular-weight organic compounds (hereinafter designated simply as polymers) are widely used in the manufacture of miniature capacitors because of their excellent dielectric characteristics and suitability for molding and processing. These capacitors frequently use thin~film dielectrics made of polystyrene and polyethylene terephthalate stretched films. On the other hand, examples of manuf... View full abstract»

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  • The Effects of Electrical Conductivity and Oxidation Resistance on Temperature Rise of Circuit-Breaker Contact Materials

    Publication Year: 1969, Page(s):99 - 103
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (664 KB)

    A study has been made of the bulk electrical conductivity and oxidation characteristics of several typical circuitbreaker contact alloys. Results were correlated with temperature rise behavior of the same materials. It was concluded that surface phenomena, particularly oxidation, exert a more potent effect on temperature characteristics than does bulk electrical conductivity. View full abstract»

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  • Corrosion Through Porous Gold Plate

    Publication Year: 1969, Page(s):89 - 98
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2272 KB)

    The corrosion of base metals through porous gold plate adversely effects the reliability of electronic connectors. Little is known, however, of these corrosion mechanisms, especially with gold-plated nickel. Previous work had been concerned almost exclusively with sulfide tarnishing of gold-plated silver or copper. This paper considers the corrosion of gold-plated nickel in environments containing... View full abstract»

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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope