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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 3 • Date September 1982

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Displaying Results 1 - 6 of 6
  • Editorial

    Publication Year: 1982, Page(s): 293
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  • An All Thick-Film Stripline Construction

    Publication Year: 1982, Page(s):294 - 296
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    Design and construction details of an all thick-film stripline (ATFSL) are presented. The new construction offers the advantage of direct access to the ground plane and is suitable for the attachment of active components in chip form. Several striplines were fabricated to study the relation between the dielectric layer thickness and the characteristic impedance of the line. The electric parameters... View full abstract»

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  • Accelerated Life Testing and Reliability of High K Multilayer Ceramic Capacitors

    Publication Year: 1982, Page(s):297 - 300
    Cited by:  Papers (46)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (472 KB)

    The reliability of high K muitilayer ceramic capacitors was evaluated using accelerated life testing. The degradation in insulation resistance was characterized as a function of voltage (two to eight times rated) and temperature (85 to 170°C). The times to failure at a voltage-temperature stress conformed to a iognormai distribution with a standard deviation typically less than 0.5. A small i... View full abstract»

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  • Effects of Titanium Layer as Diffusion Barrier in Ti/Pt/Au Beam Lead Metallization on Polysilicon

    Publication Year: 1982, Page(s):318 - 321
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (808 KB)

    The effect of a titanium layer as a diffusion barrier in Ti/Pt/Au beam lead metallization on polysilicon was investigated. A critical temperature, defined as the beginning of Au-Si eutectic reaction, was investigated for specimens with electron-beam (EB) evaporated and radio frequency (RF) sputtered titanium films 23-- 3000 Å thick deposited onto polysilicon films 0.2-2 µm thick. Polysil... View full abstract»

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  • The Aging Behavior of Commercial Thick-Film Resistors

    Publication Year: 1982, Page(s):308 - 317
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1224 KB)

    An earlier paper reported the promising prospects of accelerating thick-film resistor aging by elevated temperature and humidity stress; those early findings have now been confirmed by further results from many thousands of hours of overstress testing of commercially produced resistors from various sources--amounting to accumulated test times of some millions of resistor-hours. The normal aging tr... View full abstract»

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  • Field Studies of Contact Materials: Contact Resistance Behavior of Some Base and Noble Metals

    Publication Year: 1982, Page(s):301 - 307
    Cited by:  Papers (16)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (992 KB)

    The contact resistance of various metals was determined after exposure of from three months to four years in telephone central offices and in nonair-conditioned locations. The logarithm of median contact resistance was stable for some materials, but with most it increased on aging according to linear, parabolic, or logarithmic time relationships. The kinetics of contact resistance change depended ... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

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