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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 1 • March 1982

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Displaying Results 1 - 25 of 35
  • Foreword

    Publication Year: 1982, Page(s): 2
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    Freely Available from IEEE
  • Mid-Film for Microwave Integrated Circuits

    Publication Year: 1982, Page(s):185 - 191
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1099 KB)

    Mid-filmr is a process which has been developed to combine the high resolution capability of thin film technology and the nonvacuum low cost of thick film technology. In this paper the performance of mid-film microstrip transmission lines is described for applications in microwave integrated circuits (MIC's) in the frequency range of 3-12 GHz. The experiments were carried out on a number of ring r... View full abstract»

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  • Correction to "Solder Post Attachment of Ceramic Chip Carriers to Ceramic Film Integrated Circuits"

    Publication Year: 1982, Page(s): 192
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (41 KB)

    First Page of the Article
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  • Effects of Processing Methods on the Contact Performance Parameters for Silver-Tungsten Composite Materials

    Publication Year: 1982, Page(s):23 - 31
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2024 KB)

    A comparative study of electrical, mechanical, and microstructural properties of silver-tungsten contact materials (49 and 64 volume percent Ag) prepared by two different processing methods, namely press-sinter (PS) and press-sinter-infiltrate (PSI), is reported. Even with the same elemental composition, tungsten particle size and distribution, the two different techniques of preparation have resu... View full abstract»

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  • Effect of Fretting on the Contact Resistance of Palladium

    Publication Year: 1982, Page(s):158 - 166
    Cited by:  Papers (40)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1400 KB)

    The fretting of palladium contacts was studied at conditions relevant to their use in separable electronic connectors. Wrought, clad, and electroplated palladium mated to wrought palladium develop high contact resistance due to the formation of friction polymer. This can occur in ordinary room air which contains traces of organic air pollutants. Contact resistance changes diminish as force is incr... View full abstract»

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  • Experimental Study of Contact Arc Discharge and Contact Welding Phenomena

    Publication Year: 1982, Page(s):62 - 68
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (752 KB)

    Contact welding phenomenon is very important, but it is very complicated. The partial welding phenomena, of which there are only a few examples in fundamental studies, have been considered on the basis of experimental results. We defined the partial uncomplete welding phenomena as the phenomena which occurs when the final contact closing time is longer than the initial contact closing time. In the... View full abstract»

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  • The Effect of Lithium Upon the Erosion Kinetics of Ag-CdO Contacts

    Publication Year: 1982, Page(s):11 - 15
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (696 KB)

    The erosion kinetics of metallurgically similar Ag-CdO contacts with and without Li have been investigated. Time-resolved spectroscopic measurements reveal significant differences in the temporal development of the temperatures and metal species concentration in the arc, associated with the presence or absence of lithium in the supporting contact. These differences correlate well with bulk erosion... View full abstract»

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  • Surface Topography of Printed Wiring Boards and Its Effect on Flashover

    Publication Year: 1982, Page(s):142 - 146
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1200 KB)

    Breakdown voltage values between conductor paths on epoxy-glass printed wiring boards (PWB's) are shown to lie on the Dakin curve relating the breakdown voltage with the dielectric constant and conductor separation on the insulator. However, the insulator surface roughness is shown to affect the breakdown voltage, the smoother the surface the lower the breakdown voltage. With a roughness (peak to ... View full abstract»

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  • Contact Force Analysis of Slotted Beam Connectors

    Publication Year: 1982, Page(s):153 - 158
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    A simple mathmatical model for calculating the contact force at the entrance of the main slot for a slotted beam connector is presented. The effect of lead slot, which leads the wire into the main slot, on the entry contact force is discussed. Results from the analysis are compared with test data. Considering the various approximations involved in the analysis, the two data compare favorably. View full abstract»

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  • Cutting Force Analysis of Split Beam Connectors

    Publication Year: 1982, Page(s):180 - 185
    Cited by:  Papers (1)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (880 KB)

    The insertion process of a bare wire into a split beam is analyzed using the theories of metal cutting. The insertion and the wire entry force, which are two important design considerations for insulation displacement type connectors, are calculated theoretically and found to agree with the values obtained from the experiment. View full abstract»

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  • Pluggable Connectors for Josephson Computers

    Publication Year: 1982, Page(s):166 - 170
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    A process has been developed for the fabrication of high density arrays of miniaturized pluggable connectors for interconnections in high performance computers using Josephson devices. Electrical contacts are made by inserting (at room temperature) arrays of metal pins, each about 200 µm long and 75 µm in diameter with a center-to-center spacing of 300 µm, into corresponding Si micr... View full abstract»

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  • Electrical Properties of Conductive Elastomer as Electrical Contact Material

    Publication Year: 1982, Page(s):56 - 61
    Cited by:  Papers (15)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (872 KB)

    The conductive elastomer has both electrical and elastic properties. When the conductive elastomer is considered as an electrical contact material, it is possible to obtain conductive and elastic properties in one simple material. Therefore, the concept of metallic electrical contact can be changed to the elastomeric contact. Moreover due to excellent properties of facile shape formation, corrosio... View full abstract»

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  • Graduate and Undergraduate Educational Methods for Microelectronics

    Publication Year: 1982, Page(s):105 - 111
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1680 KB)

    Methods applicable to teaching microelectronics at the undergraduate and graduate level in conjunction with an industrial fabrication capability are presented. Results of three semesters of teaching microelectronics at the graduate level with emphasis on both digital and analog circuits are summarized. Plans for teaching an undergraduate course utilizing the fabrication of integrated circuits are ... View full abstract»

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  • Role of Reliability and Accelerated Testing in VHSIC Technology

    Publication Year: 1982, Page(s):138 - 141
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    In very high scale integrated circuits (VHSIC)/technology, reliability ground rules must be developed and included in chip design rules. This concept of "designed-in" reliability, rather than the traditional "tested-in" reliability approach, will be necessary in VHSIC. Accelerated testing becomes important as timely feedback on process, design, and reliability must be provided during technology de... View full abstract»

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  • A Finite Element Analysis of the Thermal Behavior of Contacts

    Publication Year: 1982, Page(s):3 - 10
    Cited by:  Papers (12)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1088 KB)

    The finite element method is applied to two basic problems in the thermal analysis of electrical contacts. The first problem studied is the welding together of contacts when a high current is flowing. The finite element method first is used to solve the electrostatic field equation in order to determine the internal heat generation due to the flowing current. The results are used then in a heat co... View full abstract»

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  • Failure and Overheating of Aluminum-Wired Twist-On Connections

    Publication Year: 1982, Page(s):42 - 50
    Cited by:  Papers (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1520 KB)

    In this investigation, twist-on connectors of the type used for branch circuit wiring in buildings have been tested with solid aluminum and copper conductors. The connector and conductor combinations tested are approved in both the United States and Canada. All of the twist-on connections were made in accordance with the connector manufacturers' instructions. Testing consisted of on-off cycling at... View full abstract»

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  • Failure Analysis of Contaminated Gold-Plated Connector Contacts from Operating Communication Equipment

    Publication Year: 1982, Page(s):95 - 101
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1760 KB)

    The complex phenomenon of surface contamination, leading to faulty contact performance of gold-plated connector-type contacts, has been investigated on the basis of data, samples, and observations originating from operating field equipment. Contaminated samples were collected, the environmental conditions under which they operated were determined, and their contact resistances and fritting voltage... View full abstract»

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  • Gate Arrays for VLSI Design

    Publication Year: 1982, Page(s):133 - 137
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (632 KB)

    Because of the increasing complexity of new integrated circuits (IC's) and the limited supply of IC designers, structured design approaches are necessary. A gate array is a common approach to structuring, formalizing, and thus simplifying the design process. Existing gate arrays in various technologies (ECL, CML, ISL, STL, S-TTL, NMOS, CMOS, 12L, and linear) are described in terms of st... View full abstract»

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  • A New Economic and Reliable Contact Alloy for Connectors

    Publication Year: 1982, Page(s):74 - 80
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (976 KB)

    The development of a new AuAgPd-base alloy for connectors is presented. The 70 weight percent (wt%) gold content, normally considered necessary for high quality connectors, has been successfully reduced to 39 wt% without causing any deterioration in the properties of the alloy. Indeed a marked improvement has been achieved with reference to strength and certain contact-specific features; this part... View full abstract»

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  • Measuring Gold Thickness on Printed Circuit Boards for Control of Production Plating Processes

    Publication Year: 1982, Page(s):69 - 73
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    Beta-backscatter is used to control the thickness of gold plate at a Tektronix, Inc., captive circuit board shop. Gold is deposited from deep tanks on an intermediate deposit of nickel. Routine calibration and standardization procedures resulted in discrepancies of up to 40 percent between beta-backscatter measurements and measurements of cross sections using an optical microscope. Investigation r... View full abstract»

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  • A Thermophysical Criterion for the Weldability of Electric Contact Material in a Steady-State Regime

    Publication Year: 1982, Page(s):147 - 152
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (840 KB)

    A thermophysical criterion for the weldability of contact materials is determined as an unambiguous function of the fusion temperature and of the temperature dependences of the resistivity and thermal conductivity of these materials. The values of this criterion are calculated for most metals, a number of alloys, and some of sintered compounds usually applied in contact design. Also calculated is ... View full abstract»

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  • Laser Processing in Silicon Microelectronics Technology

    Publication Year: 1982, Page(s):112 - 117
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (976 KB)

    Laser irradiation may effect either thermal or chemical changes in target materials. A brief review of the mechanisms involved and a summary assessment of their potential for application in silicon microelectronics technology is presented. View full abstract»

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  • Forming Feedthroughs in Laser-Drilled Holes in Semiconductor Wafers by Double-Sided Sputtering

    Publication Year: 1982, Page(s):171 - 180
    Cited by:  Papers (2)  |  Patents (17)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1416 KB)

    Electrical feedthroughs in semiconductor wafers were made by laser drilling an array of holes in a wafer and subsequently depositing a conductor on the walls of the holes by double-sided sputtering and through-hole electroplating. A maximum depth-to-diameter ratio of six for feedthrough holes through semiconductor wafers successfully implanted with a conductor by this method was determined from bo... View full abstract»

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  • High Current Arc Movement in a Narrow Insulating Channel

    Publication Year: 1982, Page(s):51 - 55
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    an experimental study has been performed to determine the arc speed and hesitation time of a high current arc inside a narrow insulating channel with a set of diverging copper arc runners and copper contacts. The dependence of arc speed on current, on diverging angle, and on runner width has been obtained. The results are qualitatively consistent with simple force considerations. Hesitation time (... View full abstract»

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  • A Comprehensive Approach to IC Design and Fabrication

    Publication Year: 1982, Page(s):102 - 104
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (440 KB)

    A comprehensive integrated circuit (IC) engineering curriculum is presented. The motivation for this curriculum and its implementation at Purdue University are discussed. The emphasis of the paper concerns two IC laboratory courses. View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope