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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 3 • Date September 1981

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Displaying Results 1 - 14 of 14
  • Foreword

    Publication Year: 1981, Page(s): 233
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    Freely Available from IEEE
  • 1980 Best Paper Award

    Publication Year: 1981, Page(s): 234
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    Freely Available from IEEE
  • Design and Evaluation of RC Active Filters for Hybrid Thick Film Implementation

    Publication Year: 1981, Page(s):273 - 282
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1280 KB)

    The resistance-capacitance (RC) active simulation of low sensitivity inductance--capacitance (LC) ladder filters has received a great deal of attention in recent years. Most known methods for the design of either RC active driving point impedances or general impedance converters (GIC's) use the well-known two opamp structure of Antoniou. Recently, some general second-order driving point impedances... View full abstract»

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  • Resistors Screen Printed on Ceramic-Coated Steel Substrates

    Publication Year: 1981, Page(s):235 - 239
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (736 KB)

    Steel substrates covered with ceramic insulating coating were tested for their ability to be used in thick film technology. The first intermediate ground coating was prepared by means of a special glass powder applied to the steel sheet and was fired at temperatures up to 960°C. The final coating was produced by screen printing or by some other method from a dielectric composition and fired a... View full abstract»

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  • Chip Carriers Mounted on Large Thick Film Multilayer Boards

    Publication Year: 1981, Page(s):268 - 272
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (920 KB)

    Two memory systems with 8 MHz clock frequency have been designed. One system contains 67 chip carriers mounted on an alumina substrate 9 x 12.5 cm and the other system contains 79 chip carriers mounted on an alumina substrate 9 x 14 cm. The experiences from the prototype manufacturing and testing are reported. Electrical measurements are made and the signals are compared with the same signals in a... View full abstract»

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  • Environmental Effects on Copper Thick Film Microcircuits

    Publication Year: 1981, Page(s):250 - 256
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1096 KB)

    Performance and reliability of copper thick film microcircuits have been investigated under ambient and accelerated aging environments. Results of the multilayer circuits tested at ambient conditions have demonstrated their quality performance in both unprotected as well as hermetically packaged systems. Performance of these microcircuits match and in some aspects surpass the functional behavior o... View full abstract»

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  • The Design of Composite Resistors

    Publication Year: 1981, Page(s):261 - 267
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1192 KB)

    The design of composite systems in order to achieve desirable resistor properties is discussed, with regard to obtaining a wide range of resistance by means of simple variation of the proportion of the constituents. The subsequent temperature dependence, electrical noise, and stability are also discussed along with the structure and properties of commercial thick film printed resistors for compari... View full abstract»

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  • X-Ray and Microscopic Investigations of Resistors Containing CdO and RuO2

    Publication Year: 1981, Page(s):245 - 249
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    X-ray diffraction analysis was used to determine the crystalline phases of cadmium and ruthenium present after processing thick film resistors formulated from CdO, RuO2, and cadmium-lead-barium borate glass. On firing a phase with diffraction pattern characteristic of the pyrochlore-structure type is formed through reaction of RuO2and the modifying ions present in the glass. The observe... View full abstract»

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  • Electrical Characteristics of Polymer Thick Film Resistors, Part I: Experiemental Results

    Publication Year: 1981, Page(s):283 - 288
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (712 KB)

    The electrical characteristics of some polymer thick film (PTF) resistors have been studied. There are four different kinds of carbon blacks and two different kinds of polymer resin, i.e., epoxy resin and polyimide resin, selected in the preparations of the PTF resistors. In this paper, the electrical characteristics, which include the sheet resistivity, current noise indices (CNI), temperature co... View full abstract»

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  • Preliminary Studies of Tin and Tin Rich Coatings as Electrical Contact Materials

    Publication Year: 1981, Page(s):294 - 303
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1496 KB)

    The soaring price of gold has led the gold-using industries to search for alternative materials. Gold plating on electrical connectors and circuit boards has been commonplace, and in some cases, the only viable material. However in other cases its use is an unnecessary expense. Tin and tin alloy coatings have been used extensively in the electronics industry, particularly to confer solderability t... View full abstract»

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  • Nondestructive Infrared Inspection of Hybrid Microcircuit Substrate-to-Package Thermal Adhesive Bonds

    Publication Year: 1981, Page(s):257 - 260
    Cited by:  Papers (2)  |  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (512 KB)

    A method for nondestructive inspection of the thermal transfer effectiveness of adhesive bonds between the substrate and package (case) in the production of hybrid microcircuits is described. Because this bond is a series element in the thermal path for removal of the power dissipated by the microcircuit, its effectiveness is crucial to maintaining relatively low component-operating temperatures. ... View full abstract»

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  • Piezoelectric Keyboard Electric Design Condition

    Publication Year: 1981, Page(s):304 - 310
    Cited by:  Papers (2)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (752 KB)

    A design method for an electronic keyboard with a piezoelectric transducer having a planar shape which aims at low cost and flexible structure is described. Electrical design conditions can be obtained from two physical quantities, namely electrostatic capacity and kinetic energy. View full abstract»

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  • Electrical Characteristics of Polymer Thick Film Resistors, Part II: Phenomenological Explanation

    Publication Year: 1981, Page(s):289 - 293
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (752 KB)

    Phenomenologicai explanations of the electrical characteristics of the polymer thick film resistors [1] are given. The conduction mechanism is discussed on the basis that the sheet resistivity is dependent on the average gap distance between carbon black conducting particles or chains. The effect of the "structure'! of carbon blacks has also been incorporated. The dependencies of sheet resistivity... View full abstract»

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  • Cadmium Oxide Thick Film Resistors

    Publication Year: 1981, Page(s):239 - 244
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (680 KB)

    Use of cadmium oxide as a nonprecious conducting material for thick film resistors was investigated. Screen printed resistors were evaluated over a firing temperature range of 630°C to 760°C. By adjusting the ratio of cadmium oxide to glass, the sheet e resistance could be varied from about 1 k Omeg / Box$^b ... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope