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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 2 • June 1980

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Displaying Results 1 - 16 of 16
  • Foreword

    Publication Year: 1980, Page(s):209 - 210
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    Freely Available from IEEE
  • Corrections to " Contact Erosion Pattern of DC Break Arcs"

    Publication Year: 1980, Page(s):306 - 307
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    First Page of the Article
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  • A New Bilateral Optoisolator Circuit

    Publication Year: 1980, Page(s):266 - 280
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1192 KB)

    A simple optoisolator circuit is proposed which has bilateral transmission. It is composed of two optoisolators in a positive feedback arrangement without going into instability. The experimental and analytical results show that this circuit simulates not only the transmission gain or attenuation corresponding to the step-up or step-down transformer, but also the bilateral amplification. Other fea... View full abstract»

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  • Wear of Silver-Graphite Brushes Against Various Ring Materials at High-Current Densities

    Publication Year: 1980, Page(s):288 - 291
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    A study has been carried out to evaluate noble metals for potential use as ring materials for high-speed high-current applications. A pin-on-disk friction apparatus was constructed so as to allow sliding tests to be carried out at high speeds and high-current densities in controlled environments. The pin material was a silver-graphite brush composite while the flat material was one of the elementa... View full abstract»

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  • Ion-Implanted p-Resistor Reliability

    Publication Year: 1980, Page(s):258 - 261
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    One of the key aspects of large-scale integration in bipolar technology depends on the use of high valued resistors. Ion implantation can lead to higher valued resistors not possible with diffused technology. Two different process technologies, pre-emitter and post-emitter, for making ion-implanted resistors are described. Also described are measured profiles, reliability studies carried out on p-... View full abstract»

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  • Molybdenum in the Electronics Industry

    Publication Year: 1980, Page(s):232 - 236
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (784 KB)

    Molybdenum, which is widely used in the electronics industry, is usually a misunderstood metal. An introduction to its manufacture and present use is presented. The new development of cladding molybdenum with various materials and/or elements, which not only improves the reliability of the electronic device but also reduces production costs, is described. View full abstract»

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  • The Lubrication of Gold Surfaces by Plasma-Deposited Thin Films of Fluorocarbon Polymer

    Publication Year: 1980, Page(s):297 - 304
    Cited by:  Patents (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1200 KB)

    Thin films of fluorocarbon material have been deposited on gold-plated substrates by the technique of RF-induced plasma polymerization of fluorocarbon monomer gases. The deposited films have been evaluated for suitability as contact lubricants by determining the friction and wear characteristics of the substrates in the presence and absence of the film and by a comparison to substrates coated with... View full abstract»

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  • Contamination Control in Lead Bonding to Thick and Thin Films

    Publication Year: 1980, Page(s):281 - 287
    Cited by:  Papers (1)
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    Degraded wax residues from processing steps have been found to be a major source of contamination on beam lead devices for hybrid microcircuits. Two avenues of approach were used to solve bonding problems traced to this contamination: 1) a search was initiated for a more thermoxidatively stable and more easily removed wax, and 2) an effort was made to determine the level of cleanliness necessary f... View full abstract»

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  • A Fracture Mechanics Approach to Structural Reliability of Ceramic Capacitors

    Publication Year: 1980, Page(s):250 - 257
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    Physical defects, such as cracks, spa!Is, and delaminations, may be associated with a significant percentage of the multilayered capacitors produced for high reliability applications. These defects may lead to severe cracking of the capacitors and eventually to their electrical failure. This paper presents a fracture mechanics approach to the reliability assessment of physically defective capacito... View full abstract»

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  • Connector Finishes: Tin in Place of Gold

    Publication Year: 1980, Page(s):226 - 232
    Cited by:  Papers (11)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1176 KB)

    Gold has been the natural choice as a contact material for low-voltage circuits (dry circuits) because of its properties and characteristics. In addition to having low electrical resistivity, it is not attacked by most chemicals and does not form surface oxides and sulphides so that good electrical contact is made with minimal force, even at low voltages. The rapidly escalating price of gold has m... View full abstract»

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  • Thick-film Technology: An Introduction to the Materials

    Publication Year: 1980, Page(s):211 - 225
    Cited by:  Papers (3)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2920 KB)

    The use of thick-film technology to manufacture electronic circuits and discrete passive components continues to grow at a rapid rate worldwide. When applied to hybrid microcircuits, it can be viewed as a means of packaging active devices, spanning the gap between monolithic integrated circuit chips and printed circuit boards with attached active and passive components. The strength of the thick-f... View full abstract»

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  • A New Mechanism for Lateral Erosion

    Publication Year: 1980, Page(s):292 - 296
    Cited by:  Papers (4)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (824 KB)

    Although miniature dry reed sealed contacts are in increasing demand in telecommunications, their use is often limited to low current switching. Attempts to use dry reed contacts to switch higher currents lead to resistance failures or failures to release after a relatively small number of operations. These premature failures are always due to the formation of pips and craters resulting from local... View full abstract»

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  • A Low Pressure Capacitance Type Pressure to Electric Transducing Element

    Publication Year: 1980, Page(s):261 - 265
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (664 KB)

    A great variety of pressure transducers with electrical output have been developed for pressure measurements using a number of different operating principles. Virtually all pressure to electric transducers consist of a fluid pressure sensitive member which converts fluid pressure into mechanical movement or force. A new pressure to electric transducer is described. It is a low pressure (0 to I psi... View full abstract»

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  • Design of an Internal Fuse for a High-Frequency Solid Tantalum Capacitor

    Publication Year: 1980, Page(s):244 - 249
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    A miniature fuse module was designed and incorporated into a solid tantalum capacitor for high-frequency bypass applications. The fuse consists of a fine bimetallic wire which reacts exothermically upon reaching a critical initiation temperature. It is housed in an electrically and thermally insulative body to minimize fusing energy. The desirability of having fused devices is discussed. Design co... View full abstract»

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  • Statistics of Wire Lengths on Circuit Boards

    Publication Year: 1980, Page(s):305 - 306
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (232 KB)

    The expected length of connecting wire on a rectangular board has been found based on random starting and stopping points. Two cases of connections are considered. One case uses x and y motion and the other uses a direct path. The results are important in the consideration and design of circuit performance in electronics packaging. The same probability distributions are also directly applicable to... View full abstract»

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  • Ceramic Humidity Sensors

    Publication Year: 1980, Page(s):237 - 243
    Cited by:  Papers (29)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (936 KB)

    A novel humidity sensor using a MgCr204-TiO2 porous ceramic has been developed for an automatic microwave oven. Physical properties of the MgCr204-TiO2 ceramic, construction and humidity characteristics of the sensors, and outlines of the control of the automatic microwave oven by humidity sensing are described. The MgCr204-TiO2 cer... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope