By Topic

Parts, Materials and Packaging, IEEE Transactions on

Issue 3 • Date September 1966

Filter Results

Displaying Results 1 - 6 of 6
  • Who's Who in G-PMP

    Page(s): 50
    Save to Project icon | Request Permissions | PDF file iconPDF (149 KB)  
    Freely Available from IEEE
  • Microinhomogeneity Problems in Silicon

    Page(s): 51 - 58
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1373 KB)  

    A survey evaluation of the quality of commercial silicon used in the preparation of p-n junction devices has been made, with emphasis on the detection and characterization of micro-inhomogeneities. The examination techniques included transmission electron microscopy, special etching techniques with optical microscopy, and microresistivity determination. These investigations have shown that almost all silicon produced by current commercial techniques has an appreciable concentration of microdefects, including precipitates and microcrystallographic defects, which are too small to be detected by conventional techniques. Furthermore the impurity distribution is inhomogeneous on a microscopic scale. These microinhomogeneities are frequently present in sufficient concentration to be more influential in determining the quality of the finished device than the material properties usually specified. Some suggestions are made concerning the establishment of standards of acceptability for the major types of microdefects and for developing simple, rapid evaluation procedures. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Current Topics in the Surface Chemistry of Electric Contacts

    Page(s): 59 - 67
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (1673 KB)  

    This paper describes recent work in the science of the separable electronic pressure contact with emphasis on chemical factors in performance. The following topics are discussed: growth and morphology of sulfide tarnish films which creep across the interface between gold plate and silver or copper alloys and degrade contact performance; the formation and structure of corrosion solids on porous gold electroplated contacts, and which originate in atmospheres polluted with sulfur dioxide or hygroscopic dusts; new developments in measuring the porosity in precious metal plates; the critical dependence of the porosity of gold plate on substrate roughness; and new concepts for developing electronic connectors with contacts made of base metals. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Current Ideas in the Philosophy of Testing Electrical Contacts

    Page(s): 68 - 70
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (477 KB)  

    In computer equipment, the large number of connector type contacts alone require a very reliable component. There is a definite need for obtaining a better understanding of the modes of failure in real-life environments so that new and better test methods can be developed. This paper reviews testing methods and the philosophy of evaluating electrical contacts. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Recent Studies on the Physics of Electrical Connector Surfaces

    Page(s): 71 - 75
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (785 KB)  

    The manner in which two conductors touch to form an electrical contact is described, and the influence of the phenomena occurring at the interface on the engineering properties of the connector is discussed. In the last ten years, significant advances have been made in our knowledge of the mechanical, electrical, and thermal aspects of the contact between surfaces. These have led to a better understanding of the deterioration processes which occur naturally in connectors. A new philosophy of the evaluation and specification of connectors which utilizes these results and which links the engineering reliability of the device to the basic science of the interface is discussed. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Recent Advances in Sliding Contacts including Space Applications

    Page(s): 76 - 79
    Save to Project icon | Request Permissions | Click to expandQuick Abstract | PDF file iconPDF (703 KB)  

    Drastic wear under very dry high altitude or space conditions is considered to be due to a lack of a contact film. When this film is absent, electron exchange between metallic members can produce metallic bonds which are of the same order of magnitude in strength as those of soft metals. The contact between a metal and graphite also exhibits considerable bond strength. Such bonds result in galling, seizure, high wear rates, and in some cases, the end result is poor electrical conduction. Graphite alone is not sufficient to provide a suitable contact film for sliding conduction under space conditions. It is an electron conductor, and it is therefore possible that it can make weak metallic bonds with the metals in the absence of moisture or organic vapors. A large list of chemical compounds, some of which are laminar, like graphite, and some of which are not, like lithium carbonate, can prevent drastic wear. View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.

Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope