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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 2 • Date June 1979

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Displaying Results 1 - 18 of 18
  • Who's Who in CHMT

    Publication Year: 1979, Page(s): 157
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    Freely Available from IEEE
  • Foreword

    Publication Year: 1979, Page(s): 158
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    Freely Available from IEEE
  • Accelerated Reliability Evaluation of Trimetal Integrated Circuit Chips in Plastic Packages

    Publication Year: 1979, Page(s):172 - 179
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1128 KB)

    Accelerated step-stress and constant-stress reliability tests have been performed on trimetal MOS and bipolar integrated circuit chips beam-tape bonded in both plastic and hermetic packages. Wire bonded units of like construction were also included for control purposes. The work is being performed in three phases. Phase I, already completed, was a study of the feasibility of hermetic gold metalliz... View full abstract»

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  • Hybrid IC Structures Using Solder Reflow Technology

    Publication Year: 1979, Page(s):208 - 217
    Cited by:  Papers (5)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1576 KB)

    A study of hybrid IC's produced by solder refiow technology was carried out to achieve optimum miniaturization and substantial cost reduction. Thin-film resistor and capacitor network (R-C) chips and silicon integrated circuit (SIC) chips are mounted on a multilayered thick-film conductor substrate and connected to the substrate by solder joining. The chips are first supported by solder bumps, and... View full abstract»

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  • Silver Migration and the Reliability of Pd/Ag Conductors in Thick-Film Dielectric Crossover Structures

    Publication Year: 1979, Page(s):196 - 207
    Cited by:  Papers (36)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1752 KB)

    The relative performance characteristics of thick-film Pd/Ag conductors (0-34% Pd) for dielectric crossover structures in hybrid microelectronic circuits are described. The materials were supplied from Du Pont and Engelhard. The experiments involved waterdrop (WD) tests and temperature-humidity-bias (THB) tests at 90°C, 90% RH, and a dc bias of 5-50 V applied between the conductor electrodes ... View full abstract»

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  • A Method for the Rheological Characterization of Thick-Film Pastes

    Publication Year: 1979, Page(s):232 - 239
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1136 KB)

    A complete rheological profile of a thick-film ink can provide an understanding of the effects of composition on properties and enables one to predict and control the screening behavior. A complete profile includes the thixotropic and pseudoplastic properties as well as the viscosity behavior during post-shear recovery when leveling takes place. This paper presents a set of experimental techniques... View full abstract»

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  • Solid-State Two-to Four-Wire Hybrid Function

    Publication Year: 1979, Page(s):269 - 272
    Cited by:  Papers (1)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    A new type of solid-state two- to four-wire hybrid function using photocouplers is proposed which employs the combinations of the traditional differential, push-pull, and cascade techniques. It has a good linearity and temperature dependence over a wide operating frequency from dc to 100 KHz. View full abstract»

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  • Temperature Coefficients of Resistance: A New Approach

    Publication Year: 1979, Page(s):265 - 269
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (584 KB)

    An empirical relationship is developed for the temperature variation of thick-film resistors. From this two coefficients are derived which can be used to predict resistance and tracking variations at any temperature. The predicted results are compared to actual mea- surements. View full abstract»

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  • Temperature Aging of External Connections Condensation Soldered to Ti-Pd-Au Thin Films

    Publication Year: 1979, Page(s):180 - 195
    Cited by:  Papers (22)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2408 KB)

    Soldering has a number of advantages for making external connections to HIC's (hybrid integrated circuits). However, recent investigations report a potential reliability problem due to the formation of brittle intermetallic compounds. An investigation of the mechanism of solder joint strength degradation due to the temperature aging of clip-on terminals to HIC Ti-Pd-Au thin films is described. The... View full abstract»

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  • Active Device Prescreening for Hybrids

    Publication Year: 1979, Page(s):247 - 254
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1088 KB)

    An investigation was conducted to find ways to reduce the number of active device failures so common in hybrid manufacturing. It was determined that a very substantial reduction in these failures can be achieved with the proper procurement, inspection, and testing of the active device chips prior to the assembly into the hybrid. A high reliability production line which uses this approach has resul... View full abstract»

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  • A Low-Cost Thin-Film Microcircuit Process

    Publication Year: 1979, Page(s):218 - 221
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (656 KB)

    A low-cost thin-film microcircuit conductor/resistor technology is developed which offers reduced material costs, a simple fabrication process, relatively low resistor temperature coefficients, and low resistance conductor metalization. The process uses copper for the conductors and Kanthal for the resistors; the process is compatible with certain selective etches to realize a subtractive process. View full abstract»

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  • A User's Performance Profile of a Thick-Film Resistor System

    Publication Year: 1979, Page(s):240 - 246
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (904 KB)

    The DuPont Birox11400 resistor system has been successfully used by Sylvania for several years. However, only recently has it become practical to meaningfully track the performance on a production lot basis by using a data acquisition system centered on an HP 9825 calculator. During a 39-week period in 1977-1978, 30 production lots of 11 types of custom precise resistor networks involvi... View full abstract»

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  • Heat Exchange Optimization Technique for High-Power Hybrid IC's

    Publication Year: 1979, Page(s):226 - 231
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (656 KB)

    An algorithm for the optimization of the heat exchange conditions in high-power thick-film hybrid IC's is presented. The algorithm for the placement of elements which are temperature sensitive and/or heat sources is discussed. The Powell's multivariable unconstrained optimization technique and the penalty function shifting method in constrained static optimization are proposed as tools. View full abstract»

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  • A High-Stability RC Circuit Using High Nitrogen Doped Tantalum

    Publication Year: 1979, Page(s):221 - 225
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (752 KB)

    A fabrication process and reliability studies for RC hybrid integrated circuits utilizing alpha tantalum capacitors and tantalum nitride resistors are described. The alpha tantalum used in this study was reactively sputtered tantalum film containing from 10-20 atomic percent nitrogen and has a body centered cubic structure. The ac and dc characteristics of the alpha tantalum capacitors are in agre... View full abstract»

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  • Performance of New Copper-Based Metallization Systems in an 85°C, 78% RH, SO2Contaminated Environment

    Publication Year: 1979, Page(s):159 - 171
    Cited by:  Papers (3)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2000 KB)

    The performance of Ti-Pd-Cu-Ni-Au (TPCNA), Ti-CuNi-Au (TCNA), and Ti-Cu metallization systems in an 85°C, 78% RH environment contaminated with SO2was compared with that of the standard Ti-Pd-Au (TPA) metallization. Electrolytic and galvanic corrosion failure modes were identified for encapsulated (RTV silicone tubber) and unencapsulated triple track conductor specimens fabricated u... View full abstract»

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  • The Admittance Behavior of Low-High-Low GaAs Schottky IMPATT Diodes

    Publication Year: 1979, Page(s):254 - 257
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (520 KB)

    The admittance behavior of high-efficiency high-power low-high-low GaAs Schottky IMPATT diodes is significantly different than those of Si Read type IMPATT structures. Using small signal analysis the admittance of such low-high-low structures is investigated, and the influences of the multiplication factor, recombination current, and dielectric relaxation are included. The calculations obtained on... View full abstract»

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  • Properties of Die Bond Alloys Relating to Thermal Fatigue

    Publication Year: 1979, Page(s):257 - 263
    Cited by:  Papers (43)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1048 KB)

    The differing performances of hard soldered and soft soldered power devices under cycling stresses are well understood. Hard soldered dice are often under considerable stress and may even fracture in extreme cases, but the solder itself does not degrade by fatigue after many temperature cycles. This behavior is due to the very high mechanical strengths of the hard solders between -55 and 150°... View full abstract»

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  • Thermal Oxide Film Deposition Monitoring Algorithm

    Publication Year: 1979, Page(s):263 - 265
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (352 KB)

    A software-implemented algorithm for controlling the amount of thermal oxide film grown on a substrate, along with some experimental results, is presented. View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope