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IEEE Transactions on Parts, Materials and Packaging

Issue 1 • June 1965

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Displaying Results 1 - 25 of 50
  • Electrolytic Corrosion of Metallic Resistors

    Publication Year: 1965, Page(s):143 - 148
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (494 KB)

    Metallic resistors are encapsulated mainly for two reasons. Firstly to avoid mechanical damage, secondly to provide protection against moisture. If moisture penetration is not prevented and if at the same time ions are present capable of moving through or along the insulating materials, a resistance change will occur with time, whenever the resistor is subjected to a high relative humidity and a d... View full abstract»

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  • Silicon Oxide Micromodule Capacitors

    Publication Year: 1965, Page(s):186 - 193
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (754 KB)

    Silicon oxide capacitors have been developed on micromodule wafers (O. 3lO-in. sq. with three termination notches per side). Each microelement contains 1, 2, 3, or 4 capacitors with values of 1120 and 560, 180, 100 and 68 pf per capacitor, respectively. The 1120 pf capacitor is double layered. In addition to the general requirements of microelements and micromodules, some of the more important spe... View full abstract»

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  • A Graphical Sequential Weibull Life Test Procedure

    Publication Year: 1965, Page(s):343 - 351
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (714 KB)

    This paper presents a series of graphed sequential tests to be used for testing the joint hypothesis that (the Weibull shape factor)beta=beta0and that (the Weibull scale factor)theta=theta0. These o plans, obtained by simulating life tests on an IBM 7090 computing system, are specified for two sample sizes, five confidence levels, a... View full abstract»

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  • Reliability Cost Effectiveness Through Parts Control and Standardization

    Publication Year: 1965, Page(s):327 - 331
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    Early in the F-lll design effort, an F-lll Parts Control and Standardization Program was developed and implemented through a team of electronic parts specialists from General Dynamics and 12 of the major electronic equipment contractors. Basic objectives of the team were (1) the standardization of common electronic parts by joint evaluation, selection, and use of preferred part types, (2) the prep... View full abstract»

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  • Thermal Processing of Tantalum Nitride Resistors

    Publication Year: 1965, Page(s):123 - 128
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    A study of the thermal oxidation of tantalum nitride (Ta-N) thin films has led to the development of a thermal processing technique by which these metal films can be made to exhibit superior resistor characteristics. The thermal process simply involves heating the Ta-N film resistors in air at some temperature between 450° and 700°C. Radiant heating has been found to be most convenient f... View full abstract»

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  • Communication Transformer Engineering by Computer

    Publication Year: 1965, Page(s):115 - 122
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    This paper describes a program for designing communication transformers on a digital computer. The program accepts circuit requirements for transformers, calculates the limiting values of the transformer parameters needed to meet these requirements, searches for existing designs, designs new transformers, verifies that new or old transformers will meet the requirements, characterizes new designs f... View full abstract»

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  • Ceramic Substrates for Microcircuitry

    Publication Year: 1965, Page(s):264 - 266
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (280 KB)

    Ceramic substrates for housing microelectronic circuits must be extremely stable electrically and mechanically. They should also exhibit good thermal and mechanical shock resistance in order to withstand not only process steps encountered in fabricating microcircuits on their surfaces, but also subsequent environmental applications. Chemical activity requirements have also been imposed on the subs... View full abstract»

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  • Influence of Themal Strains on Temperature Coefficient of Bulk Metal Film Resistors

    Publication Year: 1965, Page(s):158 - 164
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (640 KB)

    The main properties of a new bulk metal film resistor have been previously presented at the Electronic Components Conference in Washington, May 6, 1964. In particular, it was shown that this resistor has an extremely low and controllable temperature coefficient of resistance. In the present paper a rigorous mathematical treatment of temperature coefficient changes in bulk metal film resistors due ... View full abstract»

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  • Elecromagnetic Relay Reliability Predictions by Designed Life Experiments and Weibull Analysis

    Publication Year: 1965, Page(s):309 - 319
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1248 KB)

    The complexity of their failure mechanisms, the significant interaction effects of numerous operating parameters, and high test costs have led to many elaborate, expensive, time consuming, and often ineffective, test programs to characterize the life expectancy of specific relay designs under a variety of application conditions. This paper describes a program wherein a series of life tests of a ne... View full abstract»

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  • A Corona Free High Voltage Feedthrough Terminal Design for Electronic Applications

    Publication Year: 1965, Page(s):84 - 94
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (872 KB)

    This paper reports the development of an alumina ceramic feedthrough terminal for use on Electronic Components that is corona free to its external flashover voltage. Comparing this flashover voltage to the corona start voltage of similar size conventional terminals, this represents an improvement of more than four to one. The improvement has been gained by shielding the air near the critical mount... View full abstract»

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  • Heterogeneities in Anodic Oxide Films on Tantalum - Their Detection and Electrical Characteristics

    Publication Year: 1965, Page(s):70 - 78
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1064 KB)

    A print-out technique was used to study the electronic conductivity of anodic oxide films and, in particular, the electronic conductivity associated with heterogeneities in the oxide film. Tantalum foil was used in the "as received" state, after chemical polishing, abraded, heated in air, and carburized to show the electronic current of defects as a function of formation voltage (film thickness), ... View full abstract»

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  • Properties and Performance of Tantalum Oxide Thin Film Capacitors

    Publication Year: 1965, Page(s):194 - 204
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (992 KB)

    Tantalum oxide ~hin film capacitors of approximately 10* ~f were prepared by anodization of sputtered tantalum films and vacuum evaporation of gold counterelectrodes. Initial leakage currents at 75 v d.c. were obtained and the capacitors were placed on a constant voltage life test. The variables studied were anodization voltage (100v-300v), life test voltage (lOv-65v) and life test temperature (RT... View full abstract»

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  • A Discrete Tantalum Nitride Thin Film Resistor on a Flat Embossed Ceramic Substrate

    Publication Year: 1965, Page(s):129 - 135
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    A newly developed tantalum nitride thin film resistor is being evaluated that uses an unglazed flat ceramic substrate with a pattern for the resistive element embossed into its surface. The resistive element is the sputtered tantalum nitride film with its inherent low temperature coefficient of resistance and high stability over long term load life. The design is such that it eliminates the use of... View full abstract»

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  • Adhesion of Platinum-Gold Glaze Conductors

    Publication Year: 1965, Page(s):381 - 386
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    The present work studies the time-temperature relationships of adhesion for typical platinum-gold glaze conductors. An empirical equation is derived from which it is possible to calculate the optimum time and temperature of firing. It is shown that the effects of two firings must be taken into account in choosing primary firing conditions. Adhesion was studied as a function of time at elevated tem... View full abstract»

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  • Component Reliability at Low Stress Levels and the Significance of Failure Mechanisms

    Publication Year: 1965, Page(s):303 - 308
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    In modern electronic equipment, many components operate at stress levels much below their rated values. The factors governing failure, and therefore reliability, may be quite different at these levels from those that apply at the higher levels at which testing is usually performed. Using electrical contacts and dielectric materials as examples, the importance of considering low stress phenomena is... View full abstract»

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  • Reactively Sputtered Tantalum Resistors and Capacitors for Silicon Networks

    Publication Year: 1965, Page(s):31 - 44
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1088 KB)

    The protracted contest between solid-state and thin-film microcircuitry proponents appears to be subsiding, due to the recognition that the two techniques really complement each other. Microcircuit manufacturers and users look to hybrid circuits as a good way to achieve Iow-cost, high-performance circuits. The technique, termed "reactive sputtering" of preparing thin films ranging from conductors ... View full abstract»

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  • Design of Solid-State Radar Transmitter Units for the Lunar Excursion Module

    Publication Year: 1965, Page(s):257 - 263
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (896 KB)

    The design of all-solid-state radar transmitters for satisfactory performance in trans-lunar space or on the lunar surface poses many problems, the solution of which provides beneficial fallout for other applications. This paper discusses the design considerations which were combined to produce a highly reliable end sophisticated package adapted to accomplish, for a lunar excursion mission profile... View full abstract»

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  • Universal Component Packaging System

    Publication Year: 1965, Page(s):230 - 236
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1136 KB)

    A packaging system is described which provides for the compatible use of integrated circuits, thin film circuits and conventional components in the synthesis of spaeeborne digital command and data handling equipments. Each of the three categories of components are used in a family of 20 module types which can be used to build decoders, programmers, data multiplexers, analog-to-digital converters, ... View full abstract»

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  • New Electrical Connector Specificaton Answers Space-Age Environmental Needs

    Publication Year: 1965, Page(s):248 - 256
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (840 KB)

    A new Air Force specification for electrical connectors, MIL-C-38300(USAF) has been introduced primarily to meet the high performance demands of advanced aerospace systems. Materials and techniques used to produce connectors that will meet the specified environmental serviceability and reliability requirements are detailed and illustrated. View full abstract»

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  • Measurement of Internal Stresses in Encapsulated Electronic Modules

    Publication Year: 1965, Page(s):178 - 185
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (648 KB)

    The development of a hydrostatically-pressure sensitive transducer with dimensions much smaller than conventional pigtailed electronic components has made possible the measurement of environmentally-induced stresses in encapsulated electronic modules. Such measurements for a few encapsulants have shown large changes in internal stresses with small changes in ambient temperature, a shift in the str... View full abstract»

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  • A Thin Film Lubricant for Connector Contacts

    Publication Year: 1965, Page(s):1 - 9
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1112 KB)

    A thin film lubricant has been developed for gold plated contacts. This film is Octadecylamine-hydrochloride (ODA·HCL), and it exhibits excellent adherence to gold surfaces. The friction between solid gold surfaces and gold plated surfaces was reduced by a factor of approximately 4 to 1. The lubricating properties of this film have been adequately demonstrated under loads ranging from 20 to 3... View full abstract»

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  • Sputtered Sulphide Films for Electronic Components

    Publication Year: 1965, Page(s):277 - 284
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (584 KB)

    Two types of sputtering have been used to deposit several II-VI compound materials as thin films suitable for various applications. Both reactive and compound sputtering have yielded stable and reproducible films. In either case doping was accomplished during film deposition. Zinc sulphide films have yielded good capacitors with low dissipation, moderate breakdown voltages and High stability. Pron... View full abstract»

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  • Factors Influencing the Current Rating of R-F Capacitors

    Publication Year: 1965, Page(s):205 - 209
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    R. F. tests were run on a large number of capacitors to determine practical ratings, define operating characteristics and optimize design. Frequency and thermal effects were encountered and analyzed mathematically. A system for reporting rating characteristics was developed, a derating curve was derived and factors influencing operation were defined. View full abstract»

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  • Printed Circuit Connectors from Microassemblies

    Publication Year: 1965, Page(s):371 - 380
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (968 KB)

    First Page of the Article
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  • Poly-Para-Xylylene in Thin Film Applications

    Publication Year: 1965, Page(s):54 - 62
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (928 KB)

    First Page of the Article
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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope