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IEEE Transactions on Parts, Materials and Packaging

Issue 1 • Jun 1965

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Displaying Results 1 - 25 of 50
  • A New Dried Anodized Aluminum Capacitor

    Publication Year: 1965, Page(s):224 - 229
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (672 KB)

    The capacitance, dissipation factor, resistivity, and dielectric strength of dried anodized aluminum films are discussed. A miniature non polar self healing capacitor using metalized anodic films is described. Construction techniques, performance, and ratings are presented. View full abstract»

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  • The Gaseous Anodization of Aluminum

    Publication Year: 1965, Page(s):217 - 223
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    Gaseous anodization of aluminum has been investigated as an alternative procedure to forming thin oxide films by such standard techniques as electrolytic anodization and air oxidation. Oxide films are formed on an aluminum surface when positioned in the plateau region of a glow discharge of oxygen. Process variables such as the oxygen pressure and the applied voltage are found to affect the time f... View full abstract»

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  • New High Peformance Aluminum Electrolytic Capacitors

    Publication Year: 1965, Page(s):210 - 216
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (688 KB)

    The shortcomings of convention aluminum electrolytic capacitors are discussed, in particular their lack of stability and limited temperature range. A new type of aluminum electrolytic capacitor is described of high stability and an operating temperature range from -55°C to +125°C. It owes its superior performance characteristics to the development of a new electrolyte system representing... View full abstract»

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  • Factors Influencing the Current Rating of R-F Capacitors

    Publication Year: 1965, Page(s):205 - 209
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    R. F. tests were run on a large number of capacitors to determine practical ratings, define operating characteristics and optimize design. Frequency and thermal effects were encountered and analyzed mathematically. A system for reporting rating characteristics was developed, a derating curve was derived and factors influencing operation were defined. View full abstract»

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  • Put Engineering Efforts Back in Reliability Techniques

    Publication Year: 1965, Page(s):297 - 302
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    Conventional statistical reliability techniques are a necessary condition of reliability. They are, however, insufficient and inadequate. Other reliability techniques are needed to turn a feasibly designed system into a completely successful one. The implementation of these techniques is lagging. They have not as yet been unified on an industry-wide basis. They must be implemented and unified, how... View full abstract»

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  • Communication Transformer Engineering by Computer

    Publication Year: 1965, Page(s):115 - 122
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    This paper describes a program for designing communication transformers on a digital computer. The program accepts circuit requirements for transformers, calculates the limiting values of the transformer parameters needed to meet these requirements, searches for existing designs, designs new transformers, verifies that new or old transformers will meet the requirements, characterizes new designs f... View full abstract»

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  • A Corona Free High Voltage Feedthrough Terminal Design for Electronic Applications

    Publication Year: 1965, Page(s):84 - 94
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (872 KB)

    This paper reports the development of an alumina ceramic feedthrough terminal for use on Electronic Components that is corona free to its external flashover voltage. Comparing this flashover voltage to the corona start voltage of similar size conventional terminals, this represents an improvement of more than four to one. The improvement has been gained by shielding the air near the critical mount... View full abstract»

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  • Nanosecond Pulse Circuit Board Interconnections

    Publication Year: 1965, Page(s):359 - 370
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1096 KB)

    The difficulties involved in using mating connectors to interconnect nanosecond pulse circuit boards are discussed. The effects of such connectors on pulse characteristics may be predicted by the techniques presented in this article. Experimental verification of predicted performance is presented in the form of photographs through the use of time domain reflectometry. The connector used to illustr... View full abstract»

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  • Reliability Improvement in Pulse Transformers

    Publication Year: 1965, Page(s):103 - 108
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    As part of the NASA Orbiting Geophysical Observatory (OGO) program, an investigation was made of failure mechanisms in miniature pulse transformers, a type commonly used for drive pulse coupling in low-power digital circuitry. The resulting corrective action methods are useful for reliability improvement in other similar magnetic devices and components. Failures were traced to breaks in small diam... View full abstract»

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  • Impact of Microminiaturization on Printed Circuit Boards

    Publication Year: 1965, Page(s):352 - 358
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (888 KB)

    First Page of the Article
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  • Elecromagnetic Relay Reliability Predictions by Designed Life Experiments and Weibull Analysis

    Publication Year: 1965, Page(s):309 - 319
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1248 KB)

    The complexity of their failure mechanisms, the significant interaction effects of numerous operating parameters, and high test costs have led to many elaborate, expensive, time consuming, and often ineffective, test programs to characterize the life expectancy of specific relay designs under a variety of application conditions. This paper describes a program wherein a series of life tests of a ne... View full abstract»

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  • Design of Solid-State Radar Transmitter Units for the Lunar Excursion Module

    Publication Year: 1965, Page(s):257 - 263
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (896 KB)

    The design of all-solid-state radar transmitters for satisfactory performance in trans-lunar space or on the lunar surface poses many problems, the solution of which provides beneficial fallout for other applications. This paper discusses the design considerations which were combined to produce a highly reliable end sophisticated package adapted to accomplish, for a lunar excursion mission profile... View full abstract»

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  • Embedment of Electronic Modules by Transfer Molding

    Publication Year: 1965, Page(s):169 - 177
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1120 KB)

    One of the latest and most interesting techniques in the use of plastics for electronic packaging is the total embedment of an assembled circuit in a closed mold, utilizing a transfer molding press. This technique uses a combination of heat and pressure to liquefy a powdered or granular plastic compound in a transfer pot, and subsequent introduction of the plastic into the mold cavity while mainta... View full abstract»

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  • Silicon Oxide Micromodule Capacitors

    Publication Year: 1965, Page(s):186 - 193
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    Silicon oxide capacitors have been developed on micromodule wafers (O. 3lO-in. sq. with three termination notches per side). Each microelement contains 1, 2, 3, or 4 capacitors with values of 1120 and 560, 180, 100 and 68 pf per capacitor, respectively. The 1120 pf capacitor is double layered. In addition to the general requirements of microelements and micromodules, some of the more important spe... View full abstract»

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  • A Thin Film Lubricant for Connector Contacts

    Publication Year: 1965, Page(s):1 - 9
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1112 KB)

    A thin film lubricant has been developed for gold plated contacts. This film is Octadecylamine-hydrochloride (ODA·HCL), and it exhibits excellent adherence to gold surfaces. The friction between solid gold surfaces and gold plated surfaces was reduced by a factor of approximately 4 to 1. The lubricating properties of this film have been adequately demonstrated under loads ranging from 20 to 3... View full abstract»

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  • Thin-Film Al-Al2O3-Al Capacitors

    Publication Year: 1965, Page(s):267 - 276
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1088 KB)

    A process has been developed to produce A1-Al203-Al capacitors with good yields and suitable properties for use in thin-film circuitry. Tests were conducted to determine the effects that a number of variables have on production yields and capacitor characteristics. This paper reports the optimum found for each variable. The largest improvement inyields was brought about by fo... View full abstract»

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  • New Method in Fabrication of Tantalum Thin-Film Integrated Circuits

    Publication Year: 1965, Page(s):285 - 289
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (680 KB)

    A simple and accurate method in fabrication of tantalum thin-film integrated circuits was developed. In that, after the sheet resistivity of deposited film is adjusted by anodizing its surface, photolithographic processes are carried out successively. View full abstract»

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  • Observations on Fromation of "Cleavage" at Interface Between Glaze Resistor and Termination

    Publication Year: 1965, Page(s):387 - 392
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (960 KB)

    A low-power bench microscope was modified to facilitate direct observation of fusion of paints to make glaze resistors during heating cycles which simulate production and experimental firing cycles. Using this tool, the formation of "cleavage" (clear line of separation between noble-metal glaze resistor and screened-on termination) was studied. The mode of formation of "cleavage" and possible sour... View full abstract»

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  • Component Reliability at Low Stress Levels and the Significance of Failure Mechanisms

    Publication Year: 1965, Page(s):303 - 308
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    In modern electronic equipment, many components operate at stress levels much below their rated values. The factors governing failure, and therefore reliability, may be quite different at these levels from those that apply at the higher levels at which testing is usually performed. Using electrical contacts and dielectric materials as examples, the importance of considering low stress phenomena is... View full abstract»

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  • Sputtered Sulphide Films for Electronic Components

    Publication Year: 1965, Page(s):277 - 284
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (584 KB)

    Two types of sputtering have been used to deposit several II-VI compound materials as thin films suitable for various applications. Both reactive and compound sputtering have yielded stable and reproducible films. In either case doping was accomplished during film deposition. Zinc sulphide films have yielded good capacitors with low dissipation, moderate breakdown voltages and High stability. Pron... View full abstract»

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  • Some Factors Affecting Design, Construction, And Testing of High Reliability Relays

    Publication Year: 1965, Page(s):79 - 83
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (720 KB)

    This paper describes some improvements in design, manufacturing, and testing of 2-pole and 4-pole 5-ampere high reliability relays of low profile and small volume. Design features contributing to long life and high reliability at full load or dry-circuit load include elimination of contact buttons, push-pull actuation rather than spring bias of common contacts, gold plating as a lubricant for arma... View full abstract»

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  • New Electrical Connector Specificaton Answers Space-Age Environmental Needs

    Publication Year: 1965, Page(s):248 - 256
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (840 KB)

    A new Air Force specification for electrical connectors, MIL-C-38300(USAF) has been introduced primarily to meet the high performance demands of advanced aerospace systems. Materials and techniques used to produce connectors that will meet the specified environmental serviceability and reliability requirements are detailed and illustrated. View full abstract»

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  • Thin-Film Hybrids - A Practical Approach to Integrated Circuitry

    Publication Year: 1965, Page(s):63 - 69
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (904 KB)

    Thin-film hybrid circuits are described, and it is shown how, and why they are especially applicable, both practically and economically, in applications where space, weight, power, and operating speed are important considerations. View full abstract»

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  • Universal Component Packaging System

    Publication Year: 1965, Page(s):230 - 236
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1136 KB)

    A packaging system is described which provides for the compatible use of integrated circuits, thin film circuits and conventional components in the synthesis of spaeeborne digital command and data handling equipments. Each of the three categories of components are used in a family of 20 module types which can be used to build decoders, programmers, data multiplexers, analog-to-digital converters, ... View full abstract»

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  • Thin Copper-Clad Laminates for Multi-Layer Printed Circuit Boards

    Publication Year: 1965, Page(s):165 - 168
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (472 KB)

    This paper discusses the production of thin copper-clad laminates which are used in the manufacture of multi-layer printed circuit boards. Copper-clad laminates of conventional thickness are relatively easy to produce, to test and to use, whereas the thin laminates present some problems to both producer and user. These problems as well as the properties of thin laminates are discussed. View full abstract»

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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope