IEEE Transactions on Parts, Materials and Packaging

Issue 1 • June 1965

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Displaying Results 1 - 25 of 50
  • Electrolytic Corrosion of Metallic Resistors

    Publication Year: 1965, Page(s):143 - 148
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (494 KB)

    Metallic resistors are encapsulated mainly for two reasons. Firstly to avoid mechanical damage, secondly to provide protection against moisture. If moisture penetration is not prevented and if at the same time ions are present capable of moving through or along the insulating materials, a resistance change will occur with time, whenever the resistor is subjected to a high relative humidity and a d... View full abstract»

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  • Silicon Oxide Micromodule Capacitors

    Publication Year: 1965, Page(s):186 - 193
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (754 KB)

    Silicon oxide capacitors have been developed on micromodule wafers (O. 3lO-in. sq. with three termination notches per side). Each microelement contains 1, 2, 3, or 4 capacitors with values of 1120 and 560, 180, 100 and 68 pf per capacitor, respectively. The 1120 pf capacitor is double layered. In addition to the general requirements of microelements and micromodules, some of the more important spe... View full abstract»

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  • A Graphical Sequential Weibull Life Test Procedure

    Publication Year: 1965, Page(s):343 - 351
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (714 KB)

    This paper presents a series of graphed sequential tests to be used for testing the joint hypothesis that (the Weibull shape factor)beta=beta0and that (the Weibull scale factor)theta=theta0. These o plans, obtained by simulating life tests on an IBM 7090 computing system, are specified for two sample sizes, five confidence levels, a... View full abstract»

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  • Thin-Film Hybrids - A Practical Approach to Integrated Circuitry

    Publication Year: 1965, Page(s):63 - 69
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (904 KB)

    Thin-film hybrid circuits are described, and it is shown how, and why they are especially applicable, both practically and economically, in applications where space, weight, power, and operating speed are important considerations. View full abstract»

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  • Reactively Sputtered Tantalum Resistors and Capacitors for Silicon Networks

    Publication Year: 1965, Page(s):31 - 44
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1088 KB)

    The protracted contest between solid-state and thin-film microcircuitry proponents appears to be subsiding, due to the recognition that the two techniques really complement each other. Microcircuit manufacturers and users look to hybrid circuits as a good way to achieve Iow-cost, high-performance circuits. The technique, termed "reactive sputtering" of preparing thin films ranging from conductors ... View full abstract»

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  • A High-Accuracy Thin Film PCM Decoder Network Operating at 12 Mc

    Publication Year: 1965, Page(s):45 - 53
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (984 KB)

    A precision tantalum nitride thin film integrated resistor network has been constructed to convert 9-bit parallel binary words to equivalent analog voltages at a rate of 12 megacycles per second. There are 35 precision resistors and 9 matched diode bridges that make up the decoder network. This paper concerns fabrication and performance of the resistor portion of the network. The network was fabri... View full abstract»

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  • New Method in Fabrication of Tantalum Thin-Film Integrated Circuits

    Publication Year: 1965, Page(s):285 - 289
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (680 KB)

    A simple and accurate method in fabrication of tantalum thin-film integrated circuits was developed. In that, after the sheet resistivity of deposited film is adjusted by anodizing its surface, photolithographic processes are carried out successively. View full abstract»

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  • Tolerance Study of Printed-Circuit Process Steps for a Microwave Application

    Publication Year: 1965, Page(s):16 - 27
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1248 KB)

    This study provides tolerance-distribution data for a microwave printed-circuit development utilizing "strip-line" type filters, 50-ohm transmission lines, and tuning stubs. Irradiated polyethylene is the dielectric. Data is given on tolerance distribution in the following process areas: Artwork cutting; Photographic (reduction, exposure and development, contact printing with glass and film, step-... View full abstract»

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  • Some Factors Affecting Design, Construction, And Testing of High Reliability Relays

    Publication Year: 1965, Page(s):79 - 83
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (720 KB)

    This paper describes some improvements in design, manufacturing, and testing of 2-pole and 4-pole 5-ampere high reliability relays of low profile and small volume. Design features contributing to long life and high reliability at full load or dry-circuit load include elimination of contact buttons, push-pull actuation rather than spring bias of common contacts, gold plating as a lubricant for arma... View full abstract»

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  • A New Dried Anodized Aluminum Capacitor

    Publication Year: 1965, Page(s):224 - 229
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (672 KB)

    The capacitance, dissipation factor, resistivity, and dielectric strength of dried anodized aluminum films are discussed. A miniature non polar self healing capacitor using metalized anodic films is described. Construction techniques, performance, and ratings are presented. View full abstract»

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  • Put Engineering Efforts Back in Reliability Techniques

    Publication Year: 1965, Page(s):297 - 302
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (776 KB)

    Conventional statistical reliability techniques are a necessary condition of reliability. They are, however, insufficient and inadequate. Other reliability techniques are needed to turn a feasibly designed system into a completely successful one. The implementation of these techniques is lagging. They have not as yet been unified on an industry-wide basis. They must be implemented and unified, how... View full abstract»

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  • Improving the Confidence Level of Microwave Attenuation Measurements

    Publication Year: 1965, Page(s):332 - 342
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (960 KB)

    Stringent contractual specifications covering complex radar, communications, and space probe systems frequently call for accuracies beyond those derived from existing standards. In many cases, the true value of a standard is not exactly known: in addition, uncertainties are incurred during a measurement process. These, along with the hierarchy of calibrations from higher-to lower-echelon testing l... View full abstract»

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  • Embedment of Electronic Modules by Transfer Molding

    Publication Year: 1965, Page(s):169 - 177
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1120 KB)

    One of the latest and most interesting techniques in the use of plastics for electronic packaging is the total embedment of an assembled circuit in a closed mold, utilizing a transfer molding press. This technique uses a combination of heat and pressure to liquefy a powdered or granular plastic compound in a transfer pot, and subsequent introduction of the plastic into the mold cavity while mainta... View full abstract»

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  • Sputtered Sulphide Films for Electronic Components

    Publication Year: 1965, Page(s):277 - 284
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (584 KB)

    Two types of sputtering have been used to deposit several II-VI compound materials as thin films suitable for various applications. Both reactive and compound sputtering have yielded stable and reproducible films. In either case doping was accomplished during film deposition. Zinc sulphide films have yielded good capacitors with low dissipation, moderate breakdown voltages and High stability. Pron... View full abstract»

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  • Gard - A New Era of Component Testing

    Publication Year: 1965, Page(s):320 - 326
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1024 KB)

    This paper describes the GARD test theory and associated test instrument which is proposed as a means of economically replacing present burnin screening tests for resistive components. The total test requires approximately 5 seconds and offers a new and improved concept of temperature coefficient of resistance measurement in addition to the high reliability screening capability. This test is appli... View full abstract»

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  • Ceramic Substrates for Microcircuitry

    Publication Year: 1965, Page(s):264 - 266
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (280 KB)

    Ceramic substrates for housing microelectronic circuits must be extremely stable electrically and mechanically. They should also exhibit good thermal and mechanical shock resistance in order to withstand not only process steps encountered in fabricating microcircuits on their surfaces, but also subsequent environmental applications. Chemical activity requirements have also been imposed on the subs... View full abstract»

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  • Plasma Anodized Lanthanum Titanate Films

    Publication Year: 1965, Page(s):10 - 15
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (536 KB)

    This paper discusses the application of plasma anodization to the pyrochlore, lanthanum titanate (La2Ti2O7), and the use of this material as a thin film dielectric. The process involves co-evaporation of the metals, lanthanum and titanium, followed by plasma anodization. Evaporation and anodization techniques are fully discussed as are the electrical properties of ... View full abstract»

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  • Elecromagnetic Relay Reliability Predictions by Designed Life Experiments and Weibull Analysis

    Publication Year: 1965, Page(s):309 - 319
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1248 KB)

    The complexity of their failure mechanisms, the significant interaction effects of numerous operating parameters, and high test costs have led to many elaborate, expensive, time consuming, and often ineffective, test programs to characterize the life expectancy of specific relay designs under a variety of application conditions. This paper describes a program wherein a series of life tests of a ne... View full abstract»

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  • Thin-Film Al-Al2O3-Al Capacitors

    Publication Year: 1965, Page(s):267 - 276
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1088 KB)

    A process has been developed to produce A1-Al203-Al capacitors with good yields and suitable properties for use in thin-film circuitry. Tests were conducted to determine the effects that a number of variables have on production yields and capacitor characteristics. This paper reports the optimum found for each variable. The largest improvement inyields was brought about by fo... View full abstract»

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  • Heterogeneities in Anodic Oxide Films on Tantalum - Their Detection and Electrical Characteristics

    Publication Year: 1965, Page(s):70 - 78
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1064 KB)

    A print-out technique was used to study the electronic conductivity of anodic oxide films and, in particular, the electronic conductivity associated with heterogeneities in the oxide film. Tantalum foil was used in the "as received" state, after chemical polishing, abraded, heated in air, and carburized to show the electronic current of defects as a function of formation voltage (film thickness), ... View full abstract»

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  • Influence of Themal Strains on Temperature Coefficient of Bulk Metal Film Resistors

    Publication Year: 1965, Page(s):158 - 164
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (640 KB)

    The main properties of a new bulk metal film resistor have been previously presented at the Electronic Components Conference in Washington, May 6, 1964. In particular, it was shown that this resistor has an extremely low and controllable temperature coefficient of resistance. In the present paper a rigorous mathematical treatment of temperature coefficient changes in bulk metal film resistors due ... View full abstract»

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  • Nanosecond Pulse Circuit Board Interconnections

    Publication Year: 1965, Page(s):359 - 370
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (1096 KB)

    The difficulties involved in using mating connectors to interconnect nanosecond pulse circuit boards are discussed. The effects of such connectors on pulse characteristics may be predicted by the techniques presented in this article. Experimental verification of predicted performance is presented in the form of photographs through the use of time domain reflectometry. The connector used to illustr... View full abstract»

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  • The Gaseous Anodization of Aluminum

    Publication Year: 1965, Page(s):217 - 223
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (728 KB)

    Gaseous anodization of aluminum has been investigated as an alternative procedure to forming thin oxide films by such standard techniques as electrolytic anodization and air oxidation. Oxide films are formed on an aluminum surface when positioned in the plateau region of a glow discharge of oxygen. Process variables such as the oxygen pressure and the applied voltage are found to affect the time f... View full abstract»

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  • Impact of Microminiaturization on Printed Circuit Boards

    Publication Year: 1965, Page(s):352 - 358
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (888 KB)

    First Page of the Article
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  • Reliability Improvement in Pulse Transformers

    Publication Year: 1965, Page(s):103 - 108
    Request permission for commercial reuse | Click to expandAbstract |PDF file iconPDF (768 KB)

    As part of the NASA Orbiting Geophysical Observatory (OGO) program, an investigation was made of failure mechanisms in miniature pulse transformers, a type commonly used for drive pulse coupling in low-power digital circuitry. The resulting corrective action methods are useful for reliability improvement in other similar magnetic devices and components. Failures were traced to breaks in small diam... View full abstract»

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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope