IEEE Transactions on Parts, Materials and Packaging

Issue 1 • June 1965

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Displaying Results 1 - 25 of 50
  • Electrolytic Corrosion of Metallic Resistors

    Publication Year: 1965, Page(s):143 - 148
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (494 KB)

    Metallic resistors are encapsulated mainly for two reasons. Firstly to avoid mechanical damage, secondly to provide protection against moisture. If moisture penetration is not prevented and if at the same time ions are present capable of moving through or along the insulating materials, a resistance change will occur with time, whenever the resistor is subjected to a high relative humidity and a d... View full abstract»

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  • Silicon Oxide Micromodule Capacitors

    Publication Year: 1965, Page(s):186 - 193
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (754 KB)

    Silicon oxide capacitors have been developed on micromodule wafers (O. 3lO-in. sq. with three termination notches per side). Each microelement contains 1, 2, 3, or 4 capacitors with values of 1120 and 560, 180, 100 and 68 pf per capacitor, respectively. The 1120 pf capacitor is double layered. In addition to the general requirements of microelements and micromodules, some of the more important spe... View full abstract»

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  • A Graphical Sequential Weibull Life Test Procedure

    Publication Year: 1965, Page(s):343 - 351
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (714 KB)

    This paper presents a series of graphed sequential tests to be used for testing the joint hypothesis that (the Weibull shape factor)beta=beta0and that (the Weibull scale factor)theta=theta0. These o plans, obtained by simulating life tests on an IBM 7090 computing system, are specified for two sample sizes, five confidence levels, a... View full abstract»

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  • A Thin Film Lubricant for Connector Contacts

    Publication Year: 1965, Page(s):1 - 9
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1112 KB)

    A thin film lubricant has been developed for gold plated contacts. This film is Octadecylamine-hydrochloride (ODA·HCL), and it exhibits excellent adherence to gold surfaces. The friction between solid gold surfaces and gold plated surfaces was reduced by a factor of approximately 4 to 1. The lubricating properties of this film have been adequately demonstrated under loads ranging from 20 to 3... View full abstract»

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  • Nanosecond Pulse Circuit Board Interconnections

    Publication Year: 1965, Page(s):359 - 370
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1096 KB)

    The difficulties involved in using mating connectors to interconnect nanosecond pulse circuit boards are discussed. The effects of such connectors on pulse characteristics may be predicted by the techniques presented in this article. Experimental verification of predicted performance is presented in the form of photographs through the use of time domain reflectometry. The connector used to illustr... View full abstract»

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  • A High-Accuracy Thin Film PCM Decoder Network Operating at 12 Mc

    Publication Year: 1965, Page(s):45 - 53
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (984 KB)

    A precision tantalum nitride thin film integrated resistor network has been constructed to convert 9-bit parallel binary words to equivalent analog voltages at a rate of 12 megacycles per second. There are 35 precision resistors and 9 matched diode bridges that make up the decoder network. This paper concerns fabrication and performance of the resistor portion of the network. The network was fabri... View full abstract»

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  • Use of Devitrification for Improved Structure in Ceramics

    Publication Year: 1965, Page(s):28 - 30
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (328 KB)

    The devitrification process, which entails fritting the complete composition, preparing specimens of the powdered glass, and firing, has resulted in markedly improved structure in ceramics. This is the result of mixing of the composition on an atomic basis, retaining a randomly oriented structure in the fritted raw material, forming the basic crystalline phase by devitrification during a subsequen... View full abstract»

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  • Put Engineering Efforts Back in Reliability Techniques

    Publication Year: 1965, Page(s):297 - 302
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    Conventional statistical reliability techniques are a necessary condition of reliability. They are, however, insufficient and inadequate. Other reliability techniques are needed to turn a feasibly designed system into a completely successful one. The implementation of these techniques is lagging. They have not as yet been unified on an industry-wide basis. They must be implemented and unified, how... View full abstract»

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  • A New Dried Anodized Aluminum Capacitor

    Publication Year: 1965, Page(s):224 - 229
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (672 KB)

    The capacitance, dissipation factor, resistivity, and dielectric strength of dried anodized aluminum films are discussed. A miniature non polar self healing capacitor using metalized anodic films is described. Construction techniques, performance, and ratings are presented. View full abstract»

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  • Gard - A New Era of Component Testing

    Publication Year: 1965, Page(s):320 - 326
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1024 KB)

    This paper describes the GARD test theory and associated test instrument which is proposed as a means of economically replacing present burnin screening tests for resistive components. The total test requires approximately 5 seconds and offers a new and improved concept of temperature coefficient of resistance measurement in addition to the high reliability screening capability. This test is appli... View full abstract»

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  • Measurement of Internal Stresses in Encapsulated Electronic Modules

    Publication Year: 1965, Page(s):178 - 185
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (648 KB)

    The development of a hydrostatically-pressure sensitive transducer with dimensions much smaller than conventional pigtailed electronic components has made possible the measurement of environmentally-induced stresses in encapsulated electronic modules. Such measurements for a few encapsulants have shown large changes in internal stresses with small changes in ambient temperature, a shift in the str... View full abstract»

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  • Design of Solid-State Radar Transmitter Units for the Lunar Excursion Module

    Publication Year: 1965, Page(s):257 - 263
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (896 KB)

    The design of all-solid-state radar transmitters for satisfactory performance in trans-lunar space or on the lunar surface poses many problems, the solution of which provides beneficial fallout for other applications. This paper discusses the design considerations which were combined to produce a highly reliable end sophisticated package adapted to accomplish, for a lunar excursion mission profile... View full abstract»

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  • Printed Circuit Connectors from Microassemblies

    Publication Year: 1965, Page(s):371 - 380
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (968 KB)

    First Page of the Article
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  • Impact of Microminiaturization on Printed Circuit Boards

    Publication Year: 1965, Page(s):352 - 358
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (888 KB)

    First Page of the Article
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  • Embedment of Electronic Modules by Transfer Molding

    Publication Year: 1965, Page(s):169 - 177
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1120 KB)

    One of the latest and most interesting techniques in the use of plastics for electronic packaging is the total embedment of an assembled circuit in a closed mold, utilizing a transfer molding press. This technique uses a combination of heat and pressure to liquefy a powdered or granular plastic compound in a transfer pot, and subsequent introduction of the plastic into the mold cavity while mainta... View full abstract»

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  • Ceramic Substrates for Microcircuitry

    Publication Year: 1965, Page(s):264 - 266
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (280 KB)

    Ceramic substrates for housing microelectronic circuits must be extremely stable electrically and mechanically. They should also exhibit good thermal and mechanical shock resistance in order to withstand not only process steps encountered in fabricating microcircuits on their surfaces, but also subsequent environmental applications. Chemical activity requirements have also been imposed on the subs... View full abstract»

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  • Life Testing of Electronic Power Transformers

    Publication Year: 1965, Page(s):95 - 102
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1040 KB)

    First Page of the Article
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  • Reliability Cost Effectiveness Through Parts Control and Standardization

    Publication Year: 1965, Page(s):327 - 331
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    Early in the F-lll design effort, an F-lll Parts Control and Standardization Program was developed and implemented through a team of electronic parts specialists from General Dynamics and 12 of the major electronic equipment contractors. Basic objectives of the team were (1) the standardization of common electronic parts by joint evaluation, selection, and use of preferred part types, (2) the prep... View full abstract»

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  • The Gaseous Anodization of Aluminum

    Publication Year: 1965, Page(s):217 - 223
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    Gaseous anodization of aluminum has been investigated as an alternative procedure to forming thin oxide films by such standard techniques as electrolytic anodization and air oxidation. Oxide films are formed on an aluminum surface when positioned in the plateau region of a glow discharge of oxygen. Process variables such as the oxygen pressure and the applied voltage are found to affect the time f... View full abstract»

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  • Poly-Para-Xylylene in Thin Film Applications

    Publication Year: 1965, Page(s):54 - 62
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (928 KB)

    First Page of the Article
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  • Thermal Processing of Tantalum Nitride Resistors

    Publication Year: 1965, Page(s):123 - 128
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    A study of the thermal oxidation of tantalum nitride (Ta-N) thin films has led to the development of a thermal processing technique by which these metal films can be made to exhibit superior resistor characteristics. The thermal process simply involves heating the Ta-N film resistors in air at some temperature between 450° and 700°C. Radiant heating has been found to be most convenient f... View full abstract»

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  • Elecromagnetic Relay Reliability Predictions by Designed Life Experiments and Weibull Analysis

    Publication Year: 1965, Page(s):309 - 319
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1248 KB)

    The complexity of their failure mechanisms, the significant interaction effects of numerous operating parameters, and high test costs have led to many elaborate, expensive, time consuming, and often ineffective, test programs to characterize the life expectancy of specific relay designs under a variety of application conditions. This paper describes a program wherein a series of life tests of a ne... View full abstract»

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  • Improving the Confidence Level of Microwave Attenuation Measurements

    Publication Year: 1965, Page(s):332 - 342
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (960 KB)

    Stringent contractual specifications covering complex radar, communications, and space probe systems frequently call for accuracies beyond those derived from existing standards. In many cases, the true value of a standard is not exactly known: in addition, uncertainties are incurred during a measurement process. These, along with the hierarchy of calibrations from higher-to lower-echelon testing l... View full abstract»

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  • Factors Influencing the Current Rating of R-F Capacitors

    Publication Year: 1965, Page(s):205 - 209
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    R. F. tests were run on a large number of capacitors to determine practical ratings, define operating characteristics and optimize design. Frequency and thermal effects were encountered and analyzed mathematically. A system for reporting rating characteristics was developed, a derating curve was derived and factors influencing operation were defined. View full abstract»

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  • Failure Mechanism of High Energy Surge Resistors

    Publication Year: 1965, Page(s):136 - 142
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (544 KB)

    Failure mechanisms of high power noninductive ceramic resistors in high energy, and in high voltage surge applications, have been investigated. These studies have determined the fundamental cause of failure to be that of thermal shock propagation caused by the discharge of large amounts of stored energy in a short period of time. When the surge energies are maintained at low levels, peak voltages ... View full abstract»

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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope