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IEEE Transactions on Parts, Materials and Packaging

Issue 1 • Jun 1965

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Displaying Results 1 - 25 of 50
  • Embedment of Electronic Modules by Transfer Molding

    Publication Year: 1965, Page(s):169 - 177
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1120 KB)

    One of the latest and most interesting techniques in the use of plastics for electronic packaging is the total embedment of an assembled circuit in a closed mold, utilizing a transfer molding press. This technique uses a combination of heat and pressure to liquefy a powdered or granular plastic compound in a transfer pot, and subsequent introduction of the plastic into the mold cavity while mainta... View full abstract»

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  • Silicon Oxide Micromodule Capacitors

    Publication Year: 1965, Page(s):186 - 193
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    Silicon oxide capacitors have been developed on micromodule wafers (O. 3lO-in. sq. with three termination notches per side). Each microelement contains 1, 2, 3, or 4 capacitors with values of 1120 and 560, 180, 100 and 68 pf per capacitor, respectively. The 1120 pf capacitor is double layered. In addition to the general requirements of microelements and micromodules, some of the more important spe... View full abstract»

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  • Thin Copper-Clad Laminates for Multi-Layer Printed Circuit Boards

    Publication Year: 1965, Page(s):165 - 168
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (472 KB)

    This paper discusses the production of thin copper-clad laminates which are used in the manufacture of multi-layer printed circuit boards. Copper-clad laminates of conventional thickness are relatively easy to produce, to test and to use, whereas the thin laminates present some problems to both producer and user. These problems as well as the properties of thin laminates are discussed. View full abstract»

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  • New High Peformance Aluminum Electrolytic Capacitors

    Publication Year: 1965, Page(s):210 - 216
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (688 KB)

    The shortcomings of convention aluminum electrolytic capacitors are discussed, in particular their lack of stability and limited temperature range. A new type of aluminum electrolytic capacitor is described of high stability and an operating temperature range from -55°C to +125°C. It owes its superior performance characteristics to the development of a new electrolyte system representing... View full abstract»

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  • Measurement of Internal Stresses in Encapsulated Electronic Modules

    Publication Year: 1965, Page(s):178 - 185
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (648 KB)

    The development of a hydrostatically-pressure sensitive transducer with dimensions much smaller than conventional pigtailed electronic components has made possible the measurement of environmentally-induced stresses in encapsulated electronic modules. Such measurements for a few encapsulants have shown large changes in internal stresses with small changes in ambient temperature, a shift in the str... View full abstract»

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  • Properties and Performance of Tantalum Oxide Thin Film Capacitors

    Publication Year: 1965, Page(s):194 - 204
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (992 KB)

    Tantalum oxide ~hin film capacitors of approximately 10* ~f were prepared by anodization of sputtered tantalum films and vacuum evaporation of gold counterelectrodes. Initial leakage currents at 75 v d.c. were obtained and the capacitors were placed on a constant voltage life test. The variables studied were anodization voltage (100v-300v), life test voltage (lOv-65v) and life test temperature (RT... View full abstract»

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  • Gard - A New Era of Component Testing

    Publication Year: 1965, Page(s):320 - 326
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1024 KB)

    This paper describes the GARD test theory and associated test instrument which is proposed as a means of economically replacing present burnin screening tests for resistive components. The total test requires approximately 5 seconds and offers a new and improved concept of temperature coefficient of resistance measurement in addition to the high reliability screening capability. This test is appli... View full abstract»

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  • Factors Influencing the Current Rating of R-F Capacitors

    Publication Year: 1965, Page(s):205 - 209
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    R. F. tests were run on a large number of capacitors to determine practical ratings, define operating characteristics and optimize design. Frequency and thermal effects were encountered and analyzed mathematically. A system for reporting rating characteristics was developed, a derating curve was derived and factors influencing operation were defined. View full abstract»

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  • Failure Mechanism of High Energy Surge Resistors

    Publication Year: 1965, Page(s):136 - 142
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (544 KB)

    Failure mechanisms of high power noninductive ceramic resistors in high energy, and in high voltage surge applications, have been investigated. These studies have determined the fundamental cause of failure to be that of thermal shock propagation caused by the discharge of large amounts of stored energy in a short period of time. When the surge energies are maintained at low levels, peak voltages ... View full abstract»

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  • Heterogeneities in Anodic Oxide Films on Tantalum - Their Detection and Electrical Characteristics

    Publication Year: 1965, Page(s):70 - 78
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1064 KB)

    A print-out technique was used to study the electronic conductivity of anodic oxide films and, in particular, the electronic conductivity associated with heterogeneities in the oxide film. Tantalum foil was used in the "as received" state, after chemical polishing, abraded, heated in air, and carburized to show the electronic current of defects as a function of formation voltage (film thickness), ... View full abstract»

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  • A New Dried Anodized Aluminum Capacitor

    Publication Year: 1965, Page(s):224 - 229
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (672 KB)

    The capacitance, dissipation factor, resistivity, and dielectric strength of dried anodized aluminum films are discussed. A miniature non polar self healing capacitor using metalized anodic films is described. Construction techniques, performance, and ratings are presented. View full abstract»

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  • Thin-Film Al-Al2O3-Al Capacitors

    Publication Year: 1965, Page(s):267 - 276
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1088 KB)

    A process has been developed to produce A1-Al203-Al capacitors with good yields and suitable properties for use in thin-film circuitry. Tests were conducted to determine the effects that a number of variables have on production yields and capacitor characteristics. This paper reports the optimum found for each variable. The largest improvement inyields was brought about by fo... View full abstract»

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  • Thermal Processing of Tantalum Nitride Resistors

    Publication Year: 1965, Page(s):123 - 128
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    A study of the thermal oxidation of tantalum nitride (Ta-N) thin films has led to the development of a thermal processing technique by which these metal films can be made to exhibit superior resistor characteristics. The thermal process simply involves heating the Ta-N film resistors in air at some temperature between 450° and 700°C. Radiant heating has been found to be most convenient f... View full abstract»

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  • A Corona Free High Voltage Feedthrough Terminal Design for Electronic Applications

    Publication Year: 1965, Page(s):84 - 94
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (872 KB)

    This paper reports the development of an alumina ceramic feedthrough terminal for use on Electronic Components that is corona free to its external flashover voltage. Comparing this flashover voltage to the corona start voltage of similar size conventional terminals, this represents an improvement of more than four to one. The improvement has been gained by shielding the air near the critical mount... View full abstract»

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  • A Discrete Tantalum Nitride Thin Film Resistor on a Flat Embossed Ceramic Substrate

    Publication Year: 1965, Page(s):129 - 135
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    A newly developed tantalum nitride thin film resistor is being evaluated that uses an unglazed flat ceramic substrate with a pattern for the resistive element embossed into its surface. The resistive element is the sputtered tantalum nitride film with its inherent low temperature coefficient of resistance and high stability over long term load life. The design is such that it eliminates the use of... View full abstract»

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  • Reliability Improvement in Pulse Transformers

    Publication Year: 1965, Page(s):103 - 108
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    As part of the NASA Orbiting Geophysical Observatory (OGO) program, an investigation was made of failure mechanisms in miniature pulse transformers, a type commonly used for drive pulse coupling in low-power digital circuitry. The resulting corrective action methods are useful for reliability improvement in other similar magnetic devices and components. Failures were traced to breaks in small diam... View full abstract»

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  • Electrolytic Corrosion of Metallic Resistors

    Publication Year: 1965, Page(s):143 - 148
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (504 KB)

    Metallic resistors are encapsulated mainly for two reasons. Firstly to avoid mechanical damage, secondly to provide protection against moisture. If moisture penetration is not prevented and if at the same time ions are present capable of moving through or along the insulating materials, a resistance change will occur with time, whenever the resistor is subjected to a high relative humidity and a d... View full abstract»

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  • Communication Transformer Engineering by Computer

    Publication Year: 1965, Page(s):115 - 122
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    This paper describes a program for designing communication transformers on a digital computer. The program accepts circuit requirements for transformers, calculates the limiting values of the transformer parameters needed to meet these requirements, searches for existing designs, designs new transformers, verifies that new or old transformers will meet the requirements, characterizes new designs f... View full abstract»

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  • Adhesion of Platinum-Gold Glaze Conductors

    Publication Year: 1965, Page(s):381 - 386
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    The present work studies the time-temperature relationships of adhesion for typical platinum-gold glaze conductors. An empirical equation is derived from which it is possible to calculate the optimum time and temperature of firing. It is shown that the effects of two firings must be taken into account in choosing primary firing conditions. Adhesion was studied as a function of time at elevated tem... View full abstract»

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  • Tolerance Study of Printed-Circuit Process Steps for a Microwave Application

    Publication Year: 1965, Page(s):16 - 27
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1248 KB)

    This study provides tolerance-distribution data for a microwave printed-circuit development utilizing "strip-line" type filters, 50-ohm transmission lines, and tuning stubs. Irradiated polyethylene is the dielectric. Data is given on tolerance distribution in the following process areas: Artwork cutting; Photographic (reduction, exposure and development, contact printing with glass and film, step-... View full abstract»

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  • New Electrical Connector Specificaton Answers Space-Age Environmental Needs

    Publication Year: 1965, Page(s):248 - 256
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (840 KB)

    A new Air Force specification for electrical connectors, MIL-C-38300(USAF) has been introduced primarily to meet the high performance demands of advanced aerospace systems. Materials and techniques used to produce connectors that will meet the specified environmental serviceability and reliability requirements are detailed and illustrated. View full abstract»

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  • Reactively Sputtered Tantalum Resistors and Capacitors for Silicon Networks

    Publication Year: 1965, Page(s):31 - 44
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1088 KB)

    The protracted contest between solid-state and thin-film microcircuitry proponents appears to be subsiding, due to the recognition that the two techniques really complement each other. Microcircuit manufacturers and users look to hybrid circuits as a good way to achieve Iow-cost, high-performance circuits. The technique, termed "reactive sputtering" of preparing thin films ranging from conductors ... View full abstract»

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  • Environmental and Life Testing of High Reliability Magnetic Components

    Publication Year: 1965, Page(s):109 - 114
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    Over 2.5 million hours of life test have been accumulated in the process of manufacturing High Reliability Magnetic Components for Missile and Space Programs. These units were manufactured under a High Reliability Program and were subjected to qualification and acceptance tests as required by the customer's specifications. The compiled life hours is composed of twenty-five electrical specification... View full abstract»

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  • Nanosecond Pulse Circuit Board Interconnections

    Publication Year: 1965, Page(s):359 - 370
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1096 KB)

    The difficulties involved in using mating connectors to interconnect nanosecond pulse circuit boards are discussed. The effects of such connectors on pulse characteristics may be predicted by the techniques presented in this article. Experimental verification of predicted performance is presented in the form of photographs through the use of time domain reflectometry. The connector used to illustr... View full abstract»

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  • The Gaseous Anodization of Aluminum

    Publication Year: 1965, Page(s):217 - 223
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (728 KB)

    Gaseous anodization of aluminum has been investigated as an alternative procedure to forming thin oxide films by such standard techniques as electrolytic anodization and air oxidation. Oxide films are formed on an aluminum surface when positioned in the plateau region of a glow discharge of oxygen. Process variables such as the oxygen pressure and the applied voltage are found to affect the time f... View full abstract»

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Aims & Scope

This Transaction ceased production in 1971. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope