IEEE.org| IEEE Xplore Digital Library| IEEE Standards| IEEE Spectrum| More Sites

Cart (Loading....) | Create Account | Sign In

Author Search^beta | Advanced Search | Preferences | | More Search Options

Browse Journals & Magazines > Parts, Materials and Packaging ... Volume 1 Issue 1

Parts, Materials and Packaging, IEEE Transactions on

| Create Account

IEEE Account

Change Username/Password
Update Address

Purchase Details

Payment Options
Order History
Access Purchased Documents

Profile Information

Communications Preferences
Profession and Education
Technical Interests

Need Help?

US & Canada: +1 800 678 4333
Worldwide: +1 732 981 0060
Contact & Support

A not-for-profit organization, IEEE is the world's largest professional association for the advancement of technology.
© Copyright 2013 IEEE - All rights reserved. Use of this web site signifies your agreement to the terms and conditions.

Please enter a valid username or password.

For Institutional Users:

More Search Options

Parts, Materials and Packaging, IEEE Transactions on

Issue 1 • Date Jun 1965

Filter Results

You have selected:

You have selected:

Title History

Measurement of Internal Stresses in Encapsulated Electronic Modules

A New Dried Anodized Aluminum Capacitor

Use of Devitrification for Improved Structure in Ceramics

Design of Solid-State Radar Transmitter Units for the Lunar Excursion Module

Component Reliability at Low Stress Levels and the Significance of Failure Mechanisms

Thin Copper-Clad Laminates for Multi-Layer Printed Circuit Boards

Electrolytic Corrosion of Metallic Resistors

Thermal Processing of Tantalum Nitride Resistors

Reliability Improvement in Pulse Transformers

Elecromagnetic Relay Reliability Predictions by Designed Life Experiments and Weibull Analysis

Silicon Oxide Micromodule Capacitors

Resistor Dimensions and Power Dissipation

Plasma Anodized Lanthanum Titanate Films

A Corona Free High Voltage Feedthrough Terminal Design for Electronic Applications

Thin-Film Al-Al2O3-Al Capacitors

New Electrical Connector Specificaton Answers Space-Age Environmental Needs

Poly-Para-Xylylene in Thin Film Applications

Embedment of Electronic Modules by Transfer Molding

New Method in Fabrication of Tantalum Thin-Film Integrated Circuits

Sputtered Sulphide Films for Electronic Components

Failure Mechanism of High Energy Surge Resistors

The Gaseous Anodization of Aluminum

Gard - A New Era of Component Testing

Factors Influencing the Current Rating of R-F Capacitors

Influence of Themal Strains on Temperature Coefficient of Bulk Metal Film Resistors

Aims & Scope

Further Links

IEEE Account

Purchase Details

Profile Information

Need Help?