By Topic

IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 3 • Date September 1978

Filter Results

Displaying Results 1 - 21 of 21
  • Who's Who in CHMT

    Publication Year: 1978, Page(s): 201
    Request permission for commercial reuse | PDF file iconPDF (72 KB)
    Freely Available from IEEE
  • Foreword

    Publication Year: 1978, Page(s): 202
    Request permission for commercial reuse | PDF file iconPDF (119 KB)
    Freely Available from IEEE
  • Clarification to "Environmental Tests for Connectors and Contact Materials:An Evaluation of a Method Involving Sulphur Dioxide"

    Publication Year: 1978, Page(s): 325
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (77 KB)

    First Page of the Article
    View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • A Field Study of the Electrical Performance of Separable Connectors

    Publication Year: 1978, Page(s):286 - 296
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1632 KB)

    A three-year study of separable electronic connectors in operating telephone equipment was conducted to determine failure mechanisms and rates of presently used designs. The study of nine different connector types (six of which are reported) was carried out in four cities, and higher than expected contact resistances were observed. These were due to factory contaimination and not pore corrosion as... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Aluminum Wire to Thick-Film Connections for High-Temperature Operation

    Publication Year: 1978, Page(s):219 - 222
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (656 KB)

    Hybrid microcircuits in geothermal instrumentation must operate from room temperature to 300°C. Bond failure occurred during operation of initial geothermal circuits due to intermetallic growth at the aluminum wire-to-gold conductor interface. To remedy this problem, two wire bonding techniques have been qualified in high-temperature aging tests: 1) ultrasonic bonding of aluminum wire directl... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Nondestructive Examination of Multilayer Capacitors by Neutron Radiography

    Publication Year: 1978, Page(s):265 - 273
    Cited by:  Papers (5)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1208 KB)

    Multilayer ceramic capacitors are being used in an increasing number of critical applications. Therefore the need to ensure their reliable operation is also increasing. Internal delaminations decrease reliable operation. The use of neutron radiography as a nondestructive screening technique for detecting delaminations in multilayer capacitors is discussed. Experiments identifying requirements for ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Design and Performance Considerations for Single-Fiber Multichannel Environmental Connectors

    Publication Year: 1978, Page(s):282 - 285
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (696 KB)

    An eight-channel circular environmentally sealed fiberoptic connector has been developed for small diameter (125 µm) single fibers using a number 18 plug and receptacle shell from the Amphenol® MerlinTMIII series. A brief explanation of the factors that effect coupling efficiency is offered. A loss budget is established that includes the cable-related losses associated with fi... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Nondestructive Bond Pull in High-Reliability Applications

    Publication Year: 1978, Page(s):228 - 236
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1144 KB)

    The problem of producing reliable thermocompression gold ball bonds to aluminum metallization has been discussed by many authors. In most of these discussions, little information is provided to relate bond reliability to process parameters-cleanliness and bonder settings. The influence of bond and capillary temperatures upon bond integrity is discussed. The use of beryllia capillaries to achieve t... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Enhancing Ultrasonic Bond Development

    Publication Year: 1978, Page(s):211 - 219
    Cited by:  Papers (33)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1976 KB)

    To enhance ultrasonic bond development, an improved understanding is needed of the processes taking place at the bond interface. This work is designed to determine the role that bonding parameters play in contributing to bond development. Of particular concern are the effects created by the machine variables, i.e., load, power, and time. Silicon was selected as a bond surface for aluminum wire bon... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • High-Frequency Measurement of Q-Factors of Ceramic Chip Capacitors

    Publication Year: 1978, Page(s):257 - 264
    Cited by:  Papers (9)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1424 KB)

    No reliable instrumentation systems have been available for the measurement of capacitor properties, particularly Q-factor, in applications requiring operation in the 100-1000 MHz range. The production of large numbers of multilayer ceramic chip capacitors for such special use is a very recent development. The need for reliable measurement equipment is increasing both for purposes of device evalua... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Acoustic Microscopy of Ceramic Capacitors

    Publication Year: 1978, Page(s):251 - 257
    Cited by:  Papers (9)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1616 KB)

    The acoustic microscope has been shown to be a powerful new tool for characterizing nondestructively the internal structure of multilayer ceramic capacitors. Delamination resolution has been shown to be greater than is available with other current techniques. This tool is sensitive to erratic electrode stacking, ceramic margins, termination quality, and other defects. As such, it is already useful... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Chip-Module Package Interfaces

    Publication Year: 1978, Page(s):305 - 309
    Cited by:  Papers (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1096 KB)

    The direction of progress for printed circuit board technology is illustrated through a design example using LSI chips and multichip modules. The interface requirements between the chips and modules and between the modules and the printed-circuit board are described. The use of large-scale integrated circuits in large systems is shown to require substantial increases in interconnection density at ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Bonded Gold Fingers as a Low-Cost Alternative to Patterned Edgeboard Fingers for General PWB use

    Publication Year: 1978, Page(s):274 - 281
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1424 KB)

    The conventional means by which a plug-in printed wiring board is electrically connected to its mating backplane connector is by means of patterned and plated fingers at the edge of the printed wiring board (PWB). These fingers are usually an extension of the patterning of the board itself and are plated with a sequence of metallization layers to provide low-contact resistance between the mating p... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Characteristics of an Indium-Tin Oxide Transparent Conductor Deposited from Organometallic Compositions

    Publication Year: 1978, Page(s):237 - 241
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (688 KB)

    The characteristics of an organometallic formulation are described that may be suitable for forming the transparent electrodes of liquid crystal and other displays directly by screen printing. When printed on glass and fired at approximately 550°C, a thin film of In2-xSnxO3-ysemiconducting oxide approximately 2500 Å thick is obtained. The sheet resistance... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • High-Reliability Thermocompression Bonding for Hybrid Applications

    Publication Year: 1978, Page(s):223 - 227
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (648 KB)

    The problem of producing reliable thennocomprassion gold ball bonds to aluminum metallization has been discussed by many authors. In most of these discussions, little information is provided to relate bond reliability to process parameters-cleanliness and bonder settings. The influence of bond and capillary temperatures upon bond integrity is discussed. The use of beryllia capillaries to achieve t... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Chip Carriers as a Means for High-Density Packaging

    Publication Year: 1978, Page(s):297 - 304
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2072 KB)

    For many years now, the system designer has had to weigh the low yield, small size, and high cost of multichip hybrids against the relatively low cost, but high weight and volume of conventional dual-in-line package/printed wiring board (DIP/PWB) assemblies when dealing with complex, high-density system functions. Texas Instruments' approach to solving this problem is described using chip-carrier ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The Microelectronic Wire Bond Pull Test-How to use It, How to Abuse It

    Publication Year: 1978, Page(s):203 - 210
    Cited by:  Papers (28)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1464 KB)

    The wire bond pull test is the most universally accepted method for controlling the quality of the wire bonding operation, and thereby offering added assurance that semiconductor devices will not fail in the field due to weak wire bonds. Specific test procedures and pull-force values are called out in military and other device purchase specifications, and yet there has never been a carefully contr... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Analysis of an Interference-Fit Pin Connection

    Publication Year: 1978, Page(s):248 - 251
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (552 KB)

    Under a simplifying but reasonably justified assumption of noninterference from the adjoining pins, a mathematical analysis of an interference-fit pin connection in a backplane for the initial contact force is presented. Effects of pin shape, stiffness, interference fit, hole shape, and plate material are included in the study. A closed form solution is obtained for estimating the initial contact ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The Application of Finite Element Techniques to the Analysis of Distributed RC Networks

    Publication Year: 1978, Page(s):309 - 315
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (768 KB)

    Nonuniform distributed RC networks have been modeled using finite elements, and the resulting system of equations have been solved using a frontal solution. This considerably reduces both the number of mathematical operations and the amount of computer storage when compared with the full matrix method. The accuracy of the proposed model is demonstrated by modeling a uniform network and showing tha... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Reliability Evaluation and Failure Analysis for Multilayer Ceramic Chip Capacitors

    Publication Year: 1978, Page(s):316 - 324
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1152 KB)

    Reliability evaluation tests for multilayer ceramic chip capacitors mounted on a hybrid IC were implemented. Failure modes, failure mechanisms, and drift of characteristics were analyzed. Humidity acceleration as well as voltage and temperature accelerations were investigated to estimate the chip capacitor reliability. The chip capacitor reliability proved to be high and adequate for the service p... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Ultra-High Density VLSI Modules

    Publication Year: 1978, Page(s):242 - 248
    Cited by:  Papers (5)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1064 KB)

    A novel packaging approach is described for low-power digital VLSI (very large-scale integration) technologies, which provides low-capacity interconnections throughout and eliminates higher packaging levels. The approach is based on the use of hybrid circuits utilizing high-density interconnections on sapphire substractes with a Fotoceram (trademark-Corning Glass Company) backing. These sapphire/F... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.

Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope