IEEE Transactions on Parts, Hybrids, and Packaging

Issue 3 • September 1976

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  • Who's Who in G-PHP

    Publication Year: 1976, Page(s): 165
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    Freely Available from IEEE
  • Foreword

    Publication Year: 1976, Page(s): 166
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    Freely Available from IEEE
  • A Solid-State Variable Resistor Using a Junction FET

    Publication Year: 1976, Page(s):260 - 264
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (567 KB)

    A noncontact variable resistor having fast response and small nonlinear distortion is needed for applications such as autoattenuators or autoequalizers. For these purposes, the voltage controlled variable resistor (VCR) based on the junction FET was investigated. This paper describes the-design results achieved by a VCR and also discusses the behavior of this device with regard to nonlinear distor... View full abstract»

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  • Electron-Beam-Induced Currents in Simple Device Structures

    Publication Year: 1976, Page(s):231 - 236
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (960 KB)

    Electron-beam-induced current (EBIC) in semiconductor devices produced by the electron beam of a scanning electron microscope (SEM) can be used to image sub-surface device features and to measure certain material parameters, This paper presents a simple method of calculation for estimating the magnitude of EBIC signals. EBIC signals from silicon p-n junction diodes are compared with the results of... View full abstract»

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  • New Type Thermal Printing Head Using Thin Film

    Publication Year: 1976, Page(s):223 - 230
    Cited by:  Papers (13)  |  Patents (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1008 KB)

    This paper describes the development of a new type thermal printing head. The main features of this paper are as follows. 1) The heating element is a Ta2N thin-film resistor coated with a SiO2-Ta2O5double layer. The SiO2layer prevents oxidation of Ta2N; the Ta2O5layer, which rubs directly against the heat-sensi... View full abstract»

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  • Miniaturized Aluminum Solid Electrolytic Capacitors Using a Highly Effective Surface Enlargement Technique

    Publication Year: 1976, Page(s):217 - 223
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (944 KB)

    This paper describes a new method for increasing the anode area and hence the capacitance density of aluminum solid electrolytic capacitors. Frequency, temperature, voltage, and life characteristics of the improved capacitors are pre- sented. View full abstract»

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  • Design Considerations for High-Frequency Ceramic Chip Capacitors

    Publication Year: 1976, Page(s):206 - 212
    Cited by:  Papers (11)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (864 KB)

    The design of multilayer ceramic chip capacitors is generally very straightforward and simple. This design normally yields the Iow-frequency parameters such as capacitance, dissipation factor, and insulation resistance. As the frequency increases, however, the loss caused by the resistance of the electrodes can become significant, and the inductance of the electrodes can impair the effectiveness o... View full abstract»

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  • A Switchable Active Filter Hybrid

    Publication Year: 1976, Page(s):201 - 206
    Cited by:  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (912 KB)

    A unique active bandpass filter is described, which is capable of selecting any of 12 different frequencies as defined by a digital input. This device utilizes both thick- and thin-film technologies to their best advantages. Filtering is performed by a state variable active filter circuit designed around a custom linear integrated circuit (lC) and precisely matched components. Frequency selection ... View full abstract»

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  • Glass-Passivated Thick-Film Capacitors for RC Circuits

    Publication Year: 1976, Page(s):194 - 201
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1152 KB)

    The advantages, disadvantages, and the reasons for the limited usage of thick-film capacitors are discussed. The electrical and environmental properties of a glass-passivated high dielectric constant (HiK) (~1000) capacitor which does not require hermetic packaging are described. Design criteria for achieving a Iow-cost thick-film capacitor-resistor-conductor network are presented. These include: ... View full abstract»

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  • Theoretical Calculation of the Thermal Resistance of a Conducting and Convecting Surface

    Publication Year: 1976, Page(s):265 - 266
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (192 KB)

    A closed-form theoretical expression has been derived for the conductive and convective thermal resistance of frequently used electronic component and package covers. Numerical results are plotted in a manner that is applicable to a variety of devices such as flat packs, dual-in-line packages, and ceramic circuit cards, View full abstract»

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  • The Mechanics of Gold Beam Leads During Thermocompression Bonding

    Publication Year: 1976, Page(s):241 - 250
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1216 KB)

    An analysis of the stress and deformation in gold beam leads during thermocompression bonding is presented. The analysis isolates two particular bonding processes for study. One has the beams on opposite sides of the chip bonded simultaneously and the other sequentially. Since strains are encountered that are two orders of magnitude greater than the elastic limit, the beam leads are modelled as a ... View full abstract»

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  • Hybrid Protective Device for MOS-LSI Chips

    Publication Year: 1976, Page(s):172 - 175
    Cited by:  Papers (4)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    In this paper, several structures that can be used to protect MOS-LSl chips against electrostatic discharges (ESD) are examined experimentally to determine some of the possible specification tradeoffs that result in improved overall performance. It is shown that by using structures able to withstand larger energy discharges at the expense of their voltage-clamping characteristics, higher overvolta... View full abstract»

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  • Moisture, Myths, and Microcircuits

    Publication Year: 1976, Page(s):167 - 171
    Cited by:  Papers (26)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    The development and use of an accurate method for the measurement of moisture in microelectronic packages has uncovered many myths related to the assembly and processing of microcircuit packages. The myths indicated a general lack of awareness on the part of the manufacturer and user of the basic physics and chemistry of moisture adsorption, desorption, and leak mechanisms. This paper describes th... View full abstract»

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  • Evidence of mechanical Film Breakdown and ESCA Analysis of a Film on Thermally Aged Cobalt Hardened Gold

    Publication Year: 1976, Page(s):255 - 259
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (624 KB)

    Electron spectroscopy for chemical analysis (ESCA) has been used to determine the chemical formulation of thermally grown films on cobalt hardened-gold electroplate (150°C/8000 h). K2S04 (or SO3) ~ 60-Å, thickness has been identified overlaying a 50-Å-thick CoO layer on cobalt hardened gold. It was found that the dielectric breakdown voltage of this complex film depends on contact f... View full abstract»

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  • Parallel Gap Welding to Thick-Film Metallization

    Publication Year: 1976, Page(s):187 - 194
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1224 KB)

    This study was directed at the parallel gap welding response of a series of gold and platinum-gold thick-film conductor materials which were subjected to various peak temperature/belt speed firing profiles. The parallel gap welding was conducted using a variety of weld voltage/pulse duration settings and a nominal 0.05-mm-thick by 0.38-mm-wide pure gold ribbon. Evaluation of the welds was determin... View full abstract»

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  • Electrical Characteristics of a Two-Level Single Ground-Plane Interconnection in Josephson Tunneling Logic

    Publication Year: 1976, Page(s):236 - 240
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    The electrical characteristics of a two-level X-Y superconducting stripline network over a common superconducting ground plane have been examined as a possible means of two-dimensional interconnection for Josephson tunneling logic (JTL) [1]. Despite the crossover structure, each superconducting stripline has a unique characteristic impedance and is suitable for transmission of very high-speed Jose... View full abstract»

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  • Bias-Humidity Performance of Encapsulated and Unencapsulated Ti-Pd-Au Thin-Film Conductors in an Environment Contaminated with Cl2

    Publication Year: 1976, Page(s):176 - 181
    Cited by:  Papers (17)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (896 KB)

    Both encapsulated and unencapsulated Ti-Pd-Au thin-film conductors on AI2O3substrates were biased in an 85°C 80-percent RH environment contaminated with Cl2. The encapsulant was an RTV silicone rubber. During exposure to the corrosive environment, leakage currents between adjacent conductors were periodically measured and recorded. Leakage currents for the une... View full abstract»

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  • How Heat Treatment Affects Film Foil Capacitors

    Publication Year: 1976, Page(s):251 - 254
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (840 KB)

    The effects of heat treatment between 74°C and 130°C on the dc breakdown voltage (VB) and the change of capacitance with temperature have been determined for capacitors with Mylar film insulation. Some effects of the temperature of heat treatment on discharge life and on the rate of water desorption from rolled capacitors were also determined. It was found that the breakdown v... View full abstract»

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  • A New Center-Tapped Medium-Power Microfilm Resistor

    Publication Year: 1976, Page(s):212 - 217
    Cited by:  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    A new center-tapped microresistor with high power density capability, good stability, and a high degree of inherent reliability is described. The resistor consists of a 0.075 in2chip 0.022 in thick with two equal-value sputtered tantalum nitride photoetched resistors. Gold-plated copper leads are thermal pulse bonded to evaporated chrome/gold bonding pads. The resistive film is protecte... View full abstract»

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  • Encapsulation of Integrated Circuits Containing Beam Leaded Devices with a Silicone RTV Dispersion

    Publication Year: 1976, Page(s):182 - 187
    Cited by:  Papers (21)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1144 KB)

    This paper reviews the results of a number of investigations which have been performed to evaluate the use of an RTV silicone rubber dispersion for the encapsulation (conformal coating) of integrated circuits containing beam leaded silicon integrated circuit (SIC) devices. The dispersion consists of approximately 67-percent xylene and 33-percent solids by weight. The investigations described inclu... View full abstract»

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Aims & Scope

This Transaction ceased production in 1977. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope