Issue 4 • Date December 1975
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Displaying Results 1 - 12 of 12
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Who's Who in G-PHP
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PDF (110 KB)
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Foreword: Design of materials for electronic applications
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PDF (46 KB)
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An Approach for Evaluating Epoxy Adhesives for Use in Hybrid Microelectronic Assembly
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PDF (720 KB)
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A Versatile Ta
2 N-W-Au/SiO2 /Al/SiO2 Thin Film Hybrid Microcircuit Metallization System
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PDF (1672 KB)
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High Power Density Thin Film Resistors
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PDF (1072 KB)
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The Influence of Several Design and Material Variables on the Propensity for Solder Joint Cracking
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PDF (1232 KB)
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Material Characterization of Ti-Cu-Ni-Au(TCNA)-A New Low Cost Thin Film Conductor System
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PDF (1416 KB)
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Aims & Scope
IEEE Transactions on Parts, Hybrids, and Packaging was published 1971-1977. The latest title for this publication is IEEE Transactions on Advanced Packaging.


