Issue 1 • Date Mar 1964
Filter Results
Displaying Results 1 - 7 of 7
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Resins for Embedding Microelectronic Devices
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PDF (928 KB)
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Substrates for Thin-Film Circuitry
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PDF (1456 KB)
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Interconnection Techniques for Microcircuits
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PDF (2344 KB)
Aims & Scope
This title has been replaced by IEEE Transactions on Advanced Packaging.


