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Component Parts, IEEE Transactions on

Issue 1 • Date Mar 1964

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Displaying Results 1 - 7 of 7
  • Substrates for Thin-Film Circuitry

    Publication Year: 1964 , Page(s): 15 - 22
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1456 KB)  

    The properties of available glass, ceramic and other substrate materials are reviewed in the light of requirements imposed by current practice in thin-film circuitry. Special substrate glasses and glazed high thermal conductivity ceramics appear to be best suited to the majority of applications. Techniques for evaluation of the smoothness of substrate surfaces are reviewed and procedures for clean... View full abstract»

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  • Current-Voltage Relations for Thin-Film Tunneling Structures

    Publication Year: 1964 , Page(s): 9 - 15
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (1056 KB)  

    Current-voltage characteristics have been calculated for a structure consisting of two metal surfaces separated by a thin film of "insulating" material. The analysis includes both tunneling and thermionic emission, and takes account of dielectric constant and image force. Curves of current density vs field strength are presented for various values of barrier height and dielectric constant. Several... View full abstract»

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  • Resins for Embedding Microelectronic Devices

    Publication Year: 1964 , Page(s): 22 - 27
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (928 KB)  

    This paper discusses the use of liquid resin systems for potting, casting or encapsulating microelectronic devices. Subject matter includes discussions on epoxies, silicones, polyurethanes, polyesters and thermosetting hydrocarbons and their modifications. Discussed in detail are the large number of modifications possible in epoxies using a variety of curing agents, flexibilizers and diluents. The... View full abstract»

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  • Interconnection Techniques for Microcircuits

    Publication Year: 1964 , Page(s): 33 - 41
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (2344 KB)  

    The problem of how to interconnect today and tomorrow's microminiature electronic circuit packages is one which is growing increasingly complex in view of the ever-diminishing size factor. It appears, however, that within a period of a few short years, many ingenious solutions to the interconnection problem have evolved. Some of these microcircuit interconnection techniques have proven their merit... View full abstract»

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  • A Survey of Conducton Mechanisms in Very Thin Films

    Publication Year: 1964 , Page(s): 4 - 9
    Cited by:  Papers (1)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (880 KB)  

    This survey deals with conduction mechanisms in thin films, both metals and dielectrics, in the thickness range between 10-6and 10-5cm and generally under 2-3 x 10-6cm. Conduction in metals with an island structure is discussed in terms of a thermally-activated process based on a model suggested by Frenkel. The model makes it possible to interpret the behavior qual... View full abstract»

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  • Research Toward a Physics of Aging of Silicon P-N Junctions

    Publication Year: 1964 , Page(s): 28 - 32
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (776 KB)  

    As part of the Electronic Component Reliability Center at Battelle Memorial Institute an experimental program has been initiated, the goal of which is to develop an approach to reliability prediction based on an understanding of the physical processes responsible for degradation of performance characteristics of electronic component parts. A modification of the Eyring rate equation, accounting for... View full abstract»

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  • The Materials of Microelectronic Techniques

    Publication Year: 1964 , Page(s): 3
    Cited by:  Papers (2)
    Save to Project icon | Request Permissions | Click to expandAbstract | PDF file iconPDF (83 KB)  

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Aims & Scope

This Transaction ceased production in 1965. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope