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IEEE Transactions on Parts, Hybrids, and Packaging

Issue 3 • Date September 1974

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Displaying Results 1 - 9 of 9
  • Who's Who in G-PHP

    Publication Year: 1974, Page(s): 150
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    Freely Available from IEEE
  • Foreword

    Publication Year: 1974, Page(s): 151
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    Freely Available from IEEE
  • A Hybrid Integrated Silicon Diode Array for Visible Earth-Horizon Sensing

    Publication Year: 1974, Page(s):188 - 192
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    An earth-horizon sensing device which operates principally in the visible portion of the spectrum has been designed as a hybrid integrated circuit. The circuit was fabricated and tested for use in the LES-8/9 communications satellites as part of the system which maintains the satellites' orientation with respect to earth. The hybrid circuit consists of four silicon chips mounted on a high-density ... View full abstract»

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  • A Coaxial Interconnection System for High Speed Digital Processors

    Publication Year: 1974, Page(s):181 - 187
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1096 KB)

    The cost of interconnecting integrated circuits in large arrays has always been a considerable factor in establishing the operating cost effectiveness of high speed digital processors. Now, with the introduction and increasing use of ICs operating at subnanosecond speeds, interconnection systems have become even more of an economic factor because of the electrical limitations they can impose on th... View full abstract»

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  • Algorithmic Trimming on Active Circuitry

    Publication Year: 1974, Page(s):169 - 174
    Cited by:  Papers (8)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (736 KB)

    The active circuitry for a digital autoranging multimeter has been fabricated on a single hybrie substrate measuring 2.8 X 3.8 cm. The hybrid is realized using tantalum nitride thin film technology. A high temperature passivation process stabilizes the tantalum nitride film. During this process, the absolute value of resistance changes substantially. This change makes the technology unusable in so... View full abstract»

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  • Real Time Detection of Microcracks in Brittle Materials Using Stress Wave Emission (SWE)

    Publication Year: 1974, Page(s):152 - 159
    Cited by:  Papers (4)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1072 KB)

    Stress wave emission (SWE) is defined as the elastic waves released within a material as a result of crack propagation due to the application of stress. A SWE in a brittle material is a relatively low-amplitude stress wave that is caused by the release of energy by microstructural events. This type of a phenomenon is best described by the "Griffith Theory of Solids." Since the SWE's are generally ... View full abstract»

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  • Radiation-Stimulated Failure Mechanism in a Dielectrically Isolated Integrated Circuit

    Publication Year: 1974, Page(s):159 - 164
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1152 KB)

    An apparent latchup condition was observed in a hi-rel dielectrically isolated integrated circuit. The failure mechanism was analyzed and isolated through the use of nondestructive laboratory and radiation tests, and was found to be caused by a short circuit in one of the component transistors of the integrated circuit. This defect remained undetected throughout one-hundred percent high-reliabilit... View full abstract»

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  • A High Density Thick Film Multilayer Process for LSI Circuits

    Publication Year: 1974, Page(s):165 - 168
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (904 KB)

    An advanced thick film multilayering technology using new materials and processes has been developed for the fabrication of hybrid LSl circuits. Not only does this technology offer reduced fabrication time, compared to converttional thick film processing, but it also makes possible 4 mil linewidths and spacings on both conductive layers, and matching 4 mil vias in the dielectric. The resulting int... View full abstract»

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  • Multilayer Interconnection Techniques Applied to High Speed Computer Systems

    Publication Year: 1974, Page(s):175 - 180
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1408 KB)

    A microcircuit interconnection system has been developed which utilizes the advantages of a metal substrate for heat conduction and power distribution combined with a superimposed logic interconnection plane fabricated on 25/ \mu m polyimide film. The copper substrate component of the assembly is capable of dissipating 4 W/cm2 to a water-cooled duct and mainta... View full abstract»

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Aims & Scope

This Transaction ceased production in 1977. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope