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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 3 • Date September 1987

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Displaying Results 1 - 25 of 28
  • Foreword

    Publication Year: 1987, Page(s): 302
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    Freely Available from IEEE
  • Advantages of a Floating Annular Ring in Three-Layer Tab Assembly

    Publication Year: 1987, Page(s):332 - 334
    Cited by:  Papers (1)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (368 KB)

    A mechanically formed unsupported annular ring in three-layer tape automated bonding (TAB) material offers a number of advantages to the user. Leads are stabilized in x, y, and z axes so as to be in precise alignment for inner lead bonding to integrated circuits. Narrower leads may be designed, increasing packaging density, because they do not have to be self-supporting. Longer cantilever lengths ... View full abstract»

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  • Contact Resistance of Oxidized Metals: Dependence on the Mating Material

    Publication Year: 1987, Page(s):420 - 424
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (792 KB)

    The contact resistances of several oxidized metals were determined with smooth spherical probes that were made of various noble and base metals. It was found that contact resistance decreased sharply as the hardness of the probe was increased. Oxidized hard metal probes sometimes gave contact resistances which were less than those from probes made of soft noble metals. The reason is postulated to ... View full abstract»

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  • Optimizing the Wire-Bonding Process for Copper Ball Bonding, Using classic Experimental Designs

    Publication Year: 1987, Page(s):321 - 326
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (808 KB)

    Two classic experimental designs were used to develop the copper ball bonding process. A two-level factorial design was used to screen five process variables simultaneously and determine whether any of them had a significant effect on the process. A four-factor central composite design was used to optimize and map the bonding process window. The efficiency of using designed experiments allowed the... View full abstract»

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  • Stress and Deflection Analysis of Partially Routed Panels for Depanelization

    Publication Year: 1987, Page(s):411 - 419
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (888 KB)

    Deflection and stress in partially routed panels have been studied by the finite element method. Emphasis is placed on the effects of partial routing on the assembly processes for surface mount printed circuit boards. To test the validity of the finite element results, the overall deflection profile of a partially routed panel was measured. The calculated deflection profile agreed with the experim... View full abstract»

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  • Controlled Electromigration for Field Failure Acceleration

    Publication Year: 1987, Page(s):370 - 373
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (480 KB)

    The advent of SMT has caused a new concern for the electromigration failure mechanism. The new smaller electronic assemblies with higher density interconnections now are prime candidates for catastrophic field failures. Since the failure mechanism is so well-known and documented, it is possible to take advantage of these known responses to environmental, chemical, and physical properties and devel... View full abstract»

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  • A New LSI Interconnection Method for IC Cards

    Publication Year: 1987, Page(s):310 - 313
    Cited by:  Papers (5)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (568 KB)

    A new LSI interconnection method, the printed wiring connection (PWC) method, has already been developed. This method involves a planar interconnection, formed by screen printing, utilizing a polymeric conductor. Using this new method, an IC card was made, and the feasibility of applying this method to IC card packaging was investigated. The IC card developed has passed most reliability tests base... View full abstract»

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  • Electronic Manufacturing Process Systems Cost Modeling and Simulation Tools

    Publication Year: 1987, Page(s):401 - 410
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1560 KB)

    Recent National Science Foundation [1] and National Research Council [2] studies have discussed electronics industry needs in the areas of computer-aided process modeling and simulation tools to support the Computer Integrated Manufacturing (CIM) electronics-design-for-manufacturing process. In this paper, we present a summary of pioneering efforts in the modeling and simulation areas by Northern ... View full abstract»

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  • Fabrication of 16-bit DAC Using Infrared Fired Thick-Film Process

    Publication Year: 1987, Page(s):364 - 369
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (664 KB)

    lnterest in infrared firing of thick films has increased recently because of its potential advantages, such as short process time cycles and low power consumption, over its conventional counterpart. The theory of infrared firing and some related experimental work have been reported previously. However, earlier experimental studies were concentrated on the study of individual components like resist... View full abstract»

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  • Association of Bonding-Wire Displacement With Gas Bubbles in Plastic-Encapsulated Integrated Circuits

    Publication Year: 1987, Page(s):327 - 331
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (856 KB)

    Evidence for the unexpected association of displaced wires with gas bubbles in plastic-encapsulated integrated circuits is presented. It is also shown that bubbles can be caused by entrainment of air in the compound as it flows through the molding tool. A mechanism which accounts for the frequent association of displaced bonding wires with the gas bubbles is suggested. View full abstract»

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  • A Microprocessor-Based Architecture for E-Beam Wafer Transfer System

    Publication Year: 1987, Page(s):397 - 400
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (448 KB)

    Moving wafers from atmosphere into a high vacuum chamber and onto an X-Y stage in a system whose primary objective is high throughput can be a challenging undertaking. Position sensing of mechanisms, tolerance to transients and switching noise, flexibility to modify operating modes, extensive diagnostic capability, and a user-friendly set of controls are but a few of the considerations to be made ... View full abstract»

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  • The IEEE Compliant Lead Task Force

    Publication Year: 1987, Page(s):463 - 469
    Cited by:  Papers (13)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1568 KB)

    The leads of leadless chip carrier packages need to be yielding or compliant so that stresses on the solder Joints are minimal. These stresses are caused both by differences in the thermal expansions of the package and the material but also by board flexing. A special task force of the IEEE has determined that there are major differences between packages from different vendors, and that the differ... View full abstract»

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  • A New Laser Hermetic Sealing Technique for Aluminum Package

    Publication Year: 1987, Page(s):433 - 436
    Cited by:  Papers (8)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (648 KB)

    A new laser hermetic sealing technique which combines nickel plating with laser welding has been developed for aluminum packages. Laser welding has proved to be the most promising hermetic sealing technique for the aluminum packages. However, laser welding of the package has been difficult because of aluminum's tendency to suffer centerline cracks in the weld zone. Nickel was added in the weld zon... View full abstract»

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  • TLM Modeling of Solder Joints in Semiconductor Devices

    Publication Year: 1987, Page(s):440 - 445
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (712 KB)

    Transmission-line matrix (TLM) is an elegant technique for modeling heat flow in semiconductor devices. Unlike some other numerical methods a sense of the physical nature of the problem is retained and irregular boundaries, inhomogeneities, and temperature dependent thermal parameters can be easily incorporated. The inclusion of a layer of solder between a device and its PaCkage has a substantial ... View full abstract»

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  • The Effect of Post-Mold Curling Upon the Microstructure of Epoxy Molding Compounds

    Publication Year: 1987, Page(s):358 - 363
    Cited by:  Papers (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    Optimization of molding compound properties is the general objective of post-mold thermal processing. The use of such thermal processing has led to property changes that are commonly ascribed to residual curing. In this paper we report on an examination of microstructural changes effected during post-mold thermal aging at temperatures slightly lower than the molding temperature. The results of thi... View full abstract»

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  • New Process for Automated IC Assembly Manufacturing

    Publication Year: 1987, Page(s):391 - 396
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1056 KB)

    A novel assembly process, designed for automation, has been developed and implemented. This paper describes both the equipmerit and processes employed by this technology. The key features of the design are the Use of the whole top surface of the chip for assembly, large bonding pads to reduce the required mechanical accuracies, and elimination of wire bonding and chip attach by bonding the chip di... View full abstract»

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  • Ta-Si-C High Resistivity Thin Films for Thermal Printing Heads

    Publication Year: 1987, Page(s):446 - 451
    Cited by:  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (792 KB)

    Ta-Si-C thin films have been developed for thermal printing heads, and the effect of composition on the film properties was studied. The results of these investigations show that (1) when Ta-Si-C thin films are formed, the composition of the film does not agree with the target composition, (2) addition of carbon to Ta/SiC mixtures suppresses recrystallization during high temperature treatment, (3)... View full abstract»

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  • Electrical Performance of High-Speed Interconnect Systems

    Publication Year: 1987, Page(s):303 - 309
    Cited by:  Papers (17)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (880 KB)

    Advancing semiconductor technology is increasing both device densities and speeds. As signal risetimes become faster than Ins and interconnect densities on a single chip carrier approach 500 leads or more, extremely careful electrical modeling of the packaging environment becomes critical. Designers are confronted with the practical problems imposed by the interconnect system which may degrade (or... View full abstract»

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  • Further Studies of a Low-Melting Point Alloy Used in a Liquid Metal Current Collector

    Publication Year: 1987, Page(s):452 - 455
    Cited by:  Papers (6)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (560 KB)

    Low-melting point bismuth-based alloys are potential replacements for NaK78as liquid metal slip ring material because of their lower reactivity and potentially greater hydrodynamic stability. This paper describes experiments of one such alloy in a model of a 300-kW superconducting homopolar motor using close clearance braid-type collectors. Slip ring tip velocities varied from 5 to 20 m... View full abstract»

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  • New Film Carrier Assembly Technology: Transferred Bump TAB

    Publication Year: 1987, Page(s):335 - 340
    Cited by:  Papers (12)  |  Patents (10)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (912 KB)

    Conventional tape automated bonding (TAB) uses IC chips with gold bumps, where gold bumps are formed on the aluminum bonding pads of the IC chips by metal evaporation, photoetching, and gold plating. The bumps of metal multilayer have to be formed directly on the IC chips in the conventional TAB method, and this necessitates a number of complicated processes and equipments. With the newly develope... View full abstract»

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  • Elastoplastic Analysis of Surface-Mount Solder Joints

    Publication Year: 1987, Page(s):346 - 357
    Cited by:  Papers (41)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1320 KB)

    Thermal strain in surface-mount chip resistor assemblies is studied by the finite element method using two- and three-dimensional models. Emphasis is placed on the effects of interconnection geometry on solder joint fatigue. Nine different solder joint geometries are considered. View full abstract»

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  • Automation of Solder Joint Inspection Procedures Utilizing Laser Induced Infrared

    Publication Year: 1987, Page(s):374 - 378
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (616 KB)

    In the rush to automate assembly flow in the fabrication and assembly of electronic equipment, great strides have been made in all areas with the exception of solder joint inspection and rework. This paper focuses on an attempt to automate, at least in part, the inspection of printed wiring assembly (PWA) solder joints. The use of laser and/or X-ray equipment is causing quite a stir in the industr... View full abstract»

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  • Stiffness and Yielding in the PLCC "J" Lead

    Publication Year: 1987, Page(s):379 - 390
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1424 KB)

    The stiffness of the "J" lead in plastic leaded chip carrier (PLCC) packages is calculated using simple beam bending theory. These results are compared with experimentally determined values and used to estimate shear stress amplitudes in the solder joint. Yielding loads in "J" leads of varying geometries are also determined. View full abstract»

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  • Degradation Mechanisms in Tin- and Gold-Plated Connector Contacts

    Publication Year: 1987, Page(s):456 - 462
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1064 KB)

    Degradation mechanisms in tin-plated contacts (Sn contacts) and gold-plated contacts (Au contacts) are clarified. Contact resistance and corrosion characteristics for both types of contacts are investigated and compared. Contact resistance is more stable for Sn contacts than for Au contacts in a SO2+ NO2+ C12atmosphere. This is because relatively few corrosion prod... View full abstract»

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  • High Frequency Behavior of Ceramic Multilayer Capacitors

    Publication Year: 1987, Page(s):437 - 439
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (432 KB)

    The impedance of ceramic capacitors, made from different dielectric materials, was measured as a function of frequency from 1 MHz to 1 GHz. Most of the capacitors were of 0805 size and either end terminated or side terminated. The capacitance values ranged from a minimum of 50 pF to 100 nF. The high-frequency impedance measurements demonstrate that the inductance is a factor of two larger in end-t... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope