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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

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Components, Hybrids, and Manufacturing Technology, IEEE Transactions on

Issue 2 • Date June 1987

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Title History

Foreword: Special Section on Packaging

Investigation of Aluminum Ball Bonding Mechanism

Comparison of Wafer Scale Integration with VLSI Packaging Approaches

Investigations of Large PLCC Package Cracking During Surface Mount Exposure

Micro-Corrosion of Al-Cu Bonding Pads

Equations for Estimating Wire Length in Various Types of 2-D and 3-D System Packaging Structures

A Simple Method for Characterizing the Bondability of Metallization Surfaces

Characterization of Particle Morphology and Rheological Behavior in Solder Paste

Smell Identification Using a Thick-Film Hybrid Gas Sensor

Characterization of Intermetallic Compound Formation on In/Bi/Sn Solder Bumps Used in Pb-Alloy Josephson Chip Packaging

Buried Coaxial Conductors for High-Speed Interconnections

Water Adsorption and Surface Conductivity Measurements on $\alpha$ -Alumina Substrates

Electrical Conduction Mechanisms of Barium-Titanate-Based Thick-Film Capacitors

Correspondence: Authors' Reply

Correspondence: Comments on "1/f Noise in Metal Contacts and Granular Resistors"

The Fundamental Limits for Electronic Packaging and Systems

Thermal Management of Air- and Liquid-Cooled Multichip Modules

High-Frequency Performance of TAB

Water-Soluble Flux for Pb-Alloy Josephson Device Packaging

Surface Attach Chip Carriers for Conventional and High-Performance Applications

Experimental Study of Ag-W-Re Composite Materials Under High-Current Conditions

Cost-Density Analysis of Interconnections

Electrical Modeling of Interconnections in Multilayer Packaging Structures

Stress Analysis of Partially Yielded Soldered Joint for Surface Mount Connectors

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