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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 2 • Date June 1987

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Displaying Results 1 - 24 of 24
  • Foreword: Special Section on Packaging

    Publication Year: 1987, Page(s):141 - 142
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    Freely Available from IEEE
  • Surface Attach Chip Carriers for Conventional and High-Performance Applications

    Publication Year: 1987, Page(s):152 - 158
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1744 KB)

    Three types of surface attach chip carriers are available for systems use: leadless ceramic and plastic packages, leaded plastic and ceramic packages, and a new updated version of the leadless ceramic packages suitable only for socketing. These new packages have high lead count, copper leads, and provisions for internal decoupling capacitors. These three packaging types and the important role that... View full abstract»

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  • Electrical Modeling of Interconnections in Multilayer Packaging Structures

    Publication Year: 1987, Page(s):217 - 223
    Cited by:  Papers (24)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (944 KB)

    An effort toward modeling the interconnections in selected typical multilayer packaging structures is presented. The modeling is based on a quasi-static approximation to the associated electro-magnetic problems. A program for computing capacitance and inductance matrices and the numerical techniques used to improve the program efficiency are described. The results of numerical testing of the progr... View full abstract»

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  • Characterization of Intermetallic Compound Formation on In/Bi/Sn Solder Bumps Used in Pb-Alloy Josephson Chip Packaging

    Publication Year: 1987, Page(s):263 - 266
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (576 KB)

    An AuIn2intermetallic compound was discovered and its effect on bonding in Pb-alloy Josephson chip packaging was investigated. This was achieved by applying an In/Bi/Sn ternary alloy solder, which was characterized by X-ray and thermal analysis. Both bulk and vacuumdeposited In/Bi/Sn films were used, and in both cases the dominant compound was BiIn2. Indium, ... View full abstract»

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  • The Fundamental Limits for Electronic Packaging and Systems

    Publication Year: 1987, Page(s):176 - 183
    Cited by:  Papers (19)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1240 KB)

    A systems analysis of the fundamental physical laws that will eventually restrict the evolution of all electronic systems is presented. To formulate the analysis, a logical framework based on a minimum set of three critical hardware parameters is constructed. These parameters serve as variables in the quantification of the physical laws as they affect electronic systems. The parameters to reduce t... View full abstract»

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  • Correspondence: Authors' Reply

    Publication Year: 1987, Page(s): 292
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    More detailed discussions are presented here, according to surface problems of the static contacts. View full abstract»

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  • Water-Soluble Flux for Pb-Alloy Josephson Device Packaging

    Publication Year: 1987, Page(s):258 - 262
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (816 KB)

    A new water-soluble flux using a chelate system was developed for indium(In)-based low-melting-temperature solder alloys. Rosin fluxes, which are now widely used for reflow soldering processes, are not effective below 150°C. Therefore they can not be applied to Pb-alloy Josephson device chip interconnections. It was found that 5-sulfosalicylic acid compounds were very effective for In/33 perc... View full abstract»

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  • High-Frequency Performance of TAB

    Publication Year: 1987, Page(s):199 - 203
    Cited by:  Papers (9)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (784 KB)

    The high-performance capability of tape automated bonding (TAB) is explored by developing simple equivalent circuits that allow estimates of signal fidelity, crosstalk, power capabilities, and power signal interactions. A useful experimental technique for isolating cause and effect is used to illustrate power delta-I noise. Improvements in power and signal behavior are proposed, which result from ... View full abstract»

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  • Correspondence: Comments on "1/f Noise in Metal Contacts and Granular Resistors"

    Publication Year: 1987, Page(s):290 - 291
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (280 KB)

    A model is presented in the above paper based on temperature fluctuations of the small conducting spots inducing conductivity fluctuations. The observed experimental results are in qualitative agreement with those of the model. In this comment arguments will be presented which are at variance with the temperature fluctuation model. Their experimental results can be described by the empirical 1/f n... View full abstract»

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  • Characterization of Particle Morphology and Rheological Behavior in Solder Paste

    Publication Year: 1987, Page(s):224 - 231
    Cited by:  Papers (24)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (968 KB)

    Solder paste is an integral part of surface mount technology. An adequate understanding of its behavior and properties is essential to comprehend the relationship solder paste has to the overall manufacturing process. Techniques to characterize solder paste behavior adequately were explored. Particular emphasis was placed on characterizing solder particle size and shape as well as the viscous beha... View full abstract»

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  • Electrical Conduction Mechanisms of Barium-Titanate-Based Thick-Film Capacitors

    Publication Year: 1987, Page(s):274 - 282
    Cited by:  Papers (18)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1200 KB)

    Electrical characteristics, including degradation, of high K ( \cong 500) barium-titanate-based thick-film capacitors were studied. The leakage current of thick-film capacitors made from Ag/Pd thick-film conducting paste and high K dielectric has shown ohmic and super-ohmic (3/2 power voltage dependence) type behavior. Voltage independence of thermal activat... View full abstract»

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  • Thermal Management of Air- and Liquid-Cooled Multichip Modules

    Publication Year: 1987, Page(s):159 - 175
    Cited by:  Papers (63)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (2704 KB)

    The state-of-the-art in air- and liquid-cooled multichip modules is examined. An effort is made to identify the salient features of eight distinct modules, define their thermal characteristics, and establish a consistent basis for comparing and evaluating their thermal performance. View full abstract»

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  • Micro-Corrosion of Al-Cu Bonding Pads

    Publication Year: 1987, Page(s):252 - 257
    Cited by:  Papers (19)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1592 KB)

    Aluminum metallization films with copper additions are found to exhibit highly localized pitting in the presence of moisture. Galvanic action of aluminum surrounding Al2Cu theta phase particles causes localized aluminum corrosion. The thin layer of aluminum hydroxide corrosion product on the bonding pad creates an effective barrier to high-quality wire bonding. View full abstract»

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  • Experimental Study of Ag-W-Re Composite Materials Under High-Current Conditions

    Publication Year: 1987, Page(s):283 - 289
    Cited by:  Papers (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (952 KB)

    The results of testing the properties of the new contact material silver-tungsten-rhenium under high current conditions are presented. Arc erosion, contact resistance, and statical welding characteristics have been investigated. The AgW50Re2 is the optimum variant of the materials. It has shown considerably less erosion than that shown by AgW(50) and it appeared to have nonwelding properties. It c... View full abstract»

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  • Water Adsorption and Surface Conductivity Measurements on \alpha -Alumina Substrates

    Publication Year: 1987, Page(s):247 - 251
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (832 KB)

    Water adsorption and surface conductivity on ceramic substrates are important parameters in the electrochemical corrosion of thin-film metallizations and the associated growth of dendrites in humid environments. The adsorption of water provides the necessary electrolyte through which ion migration and electrochemical corrosion is possible, and the surface conductivity of the adsorbed moisture laye... View full abstract»

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  • Buried Coaxial Conductors for High-Speed Interconnections

    Publication Year: 1987, Page(s):204 - 208
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (544 KB)

    In May of 1985, the basic work describing buried coaxial conductors in fine-line muitilayer polyimide substrates was reported at the 35th ECC Conference [10]. This unique construction provides a breakthrough technology for controlling electrical crosstalk in closely spaced high-density substrates. Such control is critical for high-speed designs operating in the 1-10-GHz frequency range. That work ... View full abstract»

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  • Investigations of Large PLCC Package Cracking During Surface Mount Exposure

    Publication Year: 1987, Page(s):209 - 216
    Cited by:  Papers (61)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1464 KB)

    Surface mount technology imposes severe strains on plastic leaded chip carriers. An examination of package cracking during solder reflow and the factors that affect this problem are presented. The major factor inducing package cracking is found to be water vapor absorption from the ambient. It was found that the cracking problem could be circumvented by reducing the absorbed moisture level through... View full abstract»

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  • Smell Identification Using a Thick-Film Hybrid Gas Sensor

    Publication Year: 1987, Page(s):267 - 273
    Cited by:  Papers (6)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (816 KB)

    An analytical method and experimental results of identifying and quantifying smells using an electronic system composed of an integrated sensor and a microcomputer are described. The integrated sensor with six different elements on an alumina substrate was fabricated by using thick-film techniques. The elements are kept at around 400°C by a Pt heater mounted on the sensor back. Since each ele... View full abstract»

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  • Cost-Density Analysis of Interconnections

    Publication Year: 1987, Page(s):143 - 151
    Cited by:  Papers (19)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1240 KB)

    A very rapid increase in the conductor density of various interconnecting substrates makes it desirable to have a uniform method for evaluation of their relative density capabilities. The derivation of one such method of evaluation, based on conductor density per unit of total area of the substrate, is made. This method permits a uniform density analysis of the entire interconnection spectrum from... View full abstract»

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  • Comparison of Wafer Scale Integration with VLSI Packaging Approaches

    Publication Year: 1987, Page(s):184 - 189
    Cited by:  Papers (38)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (752 KB)

    A comparison is made of various high-density packaging approaches, including printed wiring board, thick-film hybrids, and wafer scale integration (WSI). Criteria include power dissipation, density, delays, and cost. It is concluded that thin-film hybrids using state-of-the-art VLSI chips have the potential for WSI density and performance. The requirement for fault tolerance, additional levels of ... View full abstract»

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  • Investigation of Aluminum Ball Bonding Mechanism

    Publication Year: 1987, Page(s):242 - 246
    Cited by:  Papers (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (720 KB)

    The effects of various factors, e.g., ball hardness, amount of ball deformation, thickness, and surface cleanliness of the aluminum electrode, which can influence bonding strength were investigated. Metallurgical bonding between balls and electrodes occurs by rupturing the oxide film existing on the aluminum electrodes and proceeds from outside, inwards to the center of the bonds. The bonding stre... View full abstract»

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  • Stress Analysis of Partially Yielded Soldered Joint for Surface Mount Connectors

    Publication Year: 1987, Page(s):236 - 241
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (696 KB)

    A closed-form solution is derived for deformation of Partially yielded L-shaped joints commonly seen in surface mount connectors. The solder layer is modeled by one-dimensional elastic/ plastic foundation. The solution agrees well with a published result of an elastic problem as a special case and with a finite element analysis in an elastic/plastic case. This analysis provides a few useful conclu... View full abstract»

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  • A Simple Method for Characterizing the Bondability of Metallization Surfaces

    Publication Year: 1987, Page(s):232 - 235
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (392 KB)

    A probing technique is described which measures breakdown voltages of contaminating films on metal surfaces. These breakdown voltages are correlated with the bondability and wettability of the surfaces. The probe setup consists of a fine gold wire with a ball terminal and a tungsten whisker. Three examples are described. The breakdown voltage on Al metallization on a Si chip and on plated Ag film ... View full abstract»

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  • Equations for Estimating Wire Length in Various Types of 2-D and 3-D System Packaging Structures

    Publication Year: 1987, Page(s):190 - 198
    Cited by:  Papers (21)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1072 KB)

    Equations for estimating wire lengths in various types of two-dimensional (2-D) and three-dimensional (3-D) cell arrays are introduced'and applications of these equations are described. The singleplane packaging technique is compared with the stacked 2-D technique. The effect of increasing the number of edge connectors for Stacked 2-D designs is evaluated. Also the wire length in 3-D wafer compute... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope