By Topic

IEEE Electrical Insulation Magazine

Issue 4 • July-Aug. 1990

Filter Results

Displaying Results 1 - 4 of 4
  • The high voltage design of superconducting power transmission systems

    Publication Year: 1990, Page(s):7 - 16
    Cited by:  Papers (25)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1480 KB)

    The special problems that arise when designing a superconducting system are examined. These are: (1) that the voltage and current levels chosen must permit economic integration into existing transmission and generation facilities; (2) the mechanical design of components that get cold must permit relatively large absolute contraction and possibly differential contraction without damage that may aff... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • The 'universal' dielectric response. III

    Publication Year: 1990, Page(s):19 - 24
    Cited by:  Papers (10)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (634 KB)

    The screened hopping mechanism, which assumes that in every dielectric system, dipolar or hopping-charge-dominated, there must be a finite amount of local adjustment of dipolar orientations or of charge dispositions in response to any particular dipole or charge movement, is discussed. The relaxation of polarization in a dipolar system with a frequency-domain (FD) behavior is considered, focusing ... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Encapsulating resins for semiconductors

    Publication Year: 1990, Page(s):25 - 32
    Cited by:  Papers (15)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (772 KB)

    Technological trends in IC packaging in Japan are briefly reviewed. Epoxy resins have been successfully applied as encapsulating resins for ICs and LSIs (large-scale integrated circuits). An epoxy resin with improved moisture resistance has been effectively used in the production of VLSI devices. For the 1- to 4-Mb DRAMs that are soon going to be produced in Japan, the encapsulating resin must com... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.
  • Partial discharge: overview and signal generation

    Publication Year: 1990, Page(s):33 - 39
    Cited by:  Papers (78)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (833 KB)

    It is shown how a partial discharge (PD) within a test sample generates a signal that can be measured outside the apparatus under test. Because the transfer function between the phenomenon within the apparatus under test and the signal that can be measured can vary widely, measured partial-discharge magnitudes rarely have absolute meaning and are often referred to as effective partial-discharge ma... View full abstract»

    Full text access may be available. Click article title to sign in or learn about subscription options.

Aims & Scope

The EI Magazine publishes articles written by authors from industry, research institutes and academia. The articles are more practical in content than the papers published in the Transactions.

Full Aims & Scope

Meet Our Editors

Co-Editor-in-Chief
Edward Cherney

Co-Editor-in-Chief
Robert Fleming