Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
Issue 4 • Date Dec. 1990
Society Sponsor
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Displaying Results 1 - 25 of 78
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Relation between delamination and temperature cycling induced failures in plastic packaged devices
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PDF (456 KB)
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Preparation, structure, and fracture modes of Pb-Sn and Pb-In terminated flip-chips attached to gold capped microsockets
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PDF (1132 KB)
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A new power cycling technique for accelerated reliability evaluation of plated through holes and interconnects in PCBs
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PDF (772 KB)
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The use environments of electronic assemblies and their impact on surface mount solder attachment reliability
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PDF (520 KB)
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Boiling incipience and nucleate boiling heat transfer of highly wetting dielectric fluids from electronic materials
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PDF (684 KB)
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Corrosion criteria for electronic packaging. II. Calculated corrosion currents and acceleration factors
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PDF (560 KB)
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Materials/processing approaches to phase stabilization of thermally conductive pastes
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PDF (444 KB)
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Thermally induced IC package cracking
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PDF (672 KB)
Aims & Scope
IEEE Transactions on Components, Hybrids, and Manufacturing Technology was published 1978-1993. The latest title for this publication is IEEE Transactions on Advanced Packaging.
