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IEEE Transactions on Components, Hybrids, and Manufacturing Technology

Issue 4 • Dec. 1990

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Displaying Results 1 - 25 of 78
  • Optical and electrical investigation of ion bombarded GaAs

    Publication Year: 1990, Page(s):617 - 622
    Cited by:  Papers (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (585 KB)

    (100) surfaces of GaAs were bombarded with low energy Ar+ ions at energies to 4 keV. Photoconductivity and Schottky diode studies were then performed. A striking persistent photoconductivity that was observed is attributed to an optically and temperature sensitive metastable defect complex formed by the ion beam etching (IBE). Optical quenching of spectral conductivity, restorable by th... View full abstract»

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  • A new high temperature multilayer capacitor with acrylate dielectrics

    Publication Year: 1990, Page(s):611 - 616
    Cited by:  Papers (10)  |  Patents (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (528 KB)

    Polymer multilayer (PML) monolithic capacitors have been produced by a continuous high-speed vacuum process. The polymer dielectric is formulated by flash evaporating an acrylate monomer material onto a rotating drum and then cross-linking it by electron beam irradiation. The resulting polymer is thermally stable at temperatures in excess of 300°C. The dielectric films are pinhole-free and hav... View full abstract»

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  • Spurious effects induced by current switching in power strips of wafer package

    Publication Year: 1990, Page(s):1110 - 1114
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    Spurious effects due to current switching in power lines on silicon wafer packages (monolithic or hybrid) are analyzed in the time domain. Theoretical results lead to simple relations allowing easy predictions of the dynamic voltage drop on a power line and of the spurious voltages on signal lines induced by crosstalk with power lines. Experimental measurements on typical devices are presented to ... View full abstract»

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  • Void free bonding of large silicon dice using gold-tin alloys

    Publication Year: 1990, Page(s):1128 - 1134
    Cited by:  Papers (39)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (708 KB)

    The successful bonding of large (6 mm×10 mm) silicon dice on alumina substrates with Au-Sn eutectic using a particular bonding technique is described. The bonding quality was examined by a scanning acoustic microscope having a resolution of 25 μm and it was found that nearly perfect bondings have been achieved. Use of Au-Sn alloy rather than Au-Si resulted in not only lower processing tem... View full abstract»

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  • Silicon interconnect-a critical factor in device thermal management

    Publication Year: 1990, Page(s):946 - 952
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (556 KB)

    The analytical and experimental methodologies for studying silicon device degradation under electrothermal stress are investigated. The experimental data support the assumption that the thermally induced stress due to power cycling and power surges is a major cause of device degradation. The analytical models point out the large impact that low-thermal diffusivity layers (solder or epoxy), located... View full abstract»

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  • Shear deformation of indium solder joints

    Publication Year: 1990, Page(s):929 - 939
    Cited by:  Papers (11)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (856 KB)

    Indium solder joint deformation has been investigated under conditions of shear loading and stress relaxation at room temperature. The deformation behavior was characterized as a function of strain, strain rate, joint thickness, and hold time. Implications of the results are discussed relative to thermal stresses and solder joint reliability in an electronic package. Work hardening during loading ... View full abstract»

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  • Packaging technology for a low temperature astrometric sensor array

    Publication Year: 1990, Page(s):1083 - 1089
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (776 KB)

    An advanced astrometric sensor array (AASA) of charge-coupled device (CCD) chips was constructed using thin-film hybrid multichip packaging technology for operation at -140°C. A series of AASA prototypes were fabricated with various epoxies, circuitry layouts, and substrate thicknesses in order to determine materials, fabrication processes, and structures suitable for construction of the AASA.... View full abstract»

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  • High field capacitance-temperature behavior of BaTiO3 ceramic disc capacitors

    Publication Year: 1990, Page(s):1124 - 1127
    Cited by:  Papers (19)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (340 KB)

    Experimental and theoretical studies are reported on the capacitance-temperature (CT) characteristics of an undoped BaTiO3 high-voltage (1000 V) nonlinear ceramic disc capacitor with a 3.6:1 capacitance ratio over the DC bias voltage range, which has application to power electronics snubbers. CT responses for both the zero-bias and 1000-V-bias conditions are modeled in terms of the pol... View full abstract»

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  • Thermally induced IC package cracking

    Publication Year: 1990, Page(s):940 - 945
    Cited by:  Papers (24)  |  Patents (2)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (672 KB)

    The presence of plastic package cracks due to the thermal stress of assembly procedures in low-cost plastic packages represents a severe long-term reliability hazard. It has been shown previously that the dominant cracking mechanism is moisture expansion due to thermal processing acting on concentrations of water vapor at the back surface of the die paddle and at the front surface of the silicon d... View full abstract»

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  • A comparison of copper and gold wire bonding on integrated circuit devices

    Publication Year: 1990, Page(s):673 - 681
    Cited by:  Papers (56)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (788 KB)

    A study carried out to investigate the process and material variables in developing a copper wire bond assembly process and to determine the potential performance and reliability of the finished product. A summary of Cu and Au comparison results for die bond, material selection, ball shear, and wire pull evaluations is given. The electrical and thermal performances are described. The intermetallic... View full abstract»

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  • The two fiber mechanical splice of low loss for optical fiber cable

    Publication Year: 1990, Page(s):807 - 810
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (376 KB)

    To meet the needs of new fiber-optic systems, it was necessary to develop a mechanical splice that would work with a short length of fiber and a cable structure that allows easy fiber access after the sheath has been removed. The authors discuss the concept of the new mechanical splice and the tool developed to perform splicing. The two-fiber mechanical splicing method allows quick splicing and do... View full abstract»

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  • Characteristics of heat transfer in small disk enclosures at high rotation speeds

    Publication Year: 1990, Page(s):1006 - 1011
    Cited by:  Papers (4)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (360 KB)

    Experimental results are reported for heat transfer in small disk enclosures containing several 5.25-in-diameter disks and two symmetrical brushless DC motors mounted on a spindle. The air flow over the disk is probably turbulent at a rotation speed of more than 5400 r.p.m., and windage loss dominates the total rotation loss. Effective forced convection reduces the temperature increase inside the ... View full abstract»

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  • On the accommodation of coolant flow paths in high density packaging

    Publication Year: 1990, Page(s):1040 - 1049
    Cited by:  Papers (5)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (800 KB)

    An analytical study was conducted to determine a balance between the switching speed of logic gates and the average wiring distance in the system on the basis of the heat removal capability of the coolant. One of the models consists of a row of gate-carrying cards flanked by side boards having networks to complete three-dimensional wiring. The gates are cooled by forced convection of FC-77 or wate... View full abstract»

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  • Creep strains in an elongated bond layer

    Publication Year: 1990, Page(s):914 - 928
    Cited by:  Papers (15)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (788 KB)

    Thermally induced shear stresses and strains in a bimaterial assembly are studied as functions of position and time. It is shown that the initial uneven distribution of shear stress will first relax so that the stresses are distributed uniformly along the bond without a change in the total shear force. During the time of this initial stress redistribution, a significant magnitude of creep may occu... View full abstract»

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  • Coupled noise and its effects on modern packaging technology

    Publication Year: 1990, Page(s):1074 - 1082
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (900 KB)

    An overview is presented of the causes of coupled noise and ways that coupled noise affects modern packaging technology. Two major types of coupled noise, crosstalk and switching noise, are discussed, with emphasis on physical causes and means of reducing both types. Major types of multiple-die hybrid and conventional packaging are described, and a case is made for the need for three-dimensional p... View full abstract»

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  • Flip-chip soldering to bare copper circuits

    Publication Year: 1990, Page(s):656 - 660
    Cited by:  Papers (5)  |  Patents (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1052 KB)

    A process for providing highly reliable high-yield controlled-collapse ship connection (C4) joining to bare copper circuitry is described. It was studied in the course of implementing a major change in IBM's metallized ceramic and metallized ceramic polyimide (MCP) production line. The study involved joining chips with 95/5 Pb/Sn C4 solder bumps to bare copper pads on substrates to replace dip-tin... View full abstract»

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  • Large scale multilayer glass-ceramic substrate for supercomputer

    Publication Year: 1990, Page(s):751 - 758
    Cited by:  Papers (7)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (732 KB)

    A large-scale multilayer glass-ceramic (MGC) substrate having a low dielectric constant (7.8) and a high flexural strength has been developed by a highly accurate green-sheet technology. The substrate has an area of 225 mm×225 mm and is 5.5 mm thick. A low electrical resistivity (3 μΩ-cm) can be realized by using a gold paste system is forming the conductors. The substrate can suppo... View full abstract»

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  • ESD packaging requirements for an opto-electronic receiver module

    Publication Year: 1990, Page(s):787 - 790
    Cited by:  Papers (1)  |  Patents (6)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (312 KB)

    The results are reported of several tests which were conducted on various packaging designs to determine the significant features affecting electrostatic discharge (ESD) susceptibility. The use of metallurgical versus metal-filled epoxy assembly of the package elements (housing, lid, substrate), and low resistance versus full closure between the packaging elements were investigated. The experiment... View full abstract»

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  • On microstrip capacitance and impedance

    Publication Year: 1990, Page(s):1121 - 1123
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (256 KB)

    The accuracy of various mathematical models for the prediction of the capacitance and characteristic impedance of a single-conductor microstrip is investigated. Comparison between experimental and modeled results indicates that purely empirical models are sometimes the most accurate over a limited range of parameters. When various mathematical models are compared to calculations done by the bounda... View full abstract»

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  • A new index S for evaluating solder joint thermal fatigue strength

    Publication Year: 1990, Page(s):1146 - 1153
    Cited by:  Papers (4)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (600 KB)

    An index named S is proposed for the quick evaluation of the thermal fatigue strength of solder joints in electronic equipment. If a joint is designed so that its S value is less than one under a given thermal cycle condition, the inelastic strain range in the joint solder, including plastic and creep components, is less than 0.2%, which is small enough for most electronic equipm... View full abstract»

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  • 3-D interconnection for ultra-dense multichip modules

    Publication Year: 1990, Page(s):814 - 821
    Cited by:  Papers (9)  |  Patents (14)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (672 KB)

    A three-dimensional interconnection technology is described that allows a reduction of the occupied area by a factor of 7 or 8 as against 2-D interconnection. The approach consists of interconnecting the bare chips not in the XY plane, but along the Z-axis. The process entails interconnecting the four lateral areas (sides) of the cube formed by stacking n chips (n View full abstract»

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  • Development of copper wire bonding application technology

    Publication Year: 1990, Page(s):667 - 672
    Cited by:  Papers (56)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (608 KB)

    The continuous forming of oxide-free, stable, spherical copper balls which has been realized by blowing a reducing gas over the copper wire during copper ball formation (sparkling) is described. The prevention of chip damage resulting from hard copper wire, including underpad cracking and silicon cratering, by the double-load wire bonding technology is discussed; this technology can minimize chip ... View full abstract»

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  • Optical components-the new challenge in packaging

    Publication Year: 1990, Page(s):798 - 806
    Cited by:  Papers (31)  |  Patents (3)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (1056 KB)

    Recent developments in packaging technology for optical components used in fiber transmission systems are reviewed. Topics covered include fiber coupling and fixing techniques, modular packaging concepts, high-speed component design, and advanced function components. A high-performance package for lithium niobate modulators is described that illustrates the packaging concepts that are outlined. Li... View full abstract»

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  • GaAs multichip module for a parallel processing system

    Publication Year: 1990, Page(s):828 - 832
    Cited by:  Papers (1)
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (692 KB)

    The module described is a high-speed data transfer network for a parallel processing system. The high-speed data transfer network connecting multiple processor units was realized in a module using 8-bit slice GaAs bus logic (BL) LSIs which operate at 100 MHz. The GaAs multichip module consists of 12 GaAs BL LSIs in a 3×4 matrix. Each GaAs chip is sealed in a chip carrier with bumps. The chip... View full abstract»

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  • Substrate impact on the thermal performance of tape automated bonding components

    Publication Year: 1990, Page(s):998 - 1005
    Request permission for commercial reuse | Click to expandAbstract | PDF file iconPDF (580 KB)

    The results of thermally characterizing a 160-I/O (input/output) tape automated bonding (TAB) device are reported. A finite-element technique is used to understand and model the thermal processes of the TAB. A three-dimensional (3-D) computer model is developed and validated against experimental data obtained in a natural convection environment. The 3-D model's results indicate that the thermal pr... View full abstract»

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Aims & Scope

This Transaction ceased production in 1993. The current publication is titled IEEE Transactions on Components, Packaging, and Manufacturing Technology.

Full Aims & Scope