Components and Packaging Technologies, IEEE Transactions on
Issue 2 • Date June 2002
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Displaying Results 1 - 21 of 21
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Open forum - editorial
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PDF (149 KB)
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Heat sinks with fluted and wavy plate fins in natural and low-velocity forced convection
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PDF (304 KB)
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Packaging of an integrated planar power passive module for a power electronics converter: a 1 MHz case study
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PDF (300 KB)
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Uprating of a single inline memory module
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PDF (193 KB)
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Experimental and theoretical characterization of an antiferroelectric ceramic capacitor for power electronics
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PDF (282 KB)
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Observation of copper ionic migration in insulation layer by pulsed electroacoustic method [metal-base PWBs]
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PDF (229 KB)
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Fully process-compatible layout design on bond pad to improve wire bond reliability in CMOS ICs
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PDF (523 KB)
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Integrated Taguchi method and neural network analysis of physical profiling in the wirebonding process
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PDF (329 KB)
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Critique of EIA SSB-1: guidelines for using plastic encapsulated microcircuits and semiconductors in military, aerospace, and other rugged applications
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PDF (186 KB)
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Three-dimensional x-ray laminography as a tool for detection and characterization of BGA package defects
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PDF (281 KB)
Aims & Scope
IEEE Transactions on Components and Packaging Technologies publishes research and applications articles on the modeling, building blocks, technical infrastructure, and analysis underpinning electronic, photonic, MEMS and sensor packaging.
Meet Our Editors
Editor-in-Chief
Koneru Ramakrishna
Freescale Semiconductor, Inc.
